Welcome to our ficonTEC Research & Development page. We will regularly inform you about recent technical and administrative activities of the R&D group.
Externer Link zu ficonTEC R&D
ficonTEC R&D hat dies direkt geteilt
It’s a wrap! ✨ Great few days filled with inspiring conversations, new connections, and exciting insights across the industry at OFC. Thanks to everyone who stopped by, shared ideas, and made this event such a success. Also a big shoutout to the team and colleagues who made it all happen 👏 We are already looking forward to next year! #ofcconference #manufacturingmadelight #ficonTEC #ficonTEST
ficonTEC R&D hat dies direkt geteilt
We are connecting the world! This weeks OFC Conference is in full swing and bringing the team together is always a highlight! At booth #909 we’re here to discuss advanced manufacturing solutions for next generation optical interconnects, including CPO, LPO, NPO and OCS. Looking forward to meeting you today or tomorrow on the show floor! #ficonTEC #AI #Photonics #CPO #LPO #Teamwork #Innovation #ocs #manufacturingmadelight
In addition to the creation of ficonTEST, it is important to highlight the role of ficonTEC R&D at our German headquarters and ficonTEC Labs around the world. These teams will actively support ficonTEST operations and customers through proof-of-concept activities, feasibility studies, and advanced technical validation, helping accelerate the transition of new photonic technologies from development to scalable manufacturing. This global collaboration across engineering, R&D, and testing capabilities further strengthens ficonTEC’s ability to support the rapidly evolving silicon photonics ecosystem.
Announcing ficonTEST - ficonTEC’s New Business Unit Dedicated to Silicon Photonics Testing At OFC Conference, ficonTEC is proud to announce the launch of ficonTEST, a new Business Unit entirely dedicated to silicon photonics test systems. As AI, cloud computing, and high-performance computing continue to drive unprecedented demand for optical connectivity, the industry requires scalable manufacturing test architectures across the entire production chain. ficonTEST addresses this challenge. The new Business Unit focuses on advanced testing solutions for next-generation optical technologies including: ➡️ Co-Packaged Optics (CPO) ➡️Near-Packaged Optics (NPO) ➡️Linear Pluggable Optics (LPO) ➡️Optical Circuit Switching (OCS) ficonTEST leads the architectural design, integration, and delivery of photonic test systems operating at: ➡️Wafer level ➡️ Die level ➡️Device and module level Among its first major responsibilities, ficonTEST is delivering the double-sided wafer-level test solution for TSMC’s COUPE (Compact Universal Photonic Engine) wafer platform, supporting the industrialization and high-volume manufacturing of next-generation silicon photonics devices. While fully part of ficonTEC, the new Business Unit operates with a dedicated organization of designers, project managers, system engineers, and commissioning specialists focused exclusively on test platforms. This structure allows ficonTEC to accelerate development cycles, increase delivery capacity, and support the rapidly expanding silicon photonics ecosystem. We are also pleased to announce that André Lalonde has been appointed President and Head of ficonTEST. 👤 About André Lalonde He is a photonics manufacturing and test executive with 25+ years of experience scaling optical technologies from engineering development to high-volume production. His expertise spans wafer-level, chip-level, and module-level testing for VCSELs, laser diodes, silicon photonics, and high-performance optical components. He has led global manufacturing ramps and production transfers across Asia and North America, aligning engineering, operations, and supply chains to deploy high-yield, high-throughput photonics manufacturing platforms. André previously held leadership roles at Coherent (Finisar, Honeywell) and Chroma ATE, and has built strong partnerships with leading test and measurement companies including FormFactor, Yokogawa, EXFO, VIAVI, Keysight, as well as major ATE leaders such as Teradyne and Advantest. With the creation of ficonTEST, ficonTEC strengthens its commitment to enabling the next generation of AI-driven photonic manufacturing, delivering scalable testing solutions from wafer to system level. We look forward to discussing this initiative with our partners and customers at OFC. #ficonTEC #ficonTEST #SiliconPhotonics #CPO #LPO #NPO #OCS #manufacturingmadelight #AIInfrastructure #PhotonicsManufacturing #WaferLevelTest #COUPE #OFC2026
ficonTEC R&D hat dies direkt geteilt
Announcing ficonTEST - ficonTEC’s New Business Unit Dedicated to Silicon Photonics Testing At OFC Conference, ficonTEC is proud to announce the launch of ficonTEST, a new Business Unit entirely dedicated to silicon photonics test systems. As AI, cloud computing, and high-performance computing continue to drive unprecedented demand for optical connectivity, the industry requires scalable manufacturing test architectures across the entire production chain. ficonTEST addresses this challenge. The new Business Unit focuses on advanced testing solutions for next-generation optical technologies including: ➡️ Co-Packaged Optics (CPO) ➡️Near-Packaged Optics (NPO) ➡️Linear Pluggable Optics (LPO) ➡️Optical Circuit Switching (OCS) ficonTEST leads the architectural design, integration, and delivery of photonic test systems operating at: ➡️Wafer level ➡️ Die level ➡️Device and module level Among its first major responsibilities, ficonTEST is delivering the double-sided wafer-level test solution for TSMC’s COUPE (Compact Universal Photonic Engine) wafer platform, supporting the industrialization and high-volume manufacturing of next-generation silicon photonics devices. While fully part of ficonTEC, the new Business Unit operates with a dedicated organization of designers, project managers, system engineers, and commissioning specialists focused exclusively on test platforms. This structure allows ficonTEC to accelerate development cycles, increase delivery capacity, and support the rapidly expanding silicon photonics ecosystem. We are also pleased to announce that André Lalonde has been appointed President and Head of ficonTEST. 👤 About André Lalonde He is a photonics manufacturing and test executive with 25+ years of experience scaling optical technologies from engineering development to high-volume production. His expertise spans wafer-level, chip-level, and module-level testing for VCSELs, laser diodes, silicon photonics, and high-performance optical components. He has led global manufacturing ramps and production transfers across Asia and North America, aligning engineering, operations, and supply chains to deploy high-yield, high-throughput photonics manufacturing platforms. André previously held leadership roles at Coherent (Finisar, Honeywell) and Chroma ATE, and has built strong partnerships with leading test and measurement companies including FormFactor, Yokogawa, EXFO, VIAVI, Keysight, as well as major ATE leaders such as Teradyne and Advantest. With the creation of ficonTEST, ficonTEC strengthens its commitment to enabling the next generation of AI-driven photonic manufacturing, delivering scalable testing solutions from wafer to system level. We look forward to discussing this initiative with our partners and customers at OFC. #ficonTEC #ficonTEST #SiliconPhotonics #CPO #LPO #NPO #OCS #manufacturingmadelight #AIInfrastructure #PhotonicsManufacturing #WaferLevelTest #COUPE #OFC2026