Nearfield Instruments

Revealing the next decade...

Revealing the next decade...

Hyperscalers are starting to look less like software companies — and more like power utilities. In the AI era, the key question is no longer just chip yield. It’s how much 𝗲𝗻𝗲𝗿𝗴𝘆-𝗲𝗳𝗳𝗶𝗰𝗶𝗲𝗻𝘁 𝗰𝗼𝗺𝗽𝘂𝘁𝗲 𝗰𝗮𝗻 𝗯𝗲 𝗽𝗿𝗼𝗱𝘂𝗰𝗲𝗱 𝗽𝗲𝗿 𝗺𝗲𝗴𝗮𝘄𝗮𝘁𝘁, 𝗮𝘁 𝘀𝗰𝗮𝗹𝗲 𝗮𝗻𝗱 𝗼𝘃𝗲𝗿 𝘁𝗶𝗺𝗲. That shift is changing the economics of data centers — and putting semiconductor 𝗽𝗿𝗼𝗰𝗲𝘀𝘀 𝗰𝗼𝗻𝘁𝗿𝗼𝗹 at the center of AI infrastructure. In our new investor note, “𝗣𝗿𝗼𝗰𝗲𝘀𝘀 𝗖𝗼𝗻𝘁𝗿𝗼𝗹 𝗶𝘀 𝗣𝗼𝘄𝗲𝗿 𝗖𝗼𝗻𝘁𝗿𝗼𝗹,” we explore why variability is becoming the dominant constraint in AI scaling, and why process control is emerging as a new strategic asset class. Find the full note from Nearfield Instruments via https://lnkd.in/eN9c6mfA

𝗦𝗶𝗱𝗲𝘄𝗮𝗹𝗹 𝗜𝗺𝗮𝗴𝗶𝗻𝗴 𝗠𝗼𝗱𝗲 𝗶𝘀 𝗵𝗲𝗿𝗲 — 𝗯𝗿𝗶𝗻𝗴𝗶𝗻𝗴 𝗻𝗼𝗻-𝗱𝗲𝘀𝘁𝗿𝘂𝗰𝘁𝗶𝘃𝗲, 𝗶𝗻𝗹𝗶𝗻𝗲 𝟯𝗗 𝘀𝗶𝗱𝗲𝘄𝗮𝗹𝗹 𝗽𝗿𝗼𝗳𝗶𝗹𝗶𝗻𝗴 𝘁𝗼 𝗮𝗱𝘃𝗮𝗻𝗰𝗲𝗱 𝘀𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗺𝗮𝗻𝘂𝗳𝗮𝗰𝘁𝘂𝗿𝗶𝗻𝗴. As AI drives the industry toward Gate-All-Around, CFET, and 3D memory architectures, device performance is increasingly defined by vertical structures. Sidewall angle, roughness, and uniformity now determine variability, leakage, yield — and ultimately energy efficiency at scale. Today, at SPIE Advanced Lithography + Patterning 2026, Nearfield Instruments announced Sidewall Imaging Mode, enabling the full 3D profile measurement of especially dense, narrow high-aspect-ratio features directly in the production flow — delivering statistically robust 3D datasets for process control and rapid optimization. Discover how Sidewall Imaging Mode makes third-dimension process control practical for high-volume manufacturing, non-destructively and in-line here: https://lnkd.in/eA94NahN

As we step into the Year of the Horse, Nearfield Instruments wishes everyone energy, success, and inspiring new opportunities in 2026. The Horse symbolizes drive, freedom, and perseverance—qualities that encourage us to move forward with confidence, embrace change, and pursue our ambitions with renewed momentum. To all who are celebrating: may this new year bring you joy, prosperity, and meaningful connections.

Hybrid bonding represents more than an incremental step beyond microbumps — it is a fundamental shift toward ultra-dense, energy-efficient interconnects required for the next generation of AI, HPC, and mobile devices. Yet the success of hybrid bonding does not depend on bonding technology alone.   In Nearfield Instruments' latest white paper - "Metrology Challenges in Hybrid Bonding: Enabling the Next Era of 3D Integration", we examine how advanced metrology is the critical enabler for high-yield, scalable 3D integration. From surface preparation and alignment to post-bond verification, every stage demands precise, reliable measurement to ensure performance and manufacturability.   As hybrid bonding moves into high-volume production, solving these metrology challenges will be essential to unlocking its full potential — and realizing the vision of seamless, reliable 3D integration.   To learn how metrology is shaping the future of hybrid bonding, follow the link below. https://lnkd.in/eRCkvWZQ

𝐀 𝐝𝐚𝐲 𝐨𝐟 𝐬𝐭𝐫𝐚𝐭𝐞𝐠𝐲 𝐚𝐧𝐝 𝐩𝐚𝐫𝐭𝐧𝐞𝐫𝐬𝐡𝐢𝐩𝐬 🇪🇺 Yesterday, the Nearfield Instruments team visited imec in Leuven, where we were warmly welcomed by the imec executive team, Luc Van den hove, Patrick Vandenameele, Max ( Masoud ) Mirgoli, Thomas Piliszczuk, Rudi Cartuyvels and Hans Lebon. Together, we kicked off our strategic cooperation – focusing on next-generation metrology and inspection for High-NA EUV, CFET and advanced packaging. Our full Supervisory Board (Young Sohn, Russell Tham, Nard Sintenie, Max ( Masoud ) Mirgoli and Eric Meurice) was also present, as imec graciously hosted our quarterly board meeting on their premises. This underlined the strong alignment between our long-term strategy, the crucial role of partnerships in breakthrough innovation, and the continued support from our shareholders, M&G Investments, Temasek, Walden Catalyst Ventures, Innovation Industries, ING, Invest-NL, TNO, Eugene Investment & Securities and Samsung Venture Investment. An energizing start to collaborations that will help shape the future of semiconductor metrology and strengthen Europe’s technological leadership. Thank you, imec, for the warm welcome – exciting steps ahead!

𝗣𝗿𝗼𝘂𝗱 𝘁𝗼 𝗯𝗲 𝗿𝗮𝗻𝗸𝗲𝗱 𝗮𝗺𝗼𝗻𝗴 𝘁𝗵𝗲 𝗡𝗲𝘁𝗵𝗲𝗿𝗹𝗮𝗻𝗱𝘀’ 𝟱𝟬 𝗺𝗼𝘀𝘁 𝗶𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝘃𝗲 𝗰𝗼𝗺𝗽𝗮𝗻𝗶𝗲𝘀 — 𝘀𝗲𝗰𝘂𝗿𝗶𝗻𝗴 𝘁𝗵𝗲 #𝟯𝟬 𝗽𝗼𝘀𝗶𝘁𝗶𝗼𝗻 𝗶𝗻 𝘁𝗵𝗲 𝟮𝟬𝟮𝟱 𝗥&𝗗 𝗧𝗼𝗽 𝟱𝟬. Nearfield Instruments is honored to be recognized in this R&D Top 50 list, a position that highlights our momentum as the deep-tech scale-up shaping the future of semiconductor metrology & inspection. This achievement is a testament to the dedication and ingenuity of our employees. Every breakthrough we deliver in semiconductor process control stems from their expertise, creativity and relentless drive and ownership. We’re equally grateful for the trust and continued support of our shareholders Eugene Investment & Securities, ING, Innovation Industries, Invest-NL, M&G, Samsung Venture Investment, Temasek, Walden Catalyst Ventures, TNO, who enable us to keep pushing technological boundaries. We believe that the only way to be ahead is to stay ahead. And we’re committed to doing exactly that — by continuously investing in innovation, expanding our technological capabilities and contributing to the global semiconductor ecosystem. For more information, see https://tw.nl/rd-top-50/ #innovation #semiconductor #metrology #inspection #powertocompute #powertocompete