Ansys Icepak
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.
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TAITherm
Simulate the complete range of heat transfer phenomena, from convection to radiation, storage to dissipation, and steady-state to dynamic and transient environmental influences. TAITherm thermal analysis software is as easy to use as it is powerful. It solves for solar and thermal radiation, convection, and conduction, including ever-changing environments. TAITherm removes the burden of complicated thermal simulations and ensures that your design will function optimally in real-world scenarios. TAITherm is used by thousands of engineers and teams around the globe. Our customers use TAITherm for an array of applications including the latest advancements in automotive, electronics, wearables, military technology, architecture, and more. Our customers are pushing the boundaries of new technology by increasing usability, safety, and effectiveness in their industries through thermal simulations and thermal analysis.
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6SigmaET
6SigmaET is an electronics thermal modeling tool that uses advanced computational fluid dynamics (CFD) to create accurate models of electronic equipment. Designed specifically for the electronics industry, our thermal simulation software ushers in unparalleled intelligence, automation and accuracy to help you meet your requirements and overcome thermal design challenges. Since its inception in 2009, 6SigmaET has become the fastest-growing thermal simulation software in the electronics cooling market. The versatility of 6SigmaET allows you to simulate the thermal performance of electronic components: ranging from the smallest ICs to the largest, most powerful servers. Learn more about 6SigmaET's value to your industry by watching one of our videos or exploring our case studies. The complete CAD geometry of a device and PCB design can be imported into 6SigmaET for thermal analysis, reducing model creation time.
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Altair SimSolid
By performing structural analyses on fully featured CAD assemblies within minutes, SimSolid is the game-changing simulation technology for designers, engineers, and analysts. It eliminates geometry preparation and meshing: the two most time-consuming, expertise-extensive and error-prone tasks performed in a conventional structural simulation.
Multiple design scenarios can be simulated quickly under real-life conditions. Early CAD models, in any common format, can be used. SimSolid tolerance of imprecise geometry means that, unlike CAD-embedded simulation tools, there is no need to simplify complex geometries before analyzing designs.
SimSolid supports all typical connections (bolt/nut, bonded, welds, rivets, sliding) and analysis of linear static, modal, thermal properties, along with more complex coupled, nonlinear, transient dynamic effects.
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