Samsung Semiconductor

AI now powers the chips that drive AI. #SamsungSemiconductor fabs need the same intelligence to stay ahead, and #DellTechnologies provides the high‑performance compute, storage, and data‑movement infrastructure for continuous AI workloads at scale. Reliable infrastructures are the backbone of trustful AI models for digital twins and yield optimization for advanced memory such as #HBM, logic processes, and advanced packaging. “At Samsung, we are embedding AI across design, engineering, and production to move beyond automation toward intelligence. That shift requires infrastructure we can trust at scale, and our long standing work with Dell Technologies supports the reliability and predictability this transformation demands.” says Dr. Yong Ho Song, EVP, Samsung Electronics. Together we’ll move beyond rule‑based automation toward adaptive autonomy: AI agents that learn, decide, and optimize in real time across the entire semiconductor lifecycle. Read the full press release here: https://lnkd.in/gkia3J2M

On May 18, #SamsungSemiconductor will host the third #SamsungSupplierSustainabilitySummit, at our Device Solutions America office in San Jose, bringing together 27 partners from the U.S. and Europe. Stay tuned for more details and highlights from the event, where we will share challenges, experiences, and insights on building a more sustainable supply chain across the greater semiconductor ecosystem.

#AI is scaling fast, from real-time services to multimodal workloads. As systems evolve, performance is no longer defined by compute, but by how efficiently data moves across systems. With Samsung #HBM4, the I/O pin count doubles from 1,024 to 2,048, doubling the pathways for parallel data movement. This means more than performance. It enables multiple AI workloads to run simultaneously while maintaining seamless data flow across applications and models. As a result, multiple AI agents can operate in parallel from coding and image generation to search without interruption or delay. More paths. Seamless connectivity. HBM4 provides the foundation for this shift. #HighBandwidthMemory #SamsungSemiconductor

As advanced graphics technologies such as ray tracing become mainstream, demand for #GPU performance continues to grow—along with the need for greater power efficiency. ENSS™ (Exynos Neural Super Sampling) addresses this challenge with AI-powered rendering and power optimization. ☑️ At the core of #ENSS ✓ Neural Super Sampling (#NSS) — AI-based upscaling that restores high-quality visuals from lower resolutions, improving performance and efficiency ✓ Neural Frame Generation (#NFG) — AI-generated intermediate frames that enhance frame rates and motion smoothness ✨ Step into the future of mobile graphics with #Exynos https://lnkd.in/gbfnWmec

#SamsungFoundry’s 4nm FinFET: scaling built on maturity. As advanced nodes push performance boundaries, the trade-off between performance and manufacturability becomes more critical than ever. Samsung’s 4nm process addresses this challenge by combining: - Proven mass production maturity and stable yield, - Enhanced performance and power efficiency, and - Expanded design flexibility across diverse applications From #AI and HPC to #automotive and RF, 4nm serves as a reliable and scalable platform bridging leading-edge innovation and real-world deployment. A practical node, ready for real-world complexity. Learn more in our article below.

🎮 What if #AI could accelerate your mobile gaming experience? Introducing ENSS™(#Exynos Neural Super Sampling), #SamsungSemiconductor's AI-powered graphics and power optimization technology designed to elevate mobile gaming. Richer visuals. Higher frame rates. All while improving power-efficiency 🔍 Learn more on the #ENSS tech page: https://lnkd.in/gbfnWmec #OnDeviceAI #GamingPerformance #PowerEfficiency

The development of #AI-driven and virtualized infrastructures calls for strengthened #security measures to reinforce data protection and integrity across storage interfaces. The PM1763 from #SamsungSemiconductor supports Post-Quantum Cryptography (#PQC), Security Protocol and Data Model 1.4 (#SPDM), and Commercial National Security Algorithm Suite 2.0 (#CNSA), along with TEE Device Interface Security Protocol (#TDISP) encryption to protect data at each stage- whether at rest, in transit, or in use. Learn more about PM1763 here: https://lnkd.in/gwQCU-HF

Every year on #EarthDay, #SamsungSemiconductor holds a lights-off event across all domestic sites as part of its broader effort to reduce energy consumption. 🌍 This year, we are continuing this initiative, marking our eighth consecutive year of participation since 2019. ⚡ In 2025, turning off lights for just 10 minutes at seven representative buildings across our six domestic sites resulted in: - a reduction of 234 kWh in electricity consumption - a reduction of 108 kg CO₂-eq emissions This is equivalent to the annual carbon absorption of approximately 46 pine trees. Beyond one-time actions, we focus on lasting change. 💡 In 2025, sensor-based smart lighting systems were installed in parking towers at our Giheung, Hwaseong, and Pyeongtaek sites. The system helped reduce unnecessary energy use by adjusting lighting levels based on natural daylight, area, and time of day. Over the four-month period, this resulted in: - 653 MWh of energy savings - a 49% reduction compared to conventional lighting By focusing on optimizing energy use and expanding the use of renewable energy, Samsung Semiconductor is accelerating efforts to reduce indirect greenhouse gas emissions, advancing toward its net-zero goal by 2050. #Sustainability #NetZero #EnergyEfficiency #CarbonReduction

Wireless charging is evolving rapidly, and ensuring reliable interoperability across diverse charging environments is becoming increasingly important. #SamsungSemiconductor’s wireless charging Power IC, #S2MIW06, has achieved Qi v2.2.1 certification, supporting the latest wireless power standard for mobile devices. S2MIW06 supports interoperability and standards readiness: ✔ Qi v2.2.1 certified ✔ Validated with 380+ Tx pads ✔ Established a test environment for pre-verification of WPC compliance With interoperability testing, standards-based pre-verification, and official certification, Samsung Power IC solutions help enable reliable and efficient #WirelessCharging for #mobile devices powered by advanced #PowerIC technology under the latest #Qi standard. See the detailed specifications: https://lnkd.in/gtnawyMe

We are proud to share the productization of GAONCHIPS’s HPC‑focused #AI chip built on the 2.5D Cube‑S platform from #SamsungFoundry. Leveraging Samsung’s advanced packaging technologies, which integrate multiple dies on a silicon interposer, each die performs its specialized function. A horizontally arranged chip placement further improves bandwidth and mitigates thermal buildup, enabling high‑performance solutions for modern devices. New dimensions powering a new era 🌟