"Curing kinetics of a novel commercial epoxy-phenolic composite build-up ..."

Shanjun Ding et al. (2025)

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DOI: 10.1016/J.MEJO.2025.106717

access: closed

type: Journal Article

metadata version: 2025-05-31

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Shanjun Ding, Jingyi Zhao, Xiaomeng Wu, Chuan Chen, Zhidan Fang, Qidong Wang:
Curing kinetics of a novel commercial epoxy-phenolic composite build-up film for flip-chip ball grid array (FCBGA) substrates. Microelectron. J. 161: 106717 (2025)

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