


4/31
!4/31!
5/56
3/51
2/31
1/:6
1/2
22/11
26/11
MSPN09
1
REV.
DRAWN
APPROVED
1
MODIFICATION
A
REV.
SHEET
SCALE
.X°± 2°
X.°± 5°
.XX°± 1°
.XXX°± 0.5°
.XXX± 0.10
.XX± 0.20
.X± 0.30
X.± 0.40
PROJ.
UNIT
APPROVAL
CHECKED
TITLE
DRAWN
DWG NO.
2
3
456789
10 11
12
234567891011
QP-04-33-B
B
C
D
E
F
G
H
I
I
H
G
F
E
D
A
C
B
Proconn Technology Co., Ltd.
J
J
PART NO.
mm
GENERAL TOLERANCE
CUSTOMER DRAWING
PROCESS COMPLIANT
Pb
-01-D
GND
WITHOUT CARD
CARD INSERTED
(#10)
(#9)
PATENTS PENDING.
ARE COVERED BY PATENTS AND/OR
2.ALL RIGHTS RESERVED,PRODUCTS
)
TE!DBSE!DJSDVU!;
(#9
(#10)
GND
C/D
1.THIS PRODUCT DOESN'T CONTAIN
ENVIRONMENTAL HAZARDOUS
MATERIALS PER DIRECTIVE
2002/95/EC FOR RoHS.
C/D
Micro SD Normal push-push
Type Connector
4:1
D
/21
MSPN09-X0-0000
D
M
B
Dbse!Tmpu
.B.
1/96
!2/21!
2/:11/71
22/26
1/21
1/16 .1/16
,
B!!)23!;!2*
A -- CONTACT UNLEAD PLATING:
A:GOLD FLASH
C:10ȝ" GOLD
NOTES :
1. MATERIAL :
INSULATOR : HIGH TEMPERATURE THERMOPLASTIC
FLAMMABILITY RARING : UL94V-0 COLOR : BLACK
CONTACT : COPPER ALLOYS
COVER : COPPER ALLOYS
2. CONTACT AREA PLATING : GOLD OVER Ni
C/D : MICRO SD CARD CARD DETECT INDICATION
3. P/N : MSPN09- X0-0000
T
A
1/4 B C D
D EN030807 BOBޕ
:/61
:/:1
y
3
!2/21!
9/11
1
/
9
1
1/41
QSPDPOO
YYYYYYY
EBUF!DPEF
QSPDPOO!MPHP
!!!!DBSE
DFOUFS!MJOF
25/81

D EN030807 BOBޕ
1
REV.
DRAWN
APPROVED
1
MODIFICATION
A
REV.
SHEET
SCALE
.X°± 2°
X.°± 5°
.XX°± 1°
.XXX°± 0.5°
.XXX± 0.10
.XX± 0.20
.X± 0.30
X.± 0.40
PROJ.
UNIT
APPROVAL
CHECKED
TITLE
DRAWN
DWG NO.
2
3
456789
10 11
12
234567891011
QP-04-33-B
B
C
D
E
F
G
H
I
I
H
G
F
E
D
A
C
B
Proconn Technology Co., Ltd.
J
J
PART NO.
mm
GENERAL TOLERANCE
CUSTOMER DRAWING
PROCESS COMPLIANT
Pb
1.THIS PRODUCT DOESN'T CONTAIN
ENVIRONMENTAL HAZARDOUS
MATERIALS PER DIRECTIVE
2002/95/EC FOR RoHS.
2.ALL RIGHTS RESERVED,PRODUCTS
ARE COVERED BY PATENTS AND/OR
PATENTS PENDING.
MSPN09-01-D
Micro SD Normal push-push
Type Connector
D
2/2
5:1
MSPN09-X0-0000
$:!$9!$8!$7!$6!$5!$4!$3!$2
$21
$21
$21
SFDPNNBOE!Q/D/C/!MBZPVU
;QSPIJCJUJPO!BSFB
1/3 B
.B.
DBSE!DFOUFS!MJOF
1/81
!4/31!
!2/21!
1/811
9/111
9/211
6/26
y37/311
2/711
2/311
:/11
)
I
P
M
F
*
²
1
/
1
6
Y3
7/3112/311
2/711
:/811
1/51
:/:1
5/21
3/11
2
/
1
1
3/311
6/:6
QJO!OP/ OBNF
$12 EBU3
$13 DE0EBU4
$14 DNE
$15 WEE
$16 DML
$17 WTT
$18 EBU1
$19 EBU2
$1: D0E
$21 HOE

1/66
1/:1
7/68
1/61
1/91
5/41
2/56
1/56
1/:1
1/71
$2
$3
$4
$5
$6
$7 $8 $9
$:
$22
$22
$21
1/91
1/91
2/96
MSPN09-X0-1000
Micro SD CONNECTOR PUSH TYPE
1 / 3
G
REV.
SCALE
PROJ.
DWG NO.
NONE
REV.
SHEET
SCALE
PROJ.
UNIT
APPROVAL
CHECKED
DWG NO.
Proconn Technology Co., Ltd.
mm
PROCESS COMPLIANT
Pb
1.THIS PRODUCT DOESN'T CONTAIN
ENVIRONMENTAL HAZARDOUS
MATERIALS PER DIRECTIVE
2002/95/EC FOR RoHS.
2.ALL RIGHTS RESERVED,PRODUCTS
ARE COVERED BY PATENTS AND/OR
PATENTS PENDING.
NOTES :
1. MATERIAL :
INSULATOR : HIGH TEMPERATURE THERMOPLASTIC
FLAMMABILITY RARING : UL94V-0 COLOR : BLACK
CONTACT : COPPER ALLOYS
COVER : STAINLESS STEEL
2. CONTACT AREA PLATING : GOLD OVER Ni
3. P/N : MSPN09-X0-1000
NONE
1
REV.
DRAWN
APPROVED
1
MODIFICATION
A
REV.
SHEET
SCALE
.X°± 2°
X.°± 5°
.XX°± 1°
.XXX°± 0.5°
.XXX± 0.10
.XX± 0.20
.X± 0.30
X.± 0.40
PROJ.
UNIT
APPROVAL
CHECKED
TITLE
DRAWN
DWG NO.
2
3
456789
10 11
12
234567891011
QP-04-33-B
B
C
D
E
F
G
H
I
I
H
G
F
E
D
A
C
B
Proconn Technology Co., Ltd.
J
J
PART NO.
mm
GENERAL TOLERANCE
CUSTOMER DRAWING
PROCESS COMPLIANT
Pb
1.THIS PRODUCT DOESN'T CONTAIN
ENVIRONMENTAL HAZARDOUS
MATERIALS PER DIRECTIVE
2002/95/EC FOR RoHS.
2.ALL RIGHTS RESERVED,PRODUCTS
ARE COVERED BY PATENTS AND/OR
PATENTS PENDING.
.X°± 2°
X.°± 5°
GENERAL TOLERANCE
MSPN09-02-G
UNLEAD PLATING:
A:GOLD FLASH
C:10u"GOLD
D:15u"GOLD
F EN071707 LEOᑗ࢘
25/38
1/21
1/:1
3/76
26/23
)QJUDI*
8/81
25/31
2/21
*!Qvti!Tusplf)
1/51!UZQ/
MPHP'
EBUF!DPEF
DPOOFDUPS
DFOUFS!MJOF
DBSE!DFOUFS!MJOF
YYYYYYY
YYYYYYY
*Fkfdups!Qptjujpo
1/89
27/:6
)2/71*!Dbse!Mpdl!Qptjujpo
)6/51
2/11
PIN NO. NAME
#01 DAT2
#02 CD/DAT3
#03 CMD
#04 VDD
#05 CLK
#06 V
SS
2
#07 DAT0
#08 DAT1
#09 CARD DETECT Switch
#10 CARD DETECT Com.
#11 GND