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SAE AS6171-6-2016技术标准文件主要关注的是在航空领域内对于可疑或假冒电子电气部件（EEE Parts）的检测技术。这份标准文档提供了使用声学显微镜（Acoustic Microscopy，简称AM）技术进行非破坏性检测的指导和要求。这包括了声学显微镜测试程序的使用，测试实验室（Test Lab）应遵循的检测顺序，以及如何根据与测试实验室合作的用户组织所确定的风险水平来导出检测级别。用户组织需要在标准所规定的SC（可疑假冒）部件检测流程中考虑风险水平，然后由测试实验室负责按照既定的检验序列进行AM测试。 SAE技术标准委员会的规则指出，SAE发布的报告旨在推进技术和工程科学的状态，这份报告的使用完全是自愿性的。任何特定用途的适用性及适宜性，包括由此产生的任何专利侵权问题，均完全由用户负责。SAE每五年至少对每个技术报告进行一次审查，在此期间可能会进行修订、重申、稳定或取消。SAE欢迎读者提供书面评论和建议。此外，该文档的任何部分都不得以电子、机械、复印、录音或任何其他方式复制、存储或传输，未经SAE事先书面许可。文档提供了一个联系方式用于文档订购，并鼓励对技术报告进行反馈，提供了SAE的网址以及如何在SAE网站上找到反馈链接。SAE组织珍视公众的反馈，并鼓励公众在SAE标准网站上提供对AS6171/6技术报告的评价和建议。 SAE AS6171-6-2016是一份专门针对航空航天领域中电子电气部件检测的技术标准文件，它重点介绍了利用声学显微镜检测技术来发现并防止使用可疑或假冒零件的重要性和方法。这份文件不仅是技术检测的指南，也是确保航空航天产品可靠性和安全性的关键依据。同时，SAE组织通过定期审查和更新技术报告，确保其内容始终反映最新的行业实践和技术进步。

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SAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is

entirely voluntary, and its applicability and suitability for any particular use, including any patent infringement arising therefrom, is the sole responsibility of the user.”

SAE reviews each technical report at least every five years at which time it may be revised, reaffirmed, stabilized, or cancelled. SAE invites your written comments and

suggestions.

photocopying, recording, or otherwise, without the prior written permission of SAE.

TO PLACE A DOCUMENT ORDER: Tel: 877-606-7323 (inside USA and Canada)

Tel: +1 724-776-4970 (outside USA)

Fax: 724-776-0790

Email: CustomerService@sae.org

SAE WEB ADDRESS: http://www.sae.org

SAE values your input. To provide feedback on this

Technical Report, please visit

http://standards.sae.org/AS6171/6

AEROSPACE

STANDARD

AS6171™/6

Issued 2016-10

Techniques for Suspect/Counterfeit EEE Parts Detection

by Acoustic Microscopy (AM) Test Methods

RATIONALE

This document provides guidance and requirements on the Acoustic Microscopy (AM) test procedures to be employed by

the Test Laboratory (Lab) for the non-destructive AM testing of parts for suspect counterfeit (SC) part detection. The level

of testing shall be derived by the User Organization working in conjunction with the Test Lab, taking into consideration the

risk level as defined in the SC part detection flow specified herein. It shall be the responsibility of the Test Lab to conduct

the AM test following the sequence of inspections for a given risk level specified herein. The creation of this document is a

step in addressing the ever-increasing global problem of electronic parts counterfeiting.

INTRODUCTION

Because many methods of counterfeiting of electronics involve a change of material from the original part, AM can provide

a method of inspection of parts and detecting differences in their material composition. The method has been used

extensively to detect non-conforming parts in electronics and in many other product areas. The implementation of

Restriction of Hazardous Substances (RoHS) requirements of the European Union and similar laws in other countries,

resulted in wide spread use of AM techniques to confirm that electronic parts are not damaged while subjected to a

surface mount to a PCB process. This document provides techniques based on those practices to detect Suspect

counterfeit parts.

The part photographs contained herein are provided to illustrate the application of detection methods identified in the

document, and are by no means intended to imply that a manufacturer identified in a photograph is involved with the

suspect product.

TABLE OF CONTENTS

1. SCOPE ......................................................................................................................................................... 3

1.1 Purpose ........................................................................................................................................................ 3

2. REFERENCES ............................................................................................................................................. 3

2.1 Applicable Documents ................................................................................................................................. 3

2.1.1 SAE Publications .......................................................................................................................................... 3

2.2 Related Publications .................................................................................................................................... 3

2.3 Terms and Definitions .................................................................................................................................. 4

2.4 Acronyms ..................................................................................................................................................... 4

3. DESCRIPTION OF METHODOLOGY/PROCEDURE ................................................................................. 4

3.1 Material Control/ESD Handling .................................................................................................................... 4

3.2 Additional Considerations ............................................................................................................................ 4

3.2.1 Microfocus Radiology versus AM ................................................................................................................. 4

3.2.2 Infrared versus AM ....................................................................................................................................... 4

3.3 General Considerations ............................................................................................................................... 4

3.3.1 How AM Works ............................................................................................................................................ 4

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SAE INTERNATIONAL AS6171™/6 Page 2 of 29

3.4 AM Procedure for PEMS and BGAs ............................................................................................................ 7

3.4.1 General Considerations ............................................................................................................................... 7

3.4.2 Exterior AM Inspection (Near Surface AM Imaging) .................................................................................... 7

3.4.3 Interior AM Inspections ................................................................................................................................ 9

3.4.4 Percentage Delamination Calculations (Figure 3) ..................................................................................... 10

4. TEST EQUIPMENT AND CALIBRATION .................................................................................................. 11

4.1 Controls and Calibration ............................................................................................................................. 11

5. REQUIREMENT ......................................................................................................................................... 11

5.1 Sampling .................................................................................................................................................... 11

5.2 Categories of Testing/Risk Levels ............................................................................................................. 11

5.3 Testing Requirements and Minimum Risk Level ....................................................................................... 11

5.4 Counterfeit Detection Test Sequence ........................................................................................................ 11

5.5 Test Plan .................................................................................................................................................... 12

5.6 Analysis and Interpretation of Results ....................................................................................................... 12

5.7 Test Report ................................................................................................................................................ 12

5.8 Certification and Training ........................................................................................................................... 13

5.8.1 Personnel ................................................................................................................................................... 13

5.8.2 Laboratory/Test Facility .............................................................................................................................. 15

5.8.3 Proficiency .................................................................................................................................................. 15

5.9 Data Retention Requirements .................................................................................................................... 16

5.9.1 Report Retention ........................................................................................................................................ 16

6. NOTES ....................................................................................................................................................... 16

6.1 Revision Indicator ....................................................................................................................................... 16

APPENDIX A ACOUSTIC MICROSCOPY IMAGES ........................................................................................................ 17

IGURE 1 DIAGRAM OF REFLECTIVE MODE ACOUSTIC MICROSCOPY .............................................................. 5

FIGURE 2 DIAGRAM OF TRANSMISSION MODE ACOUSTIC MICROSCOPY ........................................................ 5

FIGURE 3 EXAMPLE OF PERCENTAGE DELAMINATION CALCULATIONS ......................................................... 10

TABLE 1 AM TEST REQUIREMENTS BASED ON RISK LEVEL ............................................................................ 11

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SAE INTERNATIONAL AS6171™/6 Page 3 of 29

1. SCOPE

Through the use of ultra-high frequency ultrasound, typically above 10 MHz, Acoustic Microscopy (AM) non-destructively

finds and characterizes physical features and latent defects (visualization of interior features in a layer by layer process) -

such as material continuity and discontinuities, sub-surface flaws, cracks, voids, delaminations and porosity. AM observed

features and defects can be indicators that the components were improperly handled, stored, altered or previously used.

If AS6171/6 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

1.1 Purpose

The purpose of this document is to provide recommended techniques and guidelines for the use of Acoustic Microscopy

for detection of counterfeit electronic components.

2. REFERENCES

2.1 Applicable Documents

The following publications form a part of this document to the extent specified herein. The latest issue of SAE publications

shall apply. The applicable issue of other publications shall be the issue in effect on the date of the purchase order. In the

event of conflict between the text of this document and references cited herein, the text of this document takes

precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption

has been obtained.

2.1.1 SAE Publications

Available from SAE International, 400 Commonwealth Drive, Warrendale, PA 15096-0001, Tel: 877-606-7323 (inside USA

and Canada) or +1 724-776-4970 (outside USA), www.sae.org

AS6171 Test Methods Standard; General Requirements, Suspect/Counterfeit, Electrical, Electronic, and

Electromechanical Parts

2.2 Related Publications

The following publications are provided for information purposes only and are not a required part of this SAE Aerospace

Technical Report.

MIL-STD-883, Method 2030 Ultrasonic Inspection of Die Attach

NASA PEM-INST-001 Instructions for Plastic Encapsulated Microcircuit (PEM) Selection, Screening, and

Qualification

J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount

Devices

J-STD-035 Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components

MIL-STD-1580 Destructive Physical Analysis for Electronic, Electromagnetic, and Electromechanical

Parts

ESA/SCC No. 25200 Application of Scanning Acoustic Microscopy to Plastic Encapsulated Devices

GEIA-STD-006 Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts

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SAE INTERNATIONAL AS6171™/6 Page 4 of 29

2.3 Terms and Definitions

See section 2.2 of AS6171 General Requirements.

2.4 Acronyms

See section 2.3 of AS6171 General Requirements.

3. DESCRIPTION OF METHODOLOGY/PROCEDURE

3.1 Material Control/ESD Handling

3.1.1 Parts subjected to handling during AM testing can be damaged by ESD. Therefore, the ESD control requirements

of section 3.9.5 of AS6171 General Requirements shall be followed.

3.2 Additional Considerations

3.2.1 Microfocus Radiology versus AM

AM and microfocus radiology are complementary techniques that are frequently found in the same laboratories and they

can reveal different features. Radiology relies on differential attenuation of the X-ray energy. AM relies on material

change. The practical result is that AM is orders of magnitude more sensitive for detecting air space type defects such as

voids, delaminations and cracks.

3.2.2 Infrared versus AM

Infrared is an inspection technique that is based on how the infrared energy transmits through a material. Since air space

type defects do not transmit the infrared energy as well as continuous material, this technique is sometimes used to

inspect for voids and delaminations. Although this technique can produce a picture very quickly, it is highly limited by the

materials under inspection and the details achievable. AM on the other hand, takes a little longer to generate an image but

the practical result is that the images are of much higher detail. Plus, AM is not limited by the materials under inspection.

3.3 General Considerations

3.3.1 How AM Works

3.3.1.1 Reflection Mode (Figure 1) - As per J-STD-035

Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components, AM has the ability to create images by

generating a pulse of ultrasound, which is focused to a pinpoint spot. The pulse is directed into a sample and reflected at

interfaces. The frequency of the pulses and design of the lens are chosen to optimize spot size (resolution) and depth

penetration for each application. In the reflection mode of operation, the same transducer is used to send and receive the

ultrasonic pulse. Return echoes arrive at different times based upon the depth of the reflecting feature and the velocity of

sound in the materials. The operator positions an electronic gate to capture the depth of interest. The amount of

ultrasound reflected at the interface is based on differences in the acoustic impedances of the materials at the interface.

Greater differences in the acoustic impedances of the materials at the interface produce higher amplitudes of reflected

ultrasound. The order of the acoustic impedances, going from one material to the other, will change the polarity/phase of

the reflected ultrasound, too. In general, going from a lower to higher acoustic impedance will have a stronger positive

reflection and going from a higher to lower will have a stronger negative reflection. In addition, changes in the reflected

signal can provide evidence of changes in material properties. This data is often the key to determining variations in

materials used and manufacturing processes.

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