10105965B00_10106052_POWERPACK2 BOARD (DUAL BATTERY).pdf

3. Bypass capacitors shall be distributed evenly amongst power

pins of the IC power and GND pin.

4. Always observe layout guidelines and documentation from the component

manufacturers, beside the indications and comments marked on schematics.

TABLE OF CONTENTS

6. RL1, FL1, J9 & J11 conn - Through hole components, place on Top right side of the PCB

7. J12 conn - SMD component, place on Bottom left side of the PCB

8. Power tracks - marked with thick line on schematic, should be able to withstand minimum 3.3A continuous current route as wide as possible, minimum of 0.6mm.