恒玄BES2300-IU：超低功耗蓝牙5.0音频平台专为TWS耳机设计

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BES-BES2300-IU.pdf 文件是一份恒玄科技公司的蓝牙5.0超低功耗音频平台规格说明书，针对的是TWS（True Wireless Stereo，真无线立体声）耳机应用。这份文档详细阐述了BES2300-IU芯片的主要特性和功能。首先，BES2300-IU是一款专为无线音频设备设计的产品，支持蓝牙5.0标准，这确保了高速、稳定且低延迟的无线连接，对于现代TWS耳机而言，这是至关重要的，因为用户对音质和连接稳定性有着极高的要求。蓝牙5.0相较于之前的版本，提升了数据传输速度、范围和抗干扰能力。其中，IBRT（BES Intelligent Bluetooth Retransmission Tech.，BES智能蓝牙重传技术）是该平台的一大亮点。这项技术旨在通过智能化的错误检测和纠错机制，减少无线通信过程中的数据丢失，提高音频传输的可靠性和完整性。这对于TWS耳机的流畅使用体验至关重要，尤其是在复杂的无线环境中，如多设备连接和建筑物内部的信号遮挡。恒玄（Bestechnic, Shanghai）作为一家专注于音频解决方案的公司，其总部位于中国上海浦东新区。该产品规格说明书还包含了联系信息，如电话和传真号码，以及版权声明。恒玄强调未经许可不得复制或传播本文件的任何部分，并保留随时更新文档的权利，同时明确表示不对其内容提供任何形式的担保，包括适销性或特定用途的适用性。在产品规格方面，Rev0.14 版本可能包含了芯片的详细硬件和软件特性、电源管理、音频编解码支持、接口规范、功耗分析以及可能的兼容性指南。此外，可能还涉及了软件升级路径、驱动程序安装说明以及与其它蓝牙设备的配对指南等实用信息。 BES2300-IU.pdf文件是工程师、产品经理和技术人员研究恒玄公司TWS耳机解决方案的重要参考资料，提供了实现高效、稳定的无线音频传输所需的关键技术参数和设计指导。

BES2300-IU Product Specification

Rev 0.14 Page5 / 23 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd

List of Tables

Table 4-1 Operating Conditions

(a)

.............................................................................................................................. 11

Table 4-2 Absolute Maximum Ratings

(c)

..................................................................................................................... 11

Table 4-3 Power Consumption

(a)

................................................................................................................................ 11

Table 4-4 Receiver Characteristics - Basic Data Rate

(a)

.............................................................................................. 11

Table 4-5 Transmitter Characteristics - Basic Data Rate

(a)

......................................................................................... 12

Table 4-6 Receiver Characteristics - Enhanced Data Rate

(a)

....................................................................................... 12

Table 4-7 Transmitter Characteristics - Enhanced Data Rate

(a)

.................................................................................. 13

Table 4-8 Digital to Analogue Converter under 1.95V

(b)

............................................................................................ 14

Table 5-1 BES2300-IU 40-Pin Description ................................................................................................................... 16

Table 7-1 Package Peak Reflow Temperature - Sn/Pb ................................................................................................ 19

Table 7-2 Package peak reflow temperature - Pb-Free

(a)

........................................................................................... 19

List of Figures

Figure 1-1 BES2300-IU Top View................................................................................................................................... 6

Figure 2-1 Platform Architecture .................................................................................................................................. 8

Figure 5-1 BES2300-IU 40-pin ..................................................................................................................................... 16

Figure 6-1 BES2300-IU 40-pin location ....................................................................................................................... 18

Figure 7-1 Solder Reflow Profile ................................................................................................................................. 19

Figure 9-1 Tape Orientation ........................................................................................................................................ 22

Figure 9-2 Reel Dimensions

(a)(b)

.................................................................................................................................. 22

Figure 9-3 Tape Dimensions

(a)

.................................................................................................................................... 23