GlobalFoundries joins imec's Automotive Chiplet Program

GlobalFoundries, the first foundry partner of imec for its Automotive Chiplet Program, is leading new batch of companies who would join the program to accelerate chiplet adoption in the automotive industry. #imec #globalfoundries #automotive #chiplet https://lnkd.in/d_-jXXZD

imec has announced that GlobalFoundries has joined its Automotive Chiplet Program (ACP) as a foundry partner. Read more here: https://lnkd.in/eKKuEQdG #Imec #AutomotiveChiplets #GlobalFoundries

First foundry and suppliers sign imec’s ACP program to accelerate chiplet adoption in the automotive industry : https://lnkd.in/eRXyhUhW imec has announced that GlobalFoundries has joined its Automotive Chiplet Program (ACP) as a foundry partner. Semiconductor and system companies Infineon Technologies, SILICON BOX, STATS ChipPAC, and TIER IV, the Japanese autonomous driving technology developer, have also committed to join ACP, expanding imec’s network and further accelerating the development and adoption of cutting-edge chiplet architecture that’s tailored to the demands of the automotive industry. With vehicles evolving into high-performance, software-defined platforms, traditional monolithic chip designs are increasingly challenged as they look to meet the demands of advanced driver assistance systems (ADAS), autonomous driving and immersive in-vehicle infotainment. Source: (New Electronics) #semiconductor #manufacturing #technology #innovation #chips  #semiconductormanufacturing #advancedtechnology #engineering #lithography #nanometer #research #development #AI #EUV #DUV #mobileprocessors #VLSI

Tata Technologies has partnered with Synopsys Inc to advance the development of Software-Defined Vehicles (SDVs). This collaboration combines Tata Technologies' expertise in vehicle engineering with Synopsys' virtualization solutions to enable the deployment of electronics digital twins (eDTs). These eDTs facilitate early verification and validation of electronic systems, streamlining the development process for next-generation vehicles. #SoftwareDefinedVehicles #AutomotiveInnovation #DigitalTwins #FutureOfMobility #electronicsnews #technologynews https://lnkd.in/gwATaV8M

Automaker Mercedes-Benz announced it will spin off its chip design team into a separate entity to create Athos Silicon. Fidelis Companies https://lnkd.in/enCTDZdQ

"Imec has gained another partner for its Automotive Chiplet Program (ACP) with Globalfoundries. Infineon, Silicon Box, STATS ChipPAC, and TIER IV have also joined the program, which focuses on developing scalable, chiplet-based architectures for future vehicle platforms." #semiconductorindustry #automotiveindustry #imec #acp https://lnkd.in/eYwdYxkq

ChipSync and Cortus have teamed up to revolutionize the Indian automotive landscape with tailored RISC-V semiconductor solutions. This strategic partnership combines ChipSync’s expertise in connected car technologies with Cortus’ cutting-edge RISC-V automotive chips and AI inference chiplets. Together, they are driving the future of software-defined vehicles (SDVs) by delivering scalable, high-performance platforms designed to meet the rapidly evolving demands of India’s automotive market. As India aims to become a global automotive innovation hub, this collaboration accelerates the adoption of AI-powered safety features, energy-efficient designs, and faster development cycles, shaping the next generation of intelligent, connected vehicles. Read More: https://lnkd.in/gikKEuq4 ChipSync Technologies Pvt Ltd Cortus SAS Hariprasad KB Michael Chapman #ChipSync #Cortus #RISCV #AutomotiveSemiconductors #ConnectedCar #SoftwareDefinedVehicles #AIChips #TechPartnership

ChipSync and Cortus have announced a strategic collaboration to co-develop next-generation electronic solutions for the Indian automotive and consumer markets. The partnership aims to redefine the future of automotive and software-defined vehicle (SDV) technologies by integrating Cortus’ advanced RISC-V automotive chips and AI chiplets for computer vision with ChipSync’s connected car software expertise. Hariprasad KB ChipSync Technologies Pvt Ltd Michael Chapman #ChipSync #Cortus #RISC_V #ConnectedCars #Semiconductors #AutomotiveTechnology #SoftwareDefinedVehicles #SmartMobility #Innovation #IndiaAutomotive #Partnership #ChipletTechnology Read More- https://lnkd.in/d885UEwj

👏 "Today, imec announced that GlobalFoundries (Nasdaq: GFS) (GF) has joined imec’s Automotive Chiplet Program (ACP) as a foundry partner. Semiconductor and system companies Infineon, Silicon Box, STATS ChipPAC, and Japanese autonomous driving technology developer TIER IV have also committed to join ACP, expanding imec’s network and further accelerating the development and adoption of a cutting-edge chiplet architecture tailored to the unique demands of the automotive industry." #automotiveindustry #semiconductorindustry #chiplet #imec #acp https://lnkd.in/etBhAwau

STATS ChipPAC is proud to announce our participation in imec’s Automotive Chiplet Program (ACP) Consortium, together with leading partners. This collaborative initiative is dedicated to advancing chiplet-based architectures that address the demanding requirements of next-generation automotive applications. As our VP & GM of Automotive BU, Mr. Gang Jung, shared: “Joining the ACP Consortium marks a significant milestone for STATS ChipPAC, as we strengthen our commitment to innovation in autonomous driving. Together with our partners, we aim to drive technological breakthroughs that will benefit the entire industry and our customers.” Through this consortium, we will contribute to joint R&D, standardization, and sustainable technology initiatives — fostering innovation, knowledge exchange, and new opportunities for the future of mobility. #Automotive #Chiplet #AdvancedPackaging #Innovation #Collaboration