STATS ChipPAC joins imec's ACP Consortium for automotive innovation

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STATS ChipPAC is proud to announce our participation in imec’s Automotive Chiplet Program (ACP) Consortium, together with leading partners. This collaborative initiative is dedicated to advancing chiplet-based architectures that address the demanding requirements of next-generation automotive applications. As our VP & GM of Automotive BU, Mr. Gang Jung, shared: “Joining the ACP Consortium marks a significant milestone for STATS ChipPAC, as we strengthen our commitment to innovation in autonomous driving. Together with our partners, we aim to drive technological breakthroughs that will benefit the entire industry and our customers.” Through this consortium, we will contribute to joint R&D, standardization, and sustainable technology initiatives — fostering innovation, knowledge exchange, and new opportunities for the future of mobility. #Automotive #Chiplet #AdvancedPackaging #Innovation #Collaboration

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Utthaman Mahendran

Semiconductor Tools | Global Eqp Serv Management | Marketing | Sales | CRM | Business Dev | SW | Wire/Die-bond | Inspection | Dicing | Testing | SECS/GEM | Host-Com | Factory Automation | EMBA SPJ SG | umahen@gmail.com

2w

Congratulations to STATS ChipPAC and all partners involved! 👏

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