Product Specification

Revision V1.0

Date 2019-12-12

Model Name BL-M8822CS1-S

Product Name 802.11a/b/g/n/ac 2T2R WiFi + Bluetooth5.0 SDIO Module

Bilian Approve Field

Engineer QC Sales

Customer Approve Field

Engineer QC Manufactory Purchasing

Shenzhen Bilian Electronic Co., Ltd

Address: 10-11F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen.Guangdong, China
Homepage: www.b-link.net.cn
 Table of Contents

Revision History ......................................................................................... 1

1. Introduction ............................................................................................ 1
1.1 General Description ........................................................................................... 1
1.2 Features ............................................................................................................. 1
1.3 Applications ........................................................................................................ 2
2. Functional Block Diagram ...................................................................... 2
3. Product Technical Specifications ............................................................ 2
3.1 General Specifications ....................................................................................... 2
3.2 DC Power Consumption ..................................................................................... 3
3.3 WiFi RF Specification ......................................................................................... 5
3.4 Bluetooth RF Specification ................................................................................. 7
4. Pin Assignments..................................................................................... 8
5. Typical Application Circuit .................................................................... 12
6. Mechanical Specifications .................................................................... 13
7. Others .................................................................................................. 13
7.1 Package Information .........................................................................................13
7.2 Storage Temperature and Humidity ...................................................................13
7.3 Recommended Reflow Profile ...........................................................................14

0
Revision History

Document Product
Date Description
Revision Revision

2019/12/13 1.0 V1.0 Preliminary release

1. Introduction

1.1 General Description

BL-M8822CS1-S is a highly integrated dual-band WiFi + bluetooth5.0 2T2R SDIO3.0 module designed base
on Realtek RTL8822CS-VS-CG chipset. This module supports 802.11n MIMO on dual band 2.4GHz or 5GHz
operating and 802.11ac wave-2 MU-MIMO, backward compatible with IEEE 802.11a/b/g/n/ac standard and
provides the maximum PHY data rate up to 867Mbps. The host interface complies with SDIO 1.1/2.0/3.0 for
WLAN with clock rate up to 208MHz and HS-UART interface for BT. It includes Bluetooth V2.1/3.0/4.1/4.2
and supports Bluetooth 5.0 system. BL-M8822CS1-S offers feature-rich wireless connectivity and reliable
throughput from an extended distance at different kinds of work environment.

Figure 1-Top View Figure 2-Bottom View

Note: The above pictures are for reference only

1.2 Features
⚫ Operating Frequencies: 2.4~2.4835GHz or 5.15~5.85GHz
⚫ Host Interface is SDIO (SDIO 1.1/2.0/3.0) and UART for BT
⚫ IEEE Standards: IEEE 802.11a/b/g/n/ac
⚫ Wireless data rate can reach up to 867Mbps
⚫ Connect to external antenna through the half hole
⚫ Power Supply: VDD33 3.3V±0.2V, main power supply; VDIO 3.3±0.2V or 1.8±0.18V, the SDIO,
UART and PCM signal level range from 1.8V~3.3V.
1.3 Applications
⚫ MID/DVB/ STB / DV/ IP Camera/ IP TV/ E-book
⚫ Tablet/ Notebook/ Advertising machine/ OTT Box
⚫ VR/AR terminal/ Wireless storage/ Printer/ POS machine
⚫ Mini Driving Recorder/ Doorbell / Intelligent Projector Pico
⚫ Vehicle mounted front/ Rear Terminal UAV/ Robot/ Intelligent Gateway/ Smart city
⚫ Other devices which need to be supported by wireless network

2. Functional Block Diagram

Figure 3-BL-M8822CS1-S

3. Product Technical Specifications

3.1 General Specifications

Item Description
Product Name BL-M8822CS1-S
Main Chip RTL8822CS-VS-CG
Host Interface SDIO for WLAN; UART for Bluetooth
IEEE Standards IEEE 802.11a/b/g/n/ac
Operating Frequencies 2.4~2.4835GHz, 5.15~5.85 GHz
WiFi :
802.11b DSSS: CCK, DQPSK, DBPSK
Modulation
802.11g OFDM: 64-QAM,16-QAM, QPSK, BPSK
802.11n OFDM: 64-QAM,16-QAM, QPSK, BPSK
 802.11ac OFDM: 256-QAM, 64-QAM,16-QAM, QPSK, BPSK
BT:
FHSS: GFSK, π/4-DQPSK, 8PSK
Working Mode Infrastructure, Ad-Hoc
WiFi:
802.11b: 1,2,5.5,11Mbps,
802.11a: 6,9,12,18,24,36,48,54Mbps,
802.11g: 6,9,12,18,24,36,48,54Mbps,
802.11n-2.4/5G HT20: MCS0~7, reach up to 144.4Mbps,
Wireless Data Rate
802.11n-2.4/5G HT40: MCS0~7, reach up to 300Mbps,
802.11ac-VHT20: MCS0~8, VHT40、80:MCS0~9, reach up to 867Mbps,
BT:
1Mbps for BDR、BLE,
2、3Mbps for EDR
Rx Sensitivity -95dBm (Min)
TX Power 20.5dBm (Max)
Antenna Type Connect to the external antenna through half hole
Dimension(L*W*H) 15.1*13.1*2.4mm (LxWxH) Tolerance: +/-0.15mm
Clock Source 40MHz
Working Temperature -10℃ to +70℃
Storage Temperature -40℃ to +85℃

3.2 WiFi DC Power Consumption

VDD33=VDIO=3.3V，Ta = 25 °C，unit: mA

Supply current Typ Max

RX sense mode(No Link) 172 202

802.11b 1Mbps 11Mbps

Supply current Typ. Max. Typ. Max.
Continuous TX mode 395 436 347 440
RX mode 178 204 177 206
802.11g 6Mbps 54Mbps
Supply current Typ. Max. Typ. Max.
Continuous TX mode 455 620 311 652
RX mode 183 216 183 220
802.11n HT20 MCS0 MCS7
Supply current Typ. Max. Typ. Max.
Continuous TX mode 379 512 264 504
RX mode 182 216 183 216
802.11n HT20 MCS 8 MCS15
Supply current Typ. Max. Typ. Max.
Continuous TX mode 398 536 265 544
RX mode 177 208 175 212
802.11n HT40 MCS0 MCS7
Supply current Typ. Max. Typ. Max.
Continuous TX mode 317 432 231 428
RX mode 191 220 190 224
802.11n HT40 MCS 8 MCS15
Supply current Typ. Max. Typ. Max.
Continuous TX mode 357 544 246 544
RX mode 184 216 185 216
802.11a 6Mbps 54Mbps
Supply current Typ. Max. Typ. Max.
Continuous TX mode 412 512 279 528
RX mode 176 209 174 212
802.11n HT20(5G) MCS0 MCS7
Supply current Typ. Max. Typ. Max.
Continuous TX mode 398 492 273 504
RX mode 167 196 166 192
802.11n HT20(5G) MCS8 MCS15
Supply current Typ. Max. Typ. Max.
Continuous TX mode 513 704 319 712
RX mode 167 196 167 200
802.11n HT40(5G) MCS0 MCS7
Supply current Typ. Max. Typ. Max.
Continuous TX mode 369 504 252 504
RX mode 176 207 175 208
802.11n HT40(5G) MCS8 MCS15
Supply current Typ. Max. Typ. Max.
Continuous TX mode 448 716 293 720
RX mode 175 204 176 204
802.11acVHT80(5G) MCS0 MCS9
Supply current Typ. Max. Typ. Max.
Continuous TX mode 392 840 309 816
RX mode 184 212 185 212
3.3 WiFi RF Specification
WiFi-2.4G:
19.0±1.5dBm&<-18dB@11b-11Mbps
18.0±1.5dBm&<-28dB@11g-54Mbps
17.0±1.5dBm&<-28dB@11n-HT20/40-MCS7
TX Power & EVM
WiFi-5G:
17.0±2dBm&<-28dB@11a-54Mbps
16.0±2dBm&<-28dB@11n-HT20/40-MCS7
14.5±2dBm&<-32dB@11ac-VHT80-MCS9
WiFi-2.4G:
11b-1Mbps: -94dBm@PER<8%;
11b-11Mbps: -86dBm@PER<8%;
11g-54Mbps: -75dBm@PER<10%;
11n-HT20-MCS7: -70dBm@PER<10%;
Receiver Minimum Input Sensitivity@PER 11n-HT40-MCS7: -68dBm@PER<10%;
WiFi-5G:
11a-54Mbps: -75dBm@PER<10%;
11n-HT20-MCS7: -68dBm@PER<10%;
11n-HT40-MCS7: -70dBm@PER<10%;
11ac-VHT80-MCS9: -59dBm@PER<10%;

RF Test Report
PathA
2.4G
Power(dBm) EVM(dB) Sensitivity(dBm)
Mode Rate(Mbps)
CH1 CH7 CH13 CH1 CH7 CH13 CH1 CH7 CH13
1 19 19 19 -33 -33 -34 -97 -97 -97
11b
11 18 18 18 -33 -33 -33 -89 -89 -89
6 19 19 19 -31 -31 -31 -92 -92 -92
11g
54 18 18 18 -32 -32 -32 -76 -76 -76
Power(dBm) EVM(dB) Sensitivity(dBm)
Mode Rate(Mbps)
CH3 CH7 CH11 CH3 CH7 CH11 CH3 CH7 CH11
11n MCS0 19 19 19 -33 -33 -33 -90 -89 -89
HT40 MCS7 17 17 17 -34 -34 -34 -69 -69 -69
PathB
Power(dBm) EVM(dB) Sensitivity(dBm)
Mode Rate(Mbps)
CH1 CH7 CH13 CH1 CH7 CH13 CH1 CH7 CH13
11b 1 19 19 19 -33 -33 -33 -97 -96 -97
 11 19 19 19 -33 -33 -33 -89 -89 -89
6 19 19 19 -30 -30 -30 -92 -92 -92
11g
54 18 18 18 -33 -31 -31 -76 -76 -76
Power(dBm) EVM(dB) Sensitivity(dBm)
Mode Rate(Mbps)
CH3 CH7 CH11 CH3 CH7 CH11 CH3 CH7 CH11
11n MCS0 19 19 19 -33 -33 -33 -90 -90 -90
HT40 MCS7 17 17 17 -34 -34 -34 -70 -70 -70

RF Test Report
PathA
5G
Power(dBm) EVM(dB) Sensitivity(dBm)
Rate
Mode CH CH CH CH CH CH CH CH CH CH CH CH
(Mbps)
36 100 140 161 36 100 140 161 36 100 140 161

6 19 19 19 19 -29 -29 -29 -29 -92 -92 -92 -92

11a
54 18 18 18 18 -32 -32 -32 -32 -75 -76 -76 -76
Power(dBm) EVM(dB) Sensitivity(dBm)
Rate
Mode CH CH CH CH CH CH CH CH CH CH CH CH
(Mbps)
38 102 142 159 38 102 142 159 38 102 142 159
11n MCS0 19 19 19 19 -31 -31 -31 -31 -90 -90 -90 -90
HT 40 MCS7 17 17 17 17 -32 -32 -32 -32 -72 -71 -71 -71
Power(dBm) EVM(dB) Sensitivity(dBm)
Rate
Mode CH CH CH CH CH CH CH CH CH CH CH CH
(Mbps)
42 106 138 155 42 106 138 155 42 106 138 155
11ac MCS0 18 18 18 18 -29 -29 -29 -29 -87 -87 -87 -86
VHT80 MCS9 15 15 15 15 -35 -35 -35 -35 -62 -62 -61 -61
PathB
5G
Power(dBm) EVM(dB) Sensitivity(dBm)
Rate
Mode CH CH CH CH CH CH CH CH CH CH CH CH
(Mbps)
36 100 140 161 36 100 140 161 36 100 140 161
6 19 19 19 19 -30 -30 -30 -30 -92 -92 -92 -92
11a
54 18 18 18 18 -32 -32 -32 -32 -76 -76 -76 -76
Power(dBm) EVM(dB) Sensitivity(dBm)
Rate
Mode CH CH CH CH CH CH CH CH CH CH CH CH
(Mbps)
38 102 142 159 38 102 142 159 38 102 142 159
11n MCS0 19 19 19 19 -31 -31 -31 -31 -90 -90 -90 -90
HT40 MCS7 17 17 17 17 -32 -32 -32 -32 -71 -71 -71 -71
 Power(dBm) EVM(dB) Sensitivity(dBm)
Rate
Mode CH CH CH CH CH CH CH CH CH CH CH CH
(Mbps)
42 106 138 155 42 106 138 155 42 106 138 155
11ac MCS0 18 18 18 18 -29 -29 -29 -29 -87 -87 -87 -86
VHT80 MCS9 15 15 15 15 -35 -35 -35 -35 -62 -62 -61 -61

3.4 Bluetooth RF Specification

RF Characteristics for BT
Items Contents
Specification BT V5.0/4.2/4.1/V4.0+BLE/V3.0/V2.1+EDR
Modulation FHSS: GFSK, π/4-DQPSK, 8DPSK
Channel frequency 2.401~2.481 GHz
Data rate 1Mbps,2Mbps,3Mbps
TX Characteristics min. typ. max. Unit

Power level(BR/EDR) 0 4 8 dBm

Power level(BLE) 0 4 8 dBm

RX Characteristics min. typ. max. Unit

Minimum input level(Muti-slot packages

-90 -85 -80 dBm
sensitivity mode<0.1%)

ESD CAUTION: Although this module is designed to be as robust as possible, Electrostatic Discharge (ESD)
can damage this module. It must be protected from ESD at all times and handled under the protection of ESD.
4. Pin Assignments

Figure 4-Top view

PIN Function Description

1 GND Ground connections
2 WL_ANT1 WLAN RF ANT1
3 GND Ground connections
4 GND Ground connections
5 GND Ground connections
6 GND Ground connections
7 GND Ground connections
8 GND Ground connections
9 WL_ANT0 WLAN RF ANT0
10 GND Ground connections
11 GND Ground connections
12 BT_TRX BT_ANT
13 NC No connection(floating)
14 NC No connection(floating)
Input and active low signal, this signal is used by system to turn off
15 WL_REG_ON
WLAN radio with host interface remaining connected
Output and open drain active low signal. This signal is used to request
16 WL_WAKE that the system return from a sleep/suspended state to service a
function initiated wake event.
17 SDIO_CMD SDIO command line
18 SDIO_CLK SDIO clock line
19 SDIO_DATA3 SDIO data line 3
20 SDIO_DATA2 SDIO data line 2
21 SDIO_DATA0 SDIO data line 0
22 SDIO_DATA1 SDIO data line 1
23 GND Ground connections
Output signal, this signal is used to request that the system return from
24 WL_WAKE
a sleep/suspended state to service a function initiated wake event.
25 NC No connection(floating)
26 NC No connection(floating)
27 PCM_SYNC PCM sync signal
28 PCM_IN PCM data input
29 PCM_OUT PCM data output
30 PCM_CLK PCM clock
31 SUSCLK External 32k or RTC clock input to reduce power and cost for module.
32 GND Ground connections
33 NC No connection(floating)
Supply voltage for SDIO IO and UART, 3.3V or 1.8V is alternative; VDIO
34 VDIO 3.3V for default speed and high-speed modes, 1.8V for
SDR12/SDR25/SDR50/DDR50 modes.
35 NC No connection(floating)
36 VDD33 3.3V Main Power Supply
37 NC No connection(floating)
Input and active low signal, this signal is used by system to shut down BT
38 BT_REG_ON function with host interface remaining connected. When this pin is
pulled low, UART interface will be disabled.
39 GND Ground connections
40 UART_TXD Bluetooth UART interface
41 UART_RXD Bluetooth UART interface
42 UART_RTS_N Bluetooth UART interface
43 UART_CTS_N Bluetooth UART interface
Input and active low signal, this signal can externally shut down the module.
44 SD_RESET
When this pin is pulled low, SDIO interface will be disabled.
45 NC No connection(floating)
46 GND Ground connections
47 NC No connection(floating)
48 GND Ground connections
49 HOST_WAKE_BT Input signal, this signal is used by system to wake up Bluetooth device.
50 BT_WAKE_HOST Output signal, this signal is used by module to wake host system.
The WL_REG_ON/ BT_REG_ON/ WL_WAKE/ SD_RESET/ HOST_WAKE_BT signal range from 1.8V to
3.3V, the host provides the power source with the targeted power level to the module via the VDIO pin (Pin
34). Power supply, GPIO DC and IO DC characteristics please refer to the fallowing tables.

Symbol Parameter Minimum Typical Maximum Units

VDD33 3.3V Supply Voltage 3.1 3.3 3.5 V
VDIO_3.3V 3.3V I/O Supply Voltage 3.1 3.3 3.5 V
VDIO_1.8V 1.8V I/O Supply Voltage 1.62 1.8 1.98 V
Table 1-DC Characteristics

Symbol Parameter Minimum Normal Maximum Units

VIH Input high voltage 2.0 3.3 3.6 V
VIL Input low voltage -- 0 0.9 V
VOH Output high voltage 2.97 -- 3.3 V
VOL Output low voltage 0 -- 0.33 V
Table 2-3.3V GPIO DC Characteristics

Symbol Parameter Minimum Normal Maximum Units

VIH Input high voltage 1.7 1.8 3.6 V
VIL Input low voltage -- 0 0.8 V
VOH Output high voltage 1.62 -- 1.8 V
VOL Output low voltage 0 -- 0.18 V
Table 3-1.8V GPIO DC Characteristics

After power-on, the SDIO interface is selected by the module automatically when a valid SDIO command is
received. To attain better SDIO host compatibility, the following power-on sequence is recommended. We
recommend that the card detection procedures are divided into two phases: A 3.3V/1.8V power pre-charge
phase and a formal power-up phase. After the 3.3V ramp up and 1.8V ramp up, the power management unit is
enabled by the power ready detection circuit. The power management unit enables the SDIO block. EFUSE is
then auto loaded to SDIO circuits during the TSDIO_Ready duration and then SDIO pins are pulled up. After
CMD5/5/3/7 procedures, card detection is executed.
 Figure 5-System Power-On Sequence

Min. Typical Max. Unit Description

T18_Ramp 0.1 0.5 2.5 ms The 1.8V power ramp up duration.
T33_Ramp 0.1 0.5 2.5 ms The 3.3V power ramp up duration.
TChip_Ready 10 100 X ms CHIP_EN pull high timing
SDIO Not Ready Duration. In this state, the module may
respond to commands without the ready bit being set.
TSDIO_Ready 10 20 100 ms
After the ready bit is set, the host will initiate complete
card detection procedure.
Table 4-System Power on Timing Parameters

Note: The module pull high CHIP_EN internal.

5. Typical Application Circuit

Figure 6

NOTE：

a. RF traces need to keep 50-ohm impedance. Please reserve a “pi” circuit for antenna matching.
b. PIN_15 actives low WLAN disable, no connecting when using; the same as PIN_38.
c. Module’s BT UART_TX connects to reference circuit’s RX, UART_RX connects to reference circuit’s TX.
d. Keep the SDIO lines as equal as possible, minimize the trace length between host and module. Make sure that
SD-CLK trace has a good ground reference.
6. Mechanical Specifications

Module dimension: Typical (L*W * H): 15.1mm*13.1mm*2.4mm Tolerance: +/-0.15mm

Figure 7-Module dimension

7. Others

7.1 Package Information

Figure 8-Package Information

7.2 Storage Temperature and Humidity

1. Storage Condition: Moisture barrier bag must be stored under 30℃, humidity under 85% RH.
The calculated shelf life for the dry packed product shall be a 12-months from the bag seal date.
Humidity indicator cards must be blue, <30%.
2. Products require baking before mounting if humidity indicator cards reads > 30% temp < 30℃,
humidity < 70% RH, over 96 hours.
Baking condition: 125℃, 12 hours.
Baking times: 1 time.
7.3 Recommended Reflow Profile
Reflow soldering shall be done according to the solder reflow profile, Typical Solder Reflow Profile is
illustrated in Figures 9. The peak temperature is 245℃.

Figure 9-Typical Solder Reflow Profile