Product Manual 26776

(Revision NEW, 3/2014)

Original Instructions

SECM70 Digital Control

Power Gen and Vehicular Applications

Hardware Only

Hardware Manual
 Read this entire manual and all other publications pertaining to the work to be
performed before installing, operating, or servicing this equipment.
Practice all plant and safety instructions and precautions.
General
Precautions Failure to follow instructions can cause personal injury and/or property damage.

This publication may have been revised or updated since this copy was produced.
To verify that you have the latest revision, check manual 26311 , Revision Status &
Distribution Restrictions of Woodward Technical Publications, on the publications
Revisions page of the Woodward website:
www.woodward.com/publications

The latest version of most publications is available on the publications page. If

your publication is not there, please contact your customer service representative
to get the latest copy.

Any unauthorized modifications to or use of this equipment outside its specified

mechanical, electrical, or other operating limits may cause personal injury and/or
property damage, including damage to the equipment. Any such unauthorized
Proper Use modifications: (i) constitute "misuse" and/or "negligence" within the meaning of
the product warranty thereby excluding warranty coverage for any resulting
damage, and (ii) invalidate product certifications or listings.

If the cover of this publication states "Translation of the Original Instructions"

please note:
The original source of this publication may have been updated since this
Translated translation was made. Be sure to check manual 26311 , Revision Status &
Publications Distribution Restrictions of Woodward Technical Publications, to verify whether
this translation is up to date. Out-of-date translations are marked with . Always
compare with the original for technical specifications and for proper and safe
installation and operation procedures.

Revisions—Changes in this publication since the last revision are indicated by a black line
alongside the text.

Woodward reserves the right to update any portion of this publication at any time. Information provided by Woodward is
believed to be correct and reliable. However, no responsibility is assumed by Woodward unless otherwise expressly
undertaken.
Manual 26776
Copyright © Woodward 2014
All Rights Reserved
Manual 26776 SECM70 Hardware Manual

Contents

WARNINGS AND NOTICES ............................................................................III

ELECTROSTATIC DISCHARGE AWARENESS ................................................. IV
REGULATORY COMPLIANCE ....................................................................... IV
CHAPTER 1. GENERAL INFORMATION ........................................................... 1
Introduction .............................................................................................................1
Application ..............................................................................................................1
Control Features .....................................................................................................1
Model Variant Features ..........................................................................................2
Environmental Capabilities .....................................................................................3
SECM70 Packaging Dimensions ...........................................................................4
CHAPTER 2. INSTALLATION.......................................................................... 5
Scope......................................................................................................................5
Unpacking ...............................................................................................................5
Programming Requirements...................................................................................5
Painting ...................................................................................................................5
Welding ...................................................................................................................5
Power Requirements ..............................................................................................5
Location Considerations .........................................................................................6
Application Approval Process .................................................................................6
Electrical Connections ............................................................................................7
Wiring Guidelines ...................................................................................................8
CHAPTER 3. I/O DESCRIPTION ..................................................................... 9
Block Diagram ........................................................................................................9
Power Inputs (BATT, DRVG_A and DRVG_B) ....................................................10
DRVP Input ...........................................................................................................10
KEYSW Input ........................................................................................................11
MPRD Output .......................................................................................................12
CNK_VR±, CNK_DG & CAM_DG Inputs .............................................................13
Transducer Power Outputs (XDRP) .....................................................................14
Analog Inputs (AN1—AN14).................................................................................15
Switch Inputs (SWG1—SWG4) ............................................................................16
Digital Input (SPD) ................................................................................................16
HEGO Sensor Inputs ............................................................................................17
Lambda Sensor Unit (UEGO) Inputs ....................................................................17
Knock Sensor Inputs ............................................................................................18
Low-side Outputs (LSO1-LSO9) ..........................................................................19
Lamp Outputs (LAMP1-3).....................................................................................20
Injector Outputs ....................................................................................................21
EST Outputs .........................................................................................................23
H-bridge Outputs ..................................................................................................23
3-Phase BLDC Output ..........................................................................................24
CAN Communications Ports (CAN1+/–, CAN2+/–) ..............................................25
CHAPTER 4. PRODUCT SERVICE OPTIONS.................................................. 27

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SECM70 Hardware Manual Manual 26776

Illustrations and Tables

Figure 1-1. SECM70 Package Dimensions ............................................................4

Figure 3-1. Input Power Wiring Diagram ..............................................................10
Figure 3-2. Driver Power Wiring Diagram ............................................................11
Figure 3-3. Keyswitch Wiring Diagram .................................................................11
Figure 3-4. MPRD Wiring Diagram .......................................................................12
Figure 3-5. MPU Input Wiring Diagram ................................................................13
Figure 3-6. Hall-Effect Input Wiring Diagram........................................................13
Figure 3-7. Transducer Output Power Wiring Diagram ........................................14
Figure 3-8. Analog Input (with internal pull-up resistor) Wiring Diagram..............15
Figure 3-9. Analog Input (with internal pull-down resistor) Wiring Diagram .........15
Figure 3-10. Digital Input Wiring Diagram ............................................................16
Figure 3-11. Digital Input Wiring Diagram ............................................................16
Figure 3-12. HEGO Sensor Wiring Diagram ........................................................17
Figure 3-13. Lambda Sensor Unit Wiring Diagram ..............................................18
Figure 3-14. Knock Sensor Wiring Diagram .........................................................18
Figure 3-15. LSO3-LSO9 Output Wiring Diagram ................................................19
Figure 3-16. LSO1 & LSO2 Output Wiring Diagram.............................................19
Figure 3-17. LAMP Output Wiring Diagram ..........................................................20
Figure 3-18. Injector Current Waveform ...............................................................21
Figure 3-19. Injector Wiring Diagram....................................................................22
Figure 3-20. H-Bridge Wiring Diagram .................................................................23
Figure 3-21. 3-Phase Wiring Diagram ..................................................................24
Figure 3-22. CANbus Topology ............................................................................25

Table 2-1. SECM70 Control Wiring Pinout .............................................................7

Table 3-1. VR Input Specifications .......................................................................14
Table 3-2. Digital Input Specifications ..................................................................14
Table 3-3. Transducer Output Specifications .......................................................14
Table 3-4. Analog Input Configuration ..................................................................15
Table 3-5. Switch Input Characteristics & Capabilities .........................................16
Table 3-6. Digital Input Characteristics & Capabilities .........................................16
Table 3-7. HEGO Transfer Function.....................................................................17
Table 3-8. HEGO Fault Diagnostic States ............................................................17
Table 3-9. LSO Characteristics & Capabilities .....................................................20
Table 3-10. LAMP Characteristics & Capabilities.................................................21
Table 3-11. Injector Driver Characteristics & Capabilities ....................................22
Table 3-12. EST Driver Characteristics & Capabilities .........................................23
Table 3-13. H-Bridge Characteristics & Capabilities ............................................24
Table 3-14. 3-Phase Characteristics & Capabilities .............................................24
Table 3-15. CAN Specification .............................................................................25

The following are trademarks of Woodward, Inc.:

MotoHawk
Mototune
Woodward

The following are trademarks of their respective companies:

Simulink (The MathWorks, Inc.)

ii Woodward
 Manual 26776 SECM70 Hardware Manual

Warnings and Notices

Important Definitions
This is the safety alert symbol. It is used to alert you to potential
personal injury hazards. Obey all safety messages that follow this
symbol to avoid possible injury or death.
 DANGER—Indicates a hazardous situation which, if not avoided, will result
in death or serious injury.
 WARNING—Indicates a hazardous situation which, if not avoided, could
result in death or serious injury.
 CAUTION—Indicates a hazardous situation which, if not avoided, could
result in minor or moderate injury.
 NOTICE—Indicates a hazard that could result in property damage only
(including damage to the control).
 IMPORTANT—Designates an operating tip or maintenance suggestion.

The engine, turbine, or other type of prime mover should be

equipped with an overspeed shutdown device to protect against
runaway or damage to the prime mover with possible personal injury,
Overspeed / loss of life, or property damage.
Overtemperature / The overspeed shutdown device must be totally independent of the
Overpressure prime mover control system. An overtemperature or overpressure
shutdown device may also be needed for safety, as appropriate.

The products described in this publication may present risks that

could lead to personal injury, loss of life, or property damage.
Always wear the appropriate personal protective equipment (PPE) for
Personal Protective the job at hand. Equipment that should be considered includes but is
not limited to:
Equipment
 Eye Protection
 Hearing Protection
 Hard Hat
 Gloves
 Safety Boots
 Respirator
Always read the proper Material Safety Data Sheet (MSDS) for any
working fluid(s) and comply with recommended safety equipment.

Be prepared to make an emergency shutdown when starting the

engine, turbine, or other type of prime mover, to protect against
runaway or overspeed with possible personal injury, loss of life, or
Start-up property damage.

On- and off-highway Mobile Applications: Unless Woodward's

control functions as the supervisory control, customer should install
a system totally independent of the prime mover control system that
Automotive monitors for supervisory control of engine (and takes appropriate
action if supervisory control is lost) to protect against loss of engine
Applications
control with possible personal injury, loss of life, or property
damage.

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 SECM70 Hardware Manual Manual 26776

To prevent damage to a control system that uses an alternator or

battery-charging device, make sure the charging device is turned off
before disconnecting the battery from the system.
Battery Charging
Device

Electrostatic Discharge Awareness

Electronic controls contain static-sensitive parts. Observe the
following precautions to prevent damage to these parts:
 Discharge body static before handling the control (with power to
Electrostatic the control turned off, contact a grounded surface and maintain
Precautions contact while handling the control).
 Avoid all plastic, vinyl, and Styrofoam (except antistatic
versions) around printed circuit boards.
 Do not touch the components or conductors on a printed circuit
board with your hands or with conductive devices.
To prevent damage to electronic components caused by improper
handling, read and observe the precautions in Woodward manual
82715, Guide for Handling and Protection of Electronic Controls,
Printed Circuit Boards, and Modules.

Follow these precautions when working with or near the control.

1. Avoid the build-up of static electricity on your body by not wearing clothing
made of synthetic materials. Wear cotton or cotton-blend materials as much
as possible because these do not store static electric charges as much as
synthetics.
2. Do not remove the printed circuit board (PCB) from the control cabinet
unless absolutely necessary. If you must remove the PCB from the control
cabinet, follow these precautions:
 Do not touch any part of the PCB except the edges.
 Do not touch the electrical conductors, the connectors, or the
components with conductive devices or with your hands.
 When replacing a PCB, keep the new PCB in the plastic antistatic
protective bag it comes in until you are ready to install it. Immediately
after removing the old PCB from the control cabinet, place it in the
antistatic protective bag.

Regulatory Compliance
International Compliance

UNECE Type approval to UNECE Regulations 10, 67, and 110 (pending)

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Manual 26776 SECM70 Hardware Manual

Chapter 1.
General Information

Introduction
This manual describes all variants of the Woodward’s 70-pin Small Engine
Control Module (SECM70) hardware.

Application
The SECM70 control platform fits a variety of applications, including gasoline and
natural gas engines for power generation, forklifts, lift trucks, and on-highway
vehicles. The SECM70 control is programmed to meet the specific needs of the
prime mover and its driven load.

At the heart of the SECM70 control is a powerful 32-bit ST SPC563M64

microprocessor that runs Woodward’s ControlCore operating system. Application
programming is accomplished via Woodward’s MotoHawk application software
tool. MotoHawk is a rapid controls system development tool that allows controls
engineers to quickly create controls software directly within Simulink diagrams,
which run on any MotoHawk-enabled electronic control modules. Application
developers work directly in the Simulink environment and with a one-step build
are able to go from an application model to a file that can be programmed directly
into Woodward production hardware. MotoHawk provides a high-level
programming environment for users who have control systems expertise but
don’t necessarily have specific embedded programming skills. Once the
application program has been generated and loaded into the SECM70 control via
the CAN port, the user can view variables and tune the control using an
appropriate service interface tool such as Woodward’s ToolKit or MotoTune.
Connection to other devices, such as a diagnostic tool, is accomplished by
means of other CAN ports available on the control. The desired information flow
is programmed into the control via MotoTune or ToolKit.

The SECM70 control consists of a single rigid printed circuit board attached to an
aluminum housing using thermal adhesive, which is then closed and sealed with
an aluminum cover. Connections to the control are made via a single 70-pin
automotive-style sealed connector. The control can be mounted directly to the
engine or frame using vibration isolators which are available pre-installed on the
control or separately.

Control Features
Woodward
HW Version Features
P/N
1751-6680 1452 (PROD) Mobile Industrial
1751-6649 1402 (DEV) Mobile Industrial, on-the-fly calibratible
1751-6681 1453 (PROD) Power Gen
1751-6650 1403 (DEV) Power Gen, on-the-fly calibratible
1751-6682 1459 (PROD) Marine
1751-6653 1409 (DEV) Marine, on-the-fly calibratible
1751-6683 1461 (PROD) On-Highway (to be released at a later date)
1751-6675 1411 (DEV) On-Highway, on-the-fly calibratible

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 SECM70 Hardware Manual Manual 26776
Standard features common to all models are:
 2 engine speed inputs: camshaft and crankshaft speed (crank software
configurable for variable reluctance [VR] magnetic pickup sensor or Hall
effect proximity sensor inputs)
 1 frequency input
 Up to 14 analog inputs
 4 switch inputs
 Up 2 HEGO sensor inputs
 1 UEGO sensor input (compatible with Bosch LSU4.9 or NTK sensors)
 Up to 2 knock sensor inputs
 1 transducer power output providing +5 V (350 mA)
 Up to 6 injector drivers (3 capable of providing software configurable peak-
and-hold current levels
 Up to 8 ignition coil drivers
 MPRD (Master Power Relay Driver) low-side output
 9 low-side output drivers (up to 3 with current sense feedback)
 Up to 3 lamp drivers
 TACH low-side output
 2 H-bridge driver outputs providing 10 A and 5 A drive capability and
current-sense feedback
 Optional 3-Phase BLDC driver
 2 CAN (Controller Area Network) communications ports
 16-kilobyte serial EEPROM for tunable parameter storage

Model Variant Features

MI-1402/1452 MI-1403/1453 MI-1409/1459 MI-1411/1461
1751- 1751- 1571- 1751-
Function 6649/6680 6650/6681 6653/6682 6675/6683
AN1 (221k_PD) x x x x
AN2 (221k_PD) x x x x
AN3 (221k_PD) x x x x
AN4 (221k_PD) x x x (2.21k_PU) x
AN5 (4.75k_PD) x x x (2.21k_PU) x
AN6 (4.75k_PD) x x (2.21k_PU)
AN7 (51.1k_PD) x x x (1ms ) x
AN8 (4.75k_PD) x x x (51.1k_PD) x
AN9 (2.21k_PU) x x x (1k_PU) x
AN10 (2.21k_PU) x x x (1k_PU) x
AN11 (2.21k_PU) x x x (1k_PU) x
AN12 (4.75k_PU) x x x (1k_PU) x
AN13 (4.75k_PU) x x x (2.21k_PU) x
AN14 (10k_PU) x x x
EGO1 x x x
EGO2 x
UEGO x x
EK1 x x x x
EK2 x x x
SWG1 x x x x
SWG2 x x x x
SWG3 x x x x
SWG4 / Bootkey x x x x
CAM_DG x x x x
CNK_DG x x x x

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Manual 26776 SECM70 Hardware Manual

MI-1402/1452 MI-1403/1453 MI-1409/1459 MI-1411/1461

1751- 1751- 1571- 1751-
Function 6649/6680 6650/6681 6653/6682 6675/6683
SPD x
CNK_VR/SPD_VR x x x x
LSO1 x x x x
LSO2 x x x x
LSO3 (CS) x x x x
LSO4 x x x x
LSO5 x x x x
LSO6 (CS) x (no CS) x (no CS) x x (no CS)
LSO7 (CS) x (no CS) x (no CS) x x (no CS)
LSO8 x x x x
LSO9 x x x x
MPRD x x x x
LAMP1 x x x
LAMP2 (TACH) x x x
LAMP3 x x x
INJ1 (PH) x x
INJ2 (PH) x x
INJ3 (PH) x x
INJ4 (PH) x
INJ4 x x
INJ5 x x
INJ6 x x
H1 x x x
H2 x
3P 3P
EST1 x x x
EST2 x x x
EST3 x x x
EST4 x x x x
EST5 x (pin 18) x (pin 18) x (pin 18) x (pin 13)
EST6 x (pin 19) x (pin 19) x (pin 19) x (pin 14)
EST7 x
EST8 x

Environmental Capabilities
The following is a summary list of the environmental limits used for ECM design
validation.

Operating Voltage 8–32 Vdc

Operating Temperature (–40 to +105) °C / (–40 to +221) °F
Storage Temperature (–40 to +105) °C / (–40 to +221) °F
Mechanical Vibration RV3 (22.1 Grms)
Mechanical Shock 50 g, 11 ms, half-sine wave, 4 shocks in
each direction (24 total shocks)
EMI/RFI Specification SAE J1113-41 (Radiated & Conducted
Emissions)
SAE J1113-13 (ESD)
SAE J1113-21 (Radiated RF Immunity)
SAE J1113-11 (Transient Testing)

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SECM70 Hardware Manual Manual 26776
For more detailed information on the SECM70 environmental validation
specifications, please contact Woodward. Sharing of this information requires an
NDA (non-disclosure agreement).

For new applications, the actual environmental data and OE

specifications must be reviewed by Woodward during application
development and approved prior to offering warranty coverage for
the application.

SECM70 Packaging Dimensions

Figure 1-1. SECM70 Package Dimensions

4 Woodward
Manual 26776 SECM70 Hardware Manual

Chapter 2.
Installation

Scope
This chapter contains general installation instructions for the SECM70 control.
Power requirements, environmental precautions, and location considerations are
included to help you determine the best location for the control. Additional
information includes unpacking instructions, electrical connections, and
installation checkout procedures.

Unpacking
Before handling the control, read the Electrostatic Discharge Awareness section
(page iv). Be careful when unpacking the electronic control. Check the control for
signs of damage such as bent panels, scratches, and loose or broken parts. If
any damage is found, immediately notify the shipper.

Programming Requirements
SECM70 units are shipped without application software installed. The customer
is responsible for programming both microcontrollers with application software.
Refer to manual 26674, OH6 Communications, for programming information.

Painting
Painting of the SECM70 is not recommended nor is it required for heat
dissipation. If painting must be done, all connectors and labels must be masked
prior to painting. The paint must be validated per the following requirements:
 The composition of the paint must be specified to Woodward.
 The specification for thickness of the applied paint must be supplied to
Woodward.
 The customer may be asked to participate in vehicle-testing with a
thermocouple-instrumented test unit that is painted and installed in the
application.

Woodward will work with the customer to determine if paint can be safely applied;
however, Woodward reserves the right to deny warranty if the paint is found to be
detrimental to the SECM70.

Welding
Do not conduct any welding on or near the SECM70 control. At a minimum,
disconnect wiring to the control if welding near the unit is being conducted.

Power Requirements
All versions of the SECM70 control require a voltage source of 8 to 32 Vdc (12 V
or 24 V nominal based on system architecture and validation). The power
dissipation within the control is typically less than 35 W. Standby current draw is
<10 μA (nominal).

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SECM70 Hardware Manual Manual 26776

Total power consumption for both the control and the driven loads is
dependent on the application. A typical application may require
0.5 kW to 0.8 kW to drive the loads under all operating conditions.
The power source must be sized appropriately for the application.
If a battery is used for operating power, an alternator or other
battery- charging device is necessary to maintain a stable supply
voltage.

To prevent damage to the control, do not exceed the input voltage

range.

To prevent damage to the control, make sure that the alternator or

other battery-charging device is turned off or disconnected before
disconnecting the battery from the control.

Location Considerations
Consider these requirements when selecting the mounting location:
 Adequate ventilation for cooling.
 Space for servicing and repair.
 Protection from direct exposure to water or to a condensation-prone
environment.
 Protection from road debris or material that could impact or deposit on unit
and reduce thermal fin cooling.

Protection from high-voltage or high-current devices, or devices which produce

electromagnetic interference in excess of levels defined in SAE J1113-13 (ESD),
SAE J1113-21 (Radiated RF Immunity), and SAE J1113-11 (EOS Tests).
 The may be mounted on-engine, but this is not preferred due to the harsh
vibration and thermal environment of an on-engine mount. If the control
must be engine-mounted, the location must be approved by Woodward, and
the customer may be required to test each application.
 The vibration isolators provided with the units must be used independent of
mounting location. The isolators must be inspected for wear at least once
per year. For on-engine mounting, Woodward recommends replacing the
vibration isolators once a year or sooner if wear is observed.

Select a location on or near the engine that will provide an operating temperature
range in accordance to the Environmental Specifications listed in this manual.
Refer to manual 26784, SECM70 Installation, for more details on mounting
location, orientation and mating connectors.

Application Approval Process

New applications of the SECM70 module require review and approval by
Woodward in order to grant production warranty coverage. This process is either
via the Application Management Process (AMP) for Woodward developed
systems or by submittal of I/O usage details and operational and environmental
conditions to Woodward via the Account Manager. A Woodward Product
Engineer will review and provide approval or recommendations to gain approval.
Early involvement of Woodward will help assure this process goes smoothly.

6 Woodward
Manual 26776 SECM70 Hardware Manual

Electrical Connections

The control will only meet ingress protection specifications with all
mating connectors properly installed. In addition, all unused
connections in the mating connectors must be plugged to ensure
proper sealing of the connectors. Refer to Table 2-1 for the proper
connector plug part numbers. Failure to adhere to these guidelines
may result in product failure or decreased product life.

Plant wiring guidelines can be provided by Woodward for each application, and
final application wiring must be jointly agreed to with OE and Woodward during
the development project. No changes shall occur without approval from
Woodward. Table 2-1 is the SECM70 control wiring pinout. The highlighted pins
use the larger terminals.

Pin # Pin Name Pin # Pin Name Pin # Pin Name

1 INJ3 31 CNK_DG 61 AN14
2 EST_RTN 32 XDRG 62 EK2N
3 LSO2 33 SPEED/TG 63 EK1N
4 LSO3 34 INJ1/H2+/3P-B 64 EK1P
5 LSO4 35 INJ2/H2– 65 EGO1N
6 EST1 36 CAN1+ 66 EGO1P
7 LSO1 37 CAN2+ 67 DRVP
8 EST2 38 KEYSW 68 BATT
9 LSO5 39 AN9 69 DRVG_A
10 LSO6 40 AN10 70 DRVG_B
11 EST3 41 AN11
12 INJ4 42 AN4
13 EST7/INJ5/EST5 43 AN5
14 EST8/INJ6/EST6 44 AN7
15 LSO7 45 AN8
16 CNK_VR– 46 EK2P
17 CNK_VR+ 47 AN6/SNS
18 EST5/PH_INJ4 48 XDRP
19 EST6 49 EGO2N/INRC
20 LSO8 50 EGO2P/SR
21 EST4 51 H1+/3P-A
22 AN3 52 H1–/3P-C
23 LSO9 53 CAN1–
24 AN2 54 CAN2–
25 SWG1 55 MPRD
26 SWG4/BOOT 56 LAMP3
27 SWG2 57 LAMP2
28 AN1 58 LAMP1
29 SWG3 59 AN12
30 CAM_DG 60 AN13

Table 2-1. SECM70 Control Wiring Pinout

Woodward 7
SECM70 Hardware Manual Manual 26776

Wiring Guidelines

DO NOT run signal wires next to wires carrying large currents (such
as injector outputs, ignition outputs, H-bridge wiring, or power
source wiring). See Woodward application note 50532, Interference
Control in Electronic Governing Systems, for more information.

Where shielded cable is used (such as cam or crank speed signals, LSU inputs,
or communications signals), cut the cable to the desired length and prepare the
cable as instructed below.

Strip outer insulation from BOTH ENDS, exposing the braided or spiral wrapped
shield. DO NOT CUT THE SHIELD.
 Using a sharp, pointed tool carefully spread the strands of the shield.
 Pull inner conductor(s) out of the shield. If the shield is the braided type,
twist it to prevent fraying.
 Remove 6 mm (1/4 inch) of insulation from the inner conductors.
 Ground the shield at the source end and cut off the exposed shield at the
receiving end.

Installations with severe electromagnetic interference (EMI) may require

additional shielding precautions. Contact Woodward for more information.

The acceptable wire size range for the small 0.6 mm terminals is 0.22 – 0.75 mm2.
The acceptable wire size range for the large 1.5 mm terminals is 0.5 – 2 mm2.

Reference the EMC-OH installation manual for proper terminals for chosen wire
size.

Unit Grounding
The SECM70 housing is intended to be mounted through non-conductive
vibration isolators with no connection to engine/chassis ground.

8 Woodward
Manual 26776 SECM70 Hardware Manual

Chapter 3.
I/O Description

All interface I/O not provided by Woodward must be reviewed by

Woodward and approved prior to offering warranty coverage for the
application.

Block Diagram

Woodward 9
SECM70 Hardware Manual Manual 26776

Power Inputs (BATT, DRVG_A and DRVG_B)

Power supply input must be low-impedance (for example, directly from a battery).
DO NOT power the control from high-voltage sources with resistors and zener
diodes in series with the control power input.

To prevent damage to the control, do not power a low-voltage control

from high-voltage sources, do not exceed 32 V on the power inputs
for more than 1 minute, and do not power any control from high-
voltage sources with resistors and zener diodes in series with the
power input.

Figure 3-1. Input Power Wiring Diagram

Run the power leads directly from the power source to the control. DO NOT
POWER OTHER DEVICES WITH LEADS COMMON TO THE CONTROL. Avoid
long wire lengths. Connect the battery positive (power source positive) to the
BATT input and battery negative (power source common) to DRVG_A and
DRVG_B (see Figure 3-1). If the power source is a battery, be sure the system
includes an alternator or other battery-charging device.

If the battery is located outside the engine compartment, module grounding to

battery shall be via the vehicle chassis. SECM70 MUST be locally grounded,
also engine must be well grounded to chassis and chassis well grounded to
battery ground.

The BATT input is protected against damage from a –24 V reverse battery
condition for up to 5 minutes.

DRVP Input
DRVP provides the primary power for the internal H-bridges and output
recirculation diodes. These inputs must not be directly connected to the power
source. They must be connected to the power source via the Master Power
Relay Driver (see Figure 3-2) to protect the drivers during a reverse-battery
condition. The Master Power Relay is energized by the MPRD output, which is
under application program control. DRVP voltage monitor is available (see the
Analog Inputs section below). Note that the DRVP monitor will typically read up
to 3 V when MPRD is off due to internal leakage paths.

10 Woodward
Manual 26776 SECM70 Hardware Manual

Figure 3-2. Driver Power Wiring Diagram

Proper fusing of the control is highly recommended to prevent

damage to the control in case of shorts that may occur in the field
wiring. Fuses should be wired in series with all the power inputs to
the control.

KEYSW Input
The KEYSW discrete input provides a power-on wake-up command signal to the
SECM70 control’s internal power supply. Once activated, the control’s internal
power supply will remain active until commanded to shut down by the application
program. A normally-open switch is connected between battery positive and the
KEYSW input, thus connecting battery voltage to the control when the switch is
closed (see Figure 3-3). The VBAT+ supply must be from a fused source.
KEYSW voltage monitor is available (see the Analog Inputs section below).

Figure 3-3. Keyswitch Wiring Diagram

The control will not power up until the KEYSW input is activated.
Once activated, the KEYSW input may be opened, but the control’s
power supply will remain activated until commanded to shut down by
the application program. Typically, the application will monitor the
KEYSW input voltage level, and command the control to shutdown
whenever the KEYSW input voltage drops below a specified
minimum level. The application program may include shutdown
delays to allow time for tunable settings to be stored in non-volatile
memory before shutting down.

The KEYSW input is protected against damage from a –24 V reverse battery
condition for up to 5 minutes.

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Internal Temperature Monitor

The SECM70 microcontroller contains an internal temperature monitor that is
available to the application. The monitor has an accuracy of ±10 °C. This monitor
is a critical parameter for the application thermal study which is a requirement for
application approval and warranty coverage.

A logged maximum temperature exceeding 135 °C may result in

warranty claim denial.

MPRD Output
The MPRD (Main Power Relay Driver) Output is used in conjunction with the
KEYSW input to control the switching of power to the external loads that are
connected to the module. For example, the power to the injectors, ignition coils,
wastegate control valve, etc., can be disabled until the relay(s) that are
connected to the MPRD output are energized. The power to the injectors should
come through a set of normally-open contacts on the relay(s) (see Figure 3-4). It
is assumed that the architecture for any system that employs the SECM70 will
use the MPRD output to switch power through the master power relay(s). The
MPRD output is protected against reverse battery connection by utilizing a
blocking diode. The maximum sinking current for the MPRD output is 1 A.

Failure to use the MPR power distribution architecture will leave the
output drivers and actuators unprotected from a reverse battery
condition and will void warranty for this failure mode.

The driver is thermally self-protected and will provide shutdown fault detection.
Open-load detection must be based on DRVP diagnostics.
To ECM-

Outputs
Injector
OH

Figure 3-4. MPRD Wiring Diagram

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Manual 26776 SECM70 Hardware Manual

CNK_VR±, CNK_DG & CAM_DG Inputs

The Cam and Crank (CNK) inputs are used to detect engine speed and angular
position relative to TDC. The CNK input can be connected to either a variable
reluctance magnetic pick-up sensor (VR-MPU) as shown in Figure 3-5, or to a
Hall-effect proximity switch as shown in Figure 3-6; however, each type of input
has dedicated connector pins. CNK input type is configured by software. Usage
of shielded wire for the speed sensor inputs is recommended but not absolutely
necessary. Make sure the shield has continuity the entire distance to the speed
sensor, and make sure the shield is insulated from all other conducting surfaces.
If shielded wire is not used, then twisted wire pairs would be the next best
alternative.

Both the CNK_DG and CAM_DG offer software-selectable 1 k pull-ups for use
with open collector Hall sensor types.

Figure 3-5. MPU Input Wiring Diagram

Figure 3-6. Hall-Effect Input Wiring Diagram

The CAM or CNK gear tooth pattern is used by the control to convert
pulses from the speed sensing device to engine rpm, and to obtain
engine angular position information (TDC and phasing). To prevent
possible serious injury from an overspeeding engine or improper
cylinder firing, make sure the control is properly programmed with
the correct gear pattern. Refer to the software manual for information
on gear-tooth pattern selection. Improper pattern selection could
cause engine damage.

The application software allows the programmer to select either VR mode or

Hall-effect mode for speed sensing. If VR mode is selected, the SECM70 control
utilizes an adaptive variable reluctance sensor amplifier that operates with a
positive-going threshold, which is derived by peak-detecting the input signal. If
Hall mode is selected, the application software allows the programmer to select
to either enable or disable a 1 kΩ pull-up resistor which can be used for open
collector type sensors. Tables 3-1 and 3-2 list the input circuit specifications.

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Parameter Specification
VR signal connected to SECM70 shall be
configured so that the + and – at SECM70
VR polarity
input results in a waveform with falling edge
and fast zero crossing.
Minimum signal amplitude (@ 24 Hz) 0.5 V peak
Cam less than ±1 crank angle degree.
Tooth center-to-center tolerance
Crank less than ±0.1 crank angle degree.
Tooth-to-tooth pulse peak amplitude variation Between 0.7 and 1.3
Amplitude maximum (overspeed condition with
90 V peak (180 V peak-to-peak)
minimum sensor gap)
Amplitude minimum (slow cranking condition
0.75 V peak (1.5 V peak-to-peak)
with maximum sensor gap)
Table 3-1. VR Input Specifications

The VR+/– are differential inputs with an offset of 2.5 V. The VR–
should not be grounded in the application or via test measurement
equipment.

Parameter Specification
Vil(min) = 1.6 V
Input Voltage Thresholds
Vih(max) = 3.7 V
Hysteresis VHYST (min) = 0.5 Vdc
1 k  1 % pull-up to VCC
Input impedance
(software controlled)
Anti-aliasing filter 1 pole at 20 s

Table 3-2. Digital Input Specifications

Transducer Power Outputs (XDRP)

The SECM70 control provides a +5 Vdc transducer power source for powering
external transducers. The transducer power output is protected against over-
voltage, over-temperature, short circuits, and reverse power. Figure 3-7 shows a
typical connection of the transducer output powering a transducer, with the
transducer signal feeding back to an analog input on the SECM70 control.

Figure 3-7. Transducer Output Power Wiring Diagram

Current
Output Voltage
Limit
XDRP 5V±2% 350 mA
Table 3-3. Transducer Output Specifications

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 Manual 26776 SECM70 Hardware Manual

The ADC reference voltage is VCC. For improved XDRP1-sourced

absolute analog input accuracy, it is recommended that the application
utilize the precision VCAL 2.5 V reference for compensation.

Analog Inputs (AN1—AN14)

There are 14 analog inputs on the SECM70. The analog inputs have either a
pull-up resistor as shown in Figure 3-8, or a pull-down resistor as shown in
Figure 3-9. All the analog inputs have a single-pole filter with a 1 ms time
constant except for AN7, which is reserved for a MAP (Manifold Absolute
Pressure) sensor and has a 0.24 ms time constant. Table 3-4 provides the pin-
out and configuration information for each of the analog inputs. Analog inputs are
protected for shorts up to 32 V.

Figure 3-8. Analog Input (with internal pull-up resistor) Wiring Diagram

Figure 3-9. Analog Input (with internal pull-down resistor) Wiring Diagram

Channel Connector RC (ms) Base Configuration Notes

Number Pinout
AN1 28 1 221 kpull-down
AN2 24 1 221 kpull-down
AN3 22 1 221 kpull-down
AN4 42 1 221 kpull-down 2.21 k pull-down for 1409/1459
AN5 43 1 4.75 kpull-down 2.21 k pull-down for 1409/1459
AN6 47 1 4.75 kpull-down Not populated for 1403/1453; 2.21 k
pull-down for 1409/1459
AN7 44 0.240 51.1 kpull-down 1 ms TC for 1409/1459
AN8 45 1 4.75 kpull-down 51.1 kpull-down for 1409/1459
AN9 39 1 2.21 kpull-up 1 kpull-up for 1409/1459
AN10 40 1 2.21 kpull-up 1 kpull-up for 1409/1459
AN11 41 1 2.21 kpull-up 1 kpull-up for 1409/1459
AN12 59 1 4.75 kpull-up 1 kpull-up for 1409/1459
AN13 60 1 4.75 kpull-up 2.21 kpull-up for 1409/1459
AN14 61 1 10 kpull-up Not populated for 1409/1459
XDRP Internal 0.33 Raw A/D reads 0.5 of voltage Tracks to 0.5% of VCC (micro ADC
reference)
KEYSW Internal 1.8 Raw A/D reads 0.116 of voltage
DRVP internal 1.7 Raw A/D reads 0.108 of voltage
Table 3-4. Analog Input Configuration

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Switch Inputs (SWG1—SWG4)

The switch inputs on the SECM70 can be used to monitor the state of a ground
referenced contact switch. Figure 3-10 shows how the discrete inputs are
connected when using a ground-referenced contact switch. The contacts may be
either normally open or normally closed. Table 3-5 shows the switch input
capabilities and characteristics. SWG4 is also the BOOT input pin which is used
to force the unit into boot mode during start-up.

Figure 3-10. Digital Input Wiring Diagram

Channel Connector RC

Type Thresholds Configuration
Number Pinout (ms)
1 kpull-up to VCC
SW1 25 Boolean 1.1
(w/blocking diode)
Vil(min) = 1.5 V
1 kpull-up to VCC
SW2 27 Boolean 1.1
(w/blocking diode)
Vih(max) = 3.5 V
1 kpull-up to VCC
SW3 29 Boolean 1.1
Vhyst(min) = 0.5 Vdc (w/blocking diode)
1 kpull-up to VCC
SW4/BOOT 26 Boolean 0.225
(w/blocking diode)

Table 3-5. Switch Input Characteristics & Capabilities

Digital Input (SPD)

The SPD on the SECM70 can be used to monitor the state of a ground-
referenced contact switch, measure the duty cycle of a PWM signal, or measure
the frequency of a Hall-effect proximity switch. Figure 3-11 shows how the
discrete inputs are connected when using a ground-referenced contact switch.
The contacts may be either normally open or normally closed. Note that
the SPD input function is not available on all models.

Figure 3-11. Digital Input Wiring Diagram

Channel Connector Max RC

Thresholds Configuration
Number Pinout Frequency (ms)
Vil(min) = 2.4 V
1 k  1 % pull-up to
SPD 33 0–10 kHz 0.016 Vih(max) = 2.6 V
VCC (SW-controlled)
Vhyst(min) = 0.8 Vdc

Table 3-6. Digital Input Characteristics & Capabilities

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HEGO Sensor Inputs

The SECM70 control has two HEGO (Heated Exhaust Gas Oxygen) inputs which
are single-ended. Table 3-7 shows the voltage transfer function for both HEGO
inputs, and Table 3-8 shows the fault diagnostic voltage states. LSO1 & LSO2
are reserved for heater control.

Figure 3-12. HEGO Sensor Wiring Diagram

VHEGO VADC
0 0.365
0.2 0.728
0.4 1.092
0.6 1.456
0.8 1.819
1 2.182
1.2 2.545

Table 3-7. HEGO Transfer Function

Diagnostics VADC
Short to GND 0.5
Open circuit 4.0
Short to Vbatt 5.0

Table 3-8. HEGO Fault Diagnostic States

Lambda Sensor Unit (UEGO) Inputs

The SECM70 control has one LSU (Lambda Sensor Unit), also known as UEGO
(Universal Exhaust Gas Oxygen) input, which will interface with either the Bosch
LSU4.9 or NTK wide range -sensors (Lambda sensors). The -sensor(s) work in
conjunction with the on-board ST L9780 ASIC to provide continuous regulation of
 for a sensor in the range of  = 0.65... (air). The LSU inputs allow the
SECM70 to continuously regulate the engine air-to-fuel ratio, thus controlling the
percentage of exhaust pollutants during the combustion process. Figure 3-13
shows the wiring diagram for the LSU mating connector to the SECM70 control.

It is highly recommended that the wires from the UEGO sensor(s) to

the SECM70 control be shielded to reduce the levels of EMI.

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SECM70 Hardware Manual Manual 26776

Figure 3-13. Lambda Sensor Unit Wiring Diagram

The application of the LSU sensor is complex. The sensor installation, heater
control, and reading of outputs need to follow the sensor manufacturer guidelines
to ensure accurate A/F ratio reading and protection of the sensor from shortened
life. Covering the detail requirements of the application of the LSU sensor is
outside the scope of this manual.

Knock Sensor Inputs

The SECM70 supports two Knock Sensor inputs. These differential inputs are
amplified prior to ADC sampling and then processed by the microcontrollers DSP
capabilities. Up to an 4th order IIR filter can be supported using the SPC563M64
decimation filter silicon for a minimal CPU bandwidth knock solution. The
SPC563M64 also supports DSP capability that will allow a software based
solution. This would allow a very feature-rich knock solution to be authored, but
at the expense of needing to consume more of the available CPU bandwidth.
Figure 3-14 shows the wiring for the knock inputs.

The knock inputs are differential inputs with an offset of 2.5 V. The
inputs should not be grounded in the application or via test
measurement equipment.

Figure 3-14. Knock Sensor Wiring Diagram

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Low-side Outputs (LSO1-LSO9)

The SECM70 control has 9 low-side outputs (LSOx) that can be used as Boolean
outputs for driving relays, or some as PWM outputs. LSO1 and LSO2 are also
designed to drive the heater coil on a HEGO or UEGO sensor. Some low-side
outputs are provided with freewheeling diodes (internal to the SECM70 through
DRVP) to suppress the back EMF caused by inductive loads. The MotoHawk
software provides diagnostics for open and short detection of the LSO loads
(refer to the SW manual or MotoHawk help files for specifics on the diagnostic
capabilities). Figures 3-15 through 3-17 show typical applications of the various
outputs to drive a load. Table 3-9 shows the low-side output capabilities,
characteristics and diagnostics.

LSO1 and LSO2 should not be operated above 100 Hz when driving
the heater coil of a Lambda Sensor Unit (LSU). Exceeding 100 Hz will
affect the accuracy of the LSU readings.

Figure 3-15. LSO3-LSO9 Output Wiring Diagram

LSOs that have a recirculation diode to DRVP must be used with a

load powered from DRVP.

Figure 3-16. LSO1 & LSO2 Output Wiring Diagram

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Open load Shorted

Drive Diode fault load fault
Function Pin Max current Current Sense
capability type diagnostic diagnostic
(driver off) (driver on)

63k – 350k
Boolean or 6 A peak, 3 A
LSO1 7 None No load (VBAT 3.0 – 15.5 A
PWM continuous
dependent)

63k – 350k
Boolean or 6 A peak, 3 A
LSO2 3 None No load (VBAT 8.7 – 24.4 A
PWM continuous
dependent)
63k – 350k
Boolean or 10 A peak, 5 To Low-side current
LSO3 4 load (VBAT 6.4 – 14.4 A
PWM A continuous DRVP scaled to 5A
dependent)
63k – 350k
Boolean or To
LSO4 5 10 A peak No load (VBAT 8.7 – 24.4 A
PWM DRVP
dependent)
63k – 350k
Boolean or To load (VBAT
LSO5 9 10 A peak No 8.7 – 24.4 A
PWM DRVP dependent)
Load current 63k – 350k
Boolean or To scaled to 6.4A load (VBAT
LSO6 10 10 A peak 8.7 – 24.4 A
PWM DRVP (1409/1459 dependent)
model only)
Load current 63k – 350k
Boolean or To scaled to 6.4A load (VBAT
LSO7 15 10 A peak 8.7 – 24.4 A
PWM DRVP (1409/1459 dependent)
model only)
63k – 350k
Boolean or 2A To load (VBAT
LSO8 20 No 3.0 – 15.5 A
PWM continuous DRVP dependent)
63k – 350k
Boolean or 2A To load (VBAT
LSO9 23 No 3.0 – 15.5 A
PWM continuous DRVP dependent)

Table 3-9. LSO Characteristics & Capabilities

Lamp Outputs (LAMP1-3)

Figure 3-17. LAMP Output Wiring Diagram

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Open load Shorted

Drive fault load fault
Function Pin Max current Pull-up Current Sense
capability diagnostic diagnostic
(driver off) (driver on)
Dependent
on analog
LAMP1 58 Boolean None No 1.7-3.5 A
threshold
calibration

Boolean or 4.75k to None due to

LAMP2/TACH 57 1A No 1.7-3.5 A
PWM DRVP pull-up

Dependent
Boolean or on analog
LAMP3 56 None No 1.7-3.5 A
PWM threshold
calibration

Table 3-10. LAMP Characteristics & Capabilities

Injector Outputs
The SECM70 control has 6 injector outputs with up to 4 capable of driving either
low or high impedance injectors. Each injector output can be used as a Boolean
output, a PWM output, or as a synchronous or periodic peak-and-hold injector
output. When configured as injector outputs, the SECM70 hardware is capable of
producing a peak-and-hold current waveform similar to that shown in Figure 3-18.

Figure 3-18. Injector Current Waveform

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SECM70 Hardware Manual Manual 26776

Figure 3-19. Injector Wiring Diagram

The peak-and-hold current levels are globally software configurable up to a

maximum of 7 A. The peak-hold injector current levels must be configured by the
application through the MotoHawk Peak/Hold Current Definition and Set blocks
before the injector drivers can be used in a peak/hold manner. See the
MotoHawk help files for specifics on these blocks.

The hardware in the SECM70 employs a switched mode architecture that

controls the actual sensed current against a target level. The Zener turnoff is
used at the end of injection to ensure rapid solenoid closure. Table 3-11 shows
the Injector output capabilities, characteristics, and diagnostics. The MotoHawk
software provides diagnostics for open or short detection of the injector loads.
Refer to the MotoHawk help files for specifics on diagnostic capabilities.

INJ4 hardware capability varies with model. The 1411/1461 model has 4
peak/hold capable injector drivers.

Open load Shorted

Drive Injection fault load fault
Function Pin
capability type diagnostic diagnostic
(driver off) (driver on)
Based on Based on
maximum minimum
INJ1 34
Peak/hold time to time to
INJ2 35 Boolean
(7 A peak reach peak reach peak
INJ3 1 or PWM
max) threshold threshold
INJ4 (PH) 18
(calibratible (calibratible
time) time)
INJ4 12 Saturated 63k – 350k
Boolean
INJ5 13 drive (1.4 A load (VBAT 3.0 – 15.5 A
or PWM dependent)
INJ6 14 max)

Table 3-11. Injector Driver Characteristics & Capabilities

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EST Outputs
The SECM70 has up to 8 Electronic Spark Trigger (EST) push/pull logic-level
outputs which are driven low when in an off state. Diagnostics are provided via
analog feedback during a software-initiated high impedance condition during the
off state. Diagnostic pull-up is a 33k to 5.6–6.2 V.

Shorted Load (to GND)

Drive Open Load Fault Diagnostic
Function Pin Max Current Fault Diagnostic (Driver
Capability (Driver Operating)
Operating)
EST1 6
EST2 8 Boolean
Based on EST analog Based on EST analog
EST3 11 or PWM
feedback diagnostic feedback diagnostic
EST4 21
5 mA threshold (calibratible) threshold (calibratible)
EST5 18/13* 0.75 V to
Default is 64 counts Default is 275 counts
EST6 19/14* 4.5 V (at
(1.344 V) (0.312 V)
EST7 13 5 mA)
EST8 14
* The 1751-6675/1751-6683 models use pins 13 & 14 as EST5 & EST6
respectively to keep the channels labeled sequentially.

Table 3-12. EST Driver Characteristics & Capabilities

H-bridge Outputs
The SECM70 control has up to two H-bridge outputs that can be used to drive
electric motors such as butterfly throttle valves. Both H-bridges provide unsigned
load current feedback. Table 3-13 shows the H-bridge output capabilities,
characteristics and diagnostics.

DRVP

Hx+
X

Load

Hx-
X

Figure 3-20. H-Bridge Wiring Diagram

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Open Load Fault Shorted Load

Drive Current
Function Pin Max Current Diagnostic (Driver Fault Diagnostic
Capability Sense
On) (Driver On)
Scaled for Application may
H1+ 51 Boolean 8 A peak, 4 A 10 A max diagnose based
8.5 – 38 A
H1- 52 or PWM average (unsigned) on current sense
feedback
Scaled for 5.4 – 7 A (low-
6 A max side short to
Application may
(unsigned) VBAT)
H2+ 34 Boolean 5 A peak, 2.5 A diagnose based
H2- 35 or PWM average on current sense
16 – 30 A (high-
feedback
side short to
GND)
Table 3-13. H-Bridge Characteristics & Capabilities

3-Phase BLDC Output

The SECM70 control can be populated with a 3-Phase driver capable of driving a
Brushless DC (BLDC) motor. This output is only available on the 1409/1459
models.

DRVP

3P-A
51

34
Load
3P-B
52
3P-C

Figure 3-21. 3-Phase Wiring Diagram

Open Load Fault Shorted Load

Drive
Function Pin Max Current Current Sense Diagnostic (Driver Fault Diagnostic
Capability
On) (Driver On)
Phase A &
Application may
3P-A 51 Phase B legs,
diagnose based
3P-B 34 PWM 3 A average scaled for 10 13 – 59 A
on current sense
3P-C 52 A max,
feedback
(unsigned)
Table 3-14. 3-Phase Characteristics & Capabilities

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CAN Communications Ports (CAN1+/–, CAN2+/–)

The SECM70 has two CAN ports for distributed I/O, distributed control, and HMI
(Human Machine Interface) purposes. Each port operates independently.
Communications are controlled via MotoHawk. Take care in the choice of
devices used on each network. HMI devices should generally not be put on
distributed control networks with real-time control requirements. The CAN port
assignments are provided in the application documentation.

The CAN ports on the SECM70 are not isolated from each other or from any of
the other circuitry on the SECM70 control, as they share a common ground. As
such, neither port should be used for communication off the engine. They are
designed for on-engine distributed control. The CAN network must be limited to
30 m or less wiring length between the two devices at the physical ends of the
network. This limit is further reduced to 25 m if 1000 kbps baud rate is used.

The SECM70 supports xCP, ISO15765, and SAE J1939 protocols for
transmitting data over the CAN lines. The physical wiring of the CAN ports must
conform to ISO 11898-2 (see Figure 3-22 for the CANbus topology).

Transceiver type CAN 2.0B

Internal ECM termination None
Isolation voltage None
Baud rates supported 125, 250, 500, and 1000 kbps
Protocols supported xCP, ISO15765, SAE J1939

Table 3-15. CAN Specification

Node 1 Node 2 Node n

CAN_H

 
CAN_L

Figure 3-22. CANbus Topology

Per ISO 11898-2, the two-wire CANbus must meet the following criteria:
 A maximum length of 25 m for 1 Mbit/s data rate, 40 m for 250 kbits/s.
 A recommended maximum drop line length of 0 m for 1 Mbit/s data rate, 1 m
at 250 kbits/s.
 Characteristic line impedance of 121 Ω.
 Nominal line resistance of 70 mΩm.
 Nominal specific propagation delay of 5 ns/m.

SAE J1939 protocol is restricted to 250 kbps and the SAE J1939 standard limits
wiring distances to 40 m, when un-isolated controls are connected on the link.

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Termination
It is necessary to terminate the network to prevent interference caused by signal
reflections. Depending on network length, many CAN networks will not operate
without proper termination.

As a rule, no matter how many units are on a network, there should never be
more than two network terminations installed. Termination resistors must be
installed only for the two units that are at the physical ends of the network.
Terminating more than two units can overload the network and stop all
communications.

Termination is a simple 121 Ω, 0.25 W, 1 % metal film resistor placed between

CAN high and CAN low terminals at the two end units, a differential termination.
Do not connect the termination resistor to anything besides the CAN high and
CAN low wires.

Shielding
Shielded CAN cable is not required between the SECM70 and any other
device(s), but it is highly recommended. Unshielded or improperly shielded
cables are likely to cause communication problems and unreliable control
operation. Improper shield termination to ground can also cause communication
problems and unreliable control operation.

If shielding is used with the SECM70 CAN wiring, the shield should be tied only
at the SECM70 control transducer ground pins (XDRG1 on C-E4, or XDRG2 on
A-H2). If the shield is grounded at the other end, it should be through a high-
frequency AC ground (via a 0.01 μF capacitor to chassis-body ground).

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Manual 26776 SECM70 Hardware Manual

Chapter 4.
Product Service Options

The SECM70 has no operator-serviceable parts.

To prevent damage to electronic components caused by improper

handling, read and observe the precautions in Woodward manual
82715, Guide for Handling and Protection of Electronic Controls,
Printed Circuit Boards, and Modules.

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