Curriculum of B.

Tech Programme in Electronics and VLSI Engineering to be

applicable from 2023 batch onwards

CURRICULUM

3rd – 8th Semester July 2023 admission onwards

B. TECH. in Electronics and VLSI Engineering

DEPARTMENT OF ELECTRONICS AND COMMUNICATION

ENGINEERING

Dr B R AMBEDKAR NATIONAL INSTITUTE OF

TECHNOLOGY, Jalandhar

Phone: 0181-2690301, 02 (Ext. 2101, 2104), Fax: 0181-2690932

Website: www.nitj.ac.in

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 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

VISION

To become a globally recognized department of higher learning that

will provide inter-disciplinary knowledge, human values and
professional ethics among the youth, so as to serve as a valuable
resource for industry and society.

MISSION

“Educate to Excel in Social Transformation”

To serve the nation and the world by graduating proficient,

knowledgeable engineers in the field of Electronics, Communication
and related areas through constant interaction with research
organizations and industries.
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

Program Educational Objectives

PEO 1. To provide strong background in basic sciences, mathematics, computing and

engineering principles
PEO 2. To impart in-depth knowledge to students related to core areas of Electronics
and Communication Engineering so as to comprehend, analyze, design, and create novel
products and solutions for real life problems
PEO 3. To provide students with an academic environment to promote teamwork,
ethics, multidisciplinary approach and lifelong learning required for a successful professional
career

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 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

a Program Outcomes

1. Apply knowledge of mathematics, science, and engineering fundamentals in the domain

of Electronics and Communication
2. Potential to analyze an engineering problem and formulate its appropriate solution
3. Ability to design systems and processes that meet the requirements of public safety and
offer solutions for societal and environmental issues
4. Ability to formulate and analyze complex engineering problems by using mathematical
principles and engineering fundamentals
5. Select appropriate techniques and modern automation tools for the system design and
analysis
6. Understanding the contemporary issues and the impact of engineering solutions on the
society
7. Skills to develop environment friendly and sustainable solutions
8. Understanding and commitment towards professional ethics, responsibilities and norms
of engineering practices so as to become good citizens
9. Ability to function effectively, individually and in a team
10. Proficiency in communication, both verbal and written forms, which will enable them
to compete globally
11. Recognize the need for and have the ability to engage in independent and lifelong
learning and hence participate and succeed in competitive examinations, higher studies etc.
12. Willingness and ability to take up administrative responsibilities involving both project
and financial management confidently
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

Program Specific Outcomes

PSO1: Analyse, design and create solutions for the real world problems using knowledge
gained in the field of Electronics and VLSI engineering.

PSO2: Develop innovative technologies, communication systems, and VLSI designs for
advancing and transforming nation's capabilities.

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Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
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 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

3rd Semester

Contact
Course Code Course Title L T P Credits
Hours

Electromagnetic Field
1. ECDC0201 Theory and Transmission 3 1 0 4 4
Lines

Electronic Devices and

2. ECDC0203 Circuits with Product 3 0 0 3 3
Design

3. ECDC0205 Digital Electronics 3 0 0 3 3

4. ECDC0207 Signals and Systems 3 1 0 4 4

Analog and Digital

5. ECDC0211 3 0 0 3 3
Communication

Data Structures and

6. CSDC0201 3 0 0 3 3
algorithms

7. CSDC0261 Data Structures Laboratory 0 0 2 1 2

Electronic Devices and

8. ECDC0233 0 0 2 1 2
Circuits Laboratory

Digital Electronics
9. ECDC0235 0 0 2 1 2
Laboratory

TOTAL 23 26

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 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

Sr. Course
Course Title L T P Credits Contact Hours
No. Code

Data Base Management

1. CSDC0202 3 0 0 3 3
System

2. ECDC0204 Analog Integrated Circuits 3 0 0 3 3

3. ECDC0212 Low Power VLSI Design 2 0 0 2 2

4. ECDC0208 VLSI Circuit Design 3 0 0 3 3

Computer Organization
5. ECDC0216 3 0 0 3 3
and System Architecture

Analog Integrated Circuits

6. ECDC0234 0 0 2 1 2
Laboratory

Analog and Digital

7. ECDC0236 0 0 2 1 2
Communication Laboratory

8. ECDC0238 VLSI Laboratory I 0 0 2 1 2

Data Base Management

9. CSDC0232 0 0 2 1 2
System Laboratory

Universal Human Values

10. ECFE 2 0 0 1 1
FE-3

TOTAL 19 23

4th Semester
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

5th Semester

Sr.
Contact
No Course Code Course Title L T P Credits
Hours
.

1. ECDC0311 CMOS Analog IC Design 3 0 0 3 3

Advanced Microprocessor
2. ECDC0303 3 0 0 3 3
and Peripherals

Data Communication
3. ECDC0305 Networks and Internet of 3 0 0 3 3
Things

4. ECDC0307 Digital Signal Processing 3 1 0 4 4

5. ECDC0313 IC Technology 2 0 0 2 2

6. ECDEXXXX Elective 1 3 0 0 3 3

7. ECDC0339 VLSI Laboratory-II 0 0 2 1 2

Advanced Microprocessor
8. ECDC0333 0 0 2 1 2
and Peripherals Laboratory

Data Communication
9. ECDC0335 Networks and IoT 0 0 2 1 2
Laboratory

Digital Signal Processing

10. ECDC0337 0 0 2 1 2
Laboratory

11. Project 1 (Phase-I) 0 0 4 2 4

12. Industrial training 2

TOTAL 26 30

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 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

6th Semester a

Sr. Contact
Course Code Course Title L T P Credits
No. Hours

1. ECDC0312 VLSI Testing 3 0 0 3 3

2. ECDC0304 Digital Design with HDL 3 0 0 3 3

3. ECDC0306 Control Systems 3 0 0 3 3

RF Circuits and Antenna

4. ECDC0314 3 0 0 3 3
Design

Semiconductor Device
5. ECDC0310 2 0 0 2 2
Characterizations

6. ECDEXXXX Elective-2 3 0 0 3 3

Semiconductor Device
7. ECDC0342 Characterizations 0 0 2 1 2
Laboratory

Digital Design with HDL

8. ECDC0334 0 0 2 1 2
Laboratory

Quantum Device and

9. ECDC0340 0 0 2 1 2
Fabrication Laboratory

10. Project 1(Phase II) 0 0 4 2 4

TOTAL 22 27
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

7th Semester

Sr. Contact
Course Code Course Title L T P Credits
No. Hours

1. ECDEXXXX Elective 3 3 0 0 3 3

2. ECDEXXXX Elective 4 3 0 0 3 3

3. ECDEXXXX Elective 5 3 0 0 3 3

Training (during summer - - - 3 -

4.
break)

5. Project 0 0 8 4 12

TOTAL 16 21

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 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

8th Semester

Sr. Contact
Course Code Course Title L T P Credits
No. Hours

1. ECDEXXXX Elective 6 3 0 0 3 3

2. ECDEXXXX Elective 7 3 0 0 3 3

3. ECDEXXXX Elective 8 3 0 0 3 3

4. Project 0 0 8 4 12

TOTAL 13 21
Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

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Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
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rd
3 Semester
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECDC0201 Electromagnetic Field Theory and Transmission Lines [3 1 0 4]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO PSO1 PS
12 O2

CO1 ● ● ● ●

CO2 ● ● ● ●

CO3 ● ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ● ●

Course Outcomes
CO1: Understand the concept of electrostatics and magnetostatics
CO2: Analyze the concepts of electromagnetic wave propagation.
CO3: Design and predict the properties of transmission lines for various applications
CO4: Design and calculate the properties of wave guides.

Course Content
Coordinate systems - Review of vector algebra, Coordinate Systems - Cartesian, Cylindrical and
spherical systems. (3)
Electrostatics and Magnetostatics: Application of Gauss Law, Boundary conditions, Poisson’s and
Laplace’s equations in various coordinate systems, Electrostatic uniqueness theorem, Electric vector
potential. Introduction to Ampere’s Law, Magnetic Boundary conditions, Magnetic vector potential.(7)
Maxwell’s equations: Faraday’s Law, Displacement Current, Maxwell’s equations in differential,
integral and Phasor form and their physical interpretations. (8)
Electromagnetic Waves: TEM, Derivation of the wave equation and their general solution, plane
waves in unbounded media, wave propagation in lossless and conducting medium, skin depth, reflection
and refraction of plane waves, Poynting’s theorem, Instantaneous, Average and complex Poynting
vector, wave polarization. (12)
Transmission Lines:Distributed parameters, Transmission Line Equations, Input impedance, Lossless
propagation, Line distortion and attenuation, line termination, impedance matching, standing wave ratio,
Smith Chart. (10)

Recommended Books
1. W H Hayt and Buck J A, “Engineering Electromagnetics,” McGraw-Hill Education (India)
Pvt. Ltd. (2006)
2. Matthew N. O. Sadiku, “Principles of Electromagnetics,” Oxford University Press (2009).
3. R. K. Shevgaonkar, “Electromagnetic Waves,” McGraw Hill Higher Ed., 2005.
4. Constantine A. Balanis, “Advanced Engineering Electromagnetics,” Wiley India Pvt. Ltd.
(2008).
5. Jordon E C and Balmain K G, “Electromagnetic waves and Radiating System”, 2nd Ed.,

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 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

a Delhi (1993).
Prentice Hall, New
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECDC0203 Electronic Devices and Circuits with product design [3 0 0 3]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO PO1 PSO PSO
11 2 1 2
CO1 ● ● ● ● ● ●

CO2 ● ● ● ● ●

CO3 ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ●

Course Outcomes
CO1: Understand the concepts semiconductor materials.
CO2: Understanding about the construction and operation of various electronic
devices (diode, BJT,FETs)
CO3: Analyze concepts, operations and application related to different electronic
circuits andanalysis.
CO4: Understanding consolidates and upgrades their application knowledge to
improve theireffectiveness in electronic devices and circuits.
Course Content
Semiconductor Diodes: PN junction Diode - VI characteristics, qualitative and quantitative
analysisof its behavior, Diode resistance, Transition capacitance and Diffusion capacitance,
clippers,clampers, Special purpose diodes - Zener diode, junction diode. (6)
Bipolar Junction Transistor: Transistor current components, Transistor as an amplifier,
Amplifiertypes- CE, CB, CC and their characteristics, small signal low frequency transistor
model: Hybridmodel of BJT, Analysis of amplifier using Hybrid model of BJT, Transistor at
high frequency andhybrid pi-model. (6)
Transistor Biasing and Stabilization: DC operating point, DC Biasing circuits-fixed bias, emitter
bias, voltage divider bias, voltage feedback, Bias stability, Stabilization against variation in Ico,
VBE and β, Bias compensation. (6)
Multistage and Feedback Amplifiers: Amplifier frequency response-low frequency range and high
frequency, Frequency response of multistage amplifiers, various coupling methods for multistage
amplifiers, Feedback concept, oscillator. (6)
Field-Effect Transistor: The junction FET - construction, operation, characteristics, parameters,
Biasing of JFET, Small signal analysis of JFET as an amplifier- common source and common
drain amplifiers. (6)
Metal Oxide Semiconductor FET: MOSFET- construction, operation, characteristics, parameters,
CMOS devices, CMOS inverter characteristics, metal semiconductor, Novel semiconductor
deviceand materials. (6)
Product Design Principles: Basics of PCB design and layout, Overview of product design principles
and methodologies. Understanding user needs and requirements, Techniques for concept
generation, and ideation in product design. (4)

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 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
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a
Recommended Books
1. Millman, Jacob, Halkias Christos C and Satyabratajit, “Electronic Devices and Circuits” 3rd
edition, Tata McGraw- Hill, New Delhi, 2010.
2. Boylestad Nashelsky, “Electronic Devices and Circuit Theory” 8th edition,Pearson Education,
2004.
3. Sedra, Smith, “Microelectronic Circuits,” Oxford University, 8th edition.
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECDC0207 Signals and Systems [3 1 0 4]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12 PSO1 PSO2

CO1 ● ● ● ●

CO2 ● ● ●

CO3 ● ● ● ● ●

CO4 ● ● ● ●

Course Outcomes
CO1: Identify the characteristics and classifications of signals and systems, including continuous time
signals, discrete time signals, periodic signals, deterministic and random signals, energy and power
signals, static and dynamic systems, linear and nonlinear systems, and time-invariant and time-variant
systems.
CO2: Analyze continuous and discrete time signals using Fourier series and Fourier transform, and
apply these tools to real-world applications.
CO3: Apply Laplace transform techniques to analyze R-L-C circuits and solve related problems.
CO4: Apply Z-transform techniques in analyzing discrete time systems and solving related problems.
Course Content
Section 1:
Classification of Signals and Systems: Continuous time signals (CT signals) - Discrete time signals
(DT signals) - Step, Ramp, Pulse, Impulse, Sinusoidal, Exponential, Classification of CT and DT signals
- Periodic & Aperiodic signals, Deterministic & Random signals, Energy & Power signals - CT systems
and DT systems- Classification of systems – Static & Dynamic, Linear & Nonlinear, Time-variant &
Time-invariant, Causal & Non-causal, Stable & Unstable. (4)
Linear Time-Invariant Systems:
Convolution of Discrete Time LTI System, Representation of Continuous Time Signal in terms of
impulses, Convolution of Continuous Time Signals (5)
Section 2:
Analysis of Continuous Time Signals: Fourier Series and its properties, Fourier transform and its
properties along with applications, Continuous Time Fourier Series and Continuous Time Fourier
Transform. (8)
Section 3:
Analysis of Discrete Time Signals: Fourier Series and its properties, Fourier transform and its
properties along with applications, Discrete Time Fourier Series and Fourier Transform (8)
Section 4:
Laplace Transform: Introduction, Region of Convergence, Laplace integral, Laplace transform of
periodic functions, Applications of Laplace transform to R-L-C circuits. (8)
Section 5:
Z-transform: Z transform, Region of convergence, Properties of Z-transform, Inverse Z-transform (7)

Recommended Books
1. Oppenheim, “Signals and Systems” 2nd Indian edition, 2015
2. B P Lathi, “Digital and Analog Communication Systems” 4th edition, 2011.
3. K. Goplalan, “Signals and Systems” 3rd editions, 2011
4. Ravi Kumar , “ Signals and Systems” 2nd edition, PHI learning, 2009.
5. Simon Haykin , “Signals and Systems” 2nd edition, Wiley, 2008.

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 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECDC0211 Analog and Digital Communication [3 0 0 3]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12 PSO1 PSO2

CO1 ● ● ● ● ●

CO2 ● ● ● ●

CO3 ● ● ● ● ●

CO4 ● ● ● ●

Course Outcomes
CO1: Define the elements of analog communication including AM, DSBSC, SSB, and VSB.
CO2: Analyse the line coding formats and pulse code modulation formats.
CO3: Analyse the performance of baseband and passband digital communication systems in terms of
error rate and spectral efficiency
CO4: Evaluate the error performance of digital communication systems in presence of noise and other
interferences
Course Content
Section 1:
Analog Communication: Elements of Analog communication, AM, DSBSC, SSB, Time and
frequency domain representations, Bandwidth and power calculations, Frequency and Phase
modulation, Direct and Indirect method of generation of FM, Narrowband and wideband FM (8)
Section 2:
Introduction to Digital Communication: Block Diagram of Digital Communication System,
Advantages of Digital communication system over Analog communication systems, Sampling theorem,
Signal reconstruction in time domain, Aliasing Problem, Uniform and Non-uniform quantization.
Signal to Quantization ratio of Quantized Signal. (4)
Section 3:
Baseband Transmission: Line Coding & its properties, various types of PCM waveforms. Attributes
of PCM waveforms, M-ary Pulse Modulation waveforms, Differential pulse code modulation,
Multiplexing PCM signals, Delta modulation, Idling noise and slope overload, Adaptive delta
modulation, Adaptive DPCM, Comparison of PCM and DM. (7)
Section 4:
Band-pass modulation and demodulation: Types of digital modulation, Waveforms for Amplitude,
Frequency and Phase Shift Keying, Method of generation and detection of coherent & non-coherent
binary ASK, FSK & PSK, Differential phase shift keying, Quadrature modulation techniques, M-ary
FSK, Minimum Shift Keying (MSK), Probability of error and comparison of various digital modulation
techniques. (9)
Section 5:
Random Signal Theory: Introduction to Probability Theory, Definition of Probability of Random
Events. Joint and Conditional Probability, Probability Mass Function, Statistical Averages. Probability
Density Functions (PDF) and Statistical Averages, mean, median, mode moments and expectations,
standard deviation and variance. Probability distribution models: Uniform, Gaussian, Binomial,
Poisson, exponential, normal Examples of PDF, Transformation of Random Variables. Random
Processes, Stationary and Ergodicity. (8)
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

Probability of error calculations and Information Theory:Calculation of bit error probability of

BPSK and BFSK, Error probability for QPSK. Error free communication over a noisy channel, Channel
capacity theorem. (4)

Recommended Books
1. George Kennedy, “ Electronic Communication Systems,”5th Edition (2011)
2. Simon Haykin, “Communication Systems”, Wiley publication, 4th Edition (2004).
3. Bernard Sklar “Digital Communication-Fundamentals and Applications”, Pearson Education
India, 2nd Edition (2009)
4. George R Cooper, “Probabilistic methods of Signals and System Analysis” 3rd edition, 2010
5. John Proakis “Digital Communications”, Tata Mc Graw Hill, 5th Edition (2007).
6. Wayne Tomsi, “Electronic Communication Systems, Fundamentals Through Advanced”,
Pearson Education, 4th Edition, (2001).

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 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

a
ECDC0205 Digital Electronics [3 0 0 3]

PO PO PO PO PO PO PO PO PO PO PO PO PS PS
1 2 3 4 5 6 7 8 9 10 11 12 O1 O2

CO1 ● ● ● ●

CO2 ● ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ●

Course Outcomes
CO1: Demonstrate a comprehensive understanding of fundamental concepts in digital electronics,
including number systems, binary arithmetic, Boolean algebra, and logic gates.
CO2: Acquire the skills to design, analyze, and optimize the combinational circuits.
CO3: Gain proficiency in designing sequential systems using flip-flops, counters and shift registers.
CO4: Create integrated digital systems by designing circuits that incorporate memory elements
(ROM, RAM), digital-to-analog converters, and analog-to-digital converters and differentiate
various digital logic families.

Course Content
Section 1-Number Systems and Boolean Algebra: Review of Number systems, Radix conversion,
Subtraction using 1’s & 2’s complements and using 9’s &10’s complements, Binary codes, Error
detecting and Correcting codes, Hamming Code, Theorems of Boolean algebra, Canonical forms, Logic
gates. (8)
Section 2- Combinational Circuits: Representation of logic functions, Simplification using Karnaugh
map, Tabulation method, Implementation of combinational logic using standard logic gates, Adders,
Subtractors, Multiplexers, Demultiplexers, Encoders, Decoders, Code Converters, Parity Generator &
Checker and Magnitude Comparator. (10) Section 3-
Sequential Circuits: Flip flops - SR, JK, D and T flip flops - Level triggering and edge triggering,
Excitation tables - Counters - Asynchronous and synchronous type Modulo counters, Shift registers,
type of registers, circuit diagrams. (8)
Section 4 - Digital Logic Families and A/D and D/A converters: Introduction to Logic families:
TTL, ECL and MOS Logic families: NMOS, PMOS, CMOS, Details of TTL logic family - Totem pole,
open collector outputs, TTL subfamilies, Comparison of different logic families. Weighted resistor type
D/A Converter, Binary ladder D/A converter, Steady state accuracy test, D/A accuracy and resolution,
Parallel A/D Converter, counter type A/D converter, Successive approximation A/D converter, Single
and Dual Slope A/D converter, A/D accuracy and resolution. (8)
Section 5- Semiconductor Memories: Memory organization, Classification, and characteristics of
memories, ROMs, RAM memories, Content Addressable Memories, Charged-Coupled Device
Memory, Magnetic Core/Film Memory, PLDs- PLA and PAL. (6)
Recommended Books
1. Mano M. Morris, “Digital Design”, Pearson Education, 3rd edition, 2006.
2. Jain R. P., “Modern Digital Electronics”, Tata McGraw-Hill, 3rd edition, 2003.
3. Malvino and Leach, “Digital principles and Applications”, Tata McGraw Hill, 5th edition,
2003.
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

4. James W. Bignell and Robert Donovan, “Digital Electronics”, Delmar Publishers, 5th edition,
2007.
5. Flecther, “An Engineering Approach to Digital Design”, PHI, 1st edition 2009.
6. Tocci Ronald J., “Digital Systems-Principles and Applications”, PHI, 10th edition, 2009.

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 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

CSDC0201 a Data Structures and Algorithms [3 0 0 3]

PO PO PO PO PO PO PO PO PO PO PO PO PS PS
1 2 3 4 5 6 7 8 9 10 11 12 O1 O2

CO1 ● ● ● ● ● ● ●

CO2 ● ● ● ● ●

CO3 ● ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ●

Course Outcomes
CO1. Understand the concepts of data structures, algorithm and analyse their time complexity. Apply
sequential data structures e.g. Array and Linked list to solve basic problems.

CO2. Apply and analyze stack and queue data structures to solve practical problems in real-life
scenarios.

CO3. Apply variety of data structures, including trees, and graphs to address diverse and complex real-
time computing problems.

CO4: Evaluate different sorting algorithms and their applicability in various contexts. Assess and select
suitable data structures for specific applications, particularly those involving string matching.

Course Content
Unit 1: Introduction to Data Structures and Complexity Analysis: Overview of data structures,
algorithms, Asymptotic notations (Big O, Omega, Theta), Time and space complexity analysis, Best,
average, and worst-case analysis, Time space tradeoff, Abstract Data types.

Unit 2: Linear data Structures

Arrays: Introduction to single and multidimensional arrays, Representation in memory and address
calculation, Implementing basic algorithms on 1D array (insertion, deletion, searching, traversal),
Implementing basic algorithms on Matrix (Addition, Subtraction, Multiplication, Transpose), Character
string and sparse matrix.

Linked List: Representation and Implementation of Singly Linked Lists, Two-way Header List,
Traversing and Searching of Linked List, Overflow and Underflow, Insertion and deletion Algorithms,
Doubly linked list, Linked List in Array, Polynomial representation and addition, Generalized linked
list, Circular linked list, Garbage Collection and Compaction.
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

Stacks: Basic terminology, Implementing stack using arrays and linked lists, Implement basic
operations on stack (create, push, pop, full, empty), Applications of stacks, expression evaluation (prefix
and postfix), Conversion of Infix to prefix and Postfix Expressions.

Queue: Basic terminology, Implementing queue using arrays and linked lists, Implement basic
operations on queue (create, insert, delete, full, empty), Priority Queue, Circular Queue.

Unit 3: Non linear Data Structures

Introduction to Tree: Basic terminology, Array and linked representation of binary tree, Binary tree
traversal (in-order, pre-order, post-order), Threaded Binary Tree, Huffman algorithm, Binary search
trees (BST), Insertion and Deletion in BST, balanced BST-AVL tree, Red Black tree, B/B+ Tree
(Insertion, Deletion).

Introduction to graphs: Terminology and representation of graphs (adjacency matrix, adjacency list),
Multigraph, Directed Graph, Traversals - Depth-First Search (DFS) and Breadth-First Search (BFS),
Minimum Spanning Tree (Prim's, Kruskal's), Shortest path algorithm.

Unit 4: Hashing and Heap

HASH Table, Hash Functions, Collision Resolution Strategies, Hash Table Implementation, heap-based
implementations (Min, Max)
Unit 5: Strings Searching, Sorting and Matching:
Searching and Sorting: Sequential Search, Binary Search, Comparison and Analysis Internal Sorting:
Insertion Sort, Selection, Bubble Sort, Quick Sort, T w o W a y Merge Sort, Heap Sort, Radix Sort,
Practical consideration for Internal sorting
Strings: Overview of strings and String Matching Algorithms (Knuth Morris Pratt, Rabin Karp, Boyer
Moore)

Recommended Books
1. Thomas H. Cormen, Charles E. Leiserson, Ronald L. Rivest, and Clifford Stein. “Introduction to
Algorithms”. The MIT Press, 4th Edition, 2022.

2. Aaron M. Tenenbaum, Yedidyah Langsam, Moshe J. Augenstein, “Data Structures using C”, Pearson
Education, 1st Edition, 2019.

3. Behrouz A. Forouzan/Richard F. Gilberg, “C Programming and Data Structures”, Cengage Learning

India Pvt. Ltd., 3rd Edition, 2022.

4. Ellis Horowitz and Sartaj Sahani, “Fundamentals of data Structures in C++”, Universities Press, 2 nd
Edition, 2008.

5. Seymour Lipschutz, “Data Structures”, Mc Graw Hill, 2nd Edition, 2014.

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 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

CSDC0261 a Data Structures Laboratory [0 0 2 1]

PO PO PO PO PO PO PO PO PO PO PO PO1 PSO PSO

1 2 3 4 5 6 7 8 9 10 11 2 1 2

CO1 ● ● ● ● ● ● ● ●

CO2 ● ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ●

Course Outcomes
CO1. Apply sequential data structures e.g. Array and Linked list to solve basic problems.
CO2. Apply and analyze stack and queue data structures to solve practical problems in real-life
scenarios.
CO3. Apply variety of data structures, including trees, and graphs to address diverse and complex real-
time computing problems.
CO4: Evaluate different sorting algorithms and their applicability in various contexts. Assess and select
suitable data structures for specific applications.

List of Experiments
1. Write a program to implement basic operations on 1D array e.g. Insertion, Deletion, Traversal,
and Searching.
2. Write a program to implement basic operations on 2D array/ Matrix e.g. Addition, Subtraction,
Multiplication, Transpose.
3. Write a program using dynamic variable & pointers to implement insertion and deletion
operation on a singly linked list consisting of the following information in each node. Student
id (integer), student name (character string) & semester (integer).
4. Write a program to implement basic operations on doubly Linked List e.g. Insertion, Deletion,
Traversal, and Searching.
5. Write a program to implement push, pop, and display operations on stack of integers. The
program should print appropriate messages for stack overflow, stack Underflow & stack empty.
6. Write a C program to evaluate a valid postfix expression using a Stack, assume that the suffix
/postfix expression is read as a single line consisting of non-negative single digit operands &
binary arithmetic operands. The arithmetic operators are + (ADD), - (subtract), *(multiply) & /
(divide).
7. Implementation of queue data structure using array and linked list with the basic functions of
Create(), IsEmpty(), Insert(), Delete() and IsFull().
8. Write a program to construct a binary search tree of integers and traverse the tree using all the
methods i.e. inorder, preorder & Postorder to display the elements in the tree.
9. Write a program to implement Breadth-First Search (BFS) and Depth-First Search (DFS)
algorithms.
10. Implementation of Kruskal and Prims Minimal Spanning Tree algorithms.
11. Write a modified version of DFS algorithm to print all the connected components of a graph.
12. Write a program to sort a list of N integers using the merge sort, quick sort, and insertion sort,
Heap sort algorithm.
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECDC0233 Electronic Devices and Circuits Laboratory [0 0 2 1]

PO PO PO PO PO PO PO PO PO PO PO PO1 PSO PSO

1 2 3 4 5 6 7 8 9 10 11 2 1 2

CO1 ● ● ● ● ●

CO2 ● ● ● ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ●

Course Outcomes
After completion of this laboratory course, the students will have ability to:
CO1: To identify and use basic electronic components and electronic equipment such as multimeter,
oscilloscope, power-supply, Signal generator for measuring and testing electronic circuits
CO2: Demonstrate the working of semiconductor devices in different electronic circuits
CO3: Evaluate different performance parameters of semiconductor devices and various electronics
circuits
CO4: Build the electronic circuits on breadboard and SPICE simulator, and carry out different types
of analyses

List of Experiments
Section 1: Familiarization with Electronic Components and Equipment
1. Getting familiar with various active and passive components, colour coding of resistors, bread-
board, general purpose electronic test equipment: Multimeter, Oscilloscope, Power-supply,
Signal Generator.
2. Learn about PCB Fabrication Techniques, To practice soldering and desoldering
Section 2: Diodes and their circuit applications
3. Plot the VI characteristics of PN junction diode in forward and reverse bias, and find its static
and dynamic resistance.
4. Investigate the applications of diodes in (i) Clipping (ii) Clamping
5. Plot input and output waveforms of a Bridge Rectifier with filter, and find ripple factor and %
age regulation experimentally.
Section 3: Transistors
1. Plot input and output characteristics of Common Emitter BJT and compute h-parameters
graphically, and plot Load line.
2. Study bipolar transistor as (i) switch (ii) amplifier.
3. Plot drain and transfer characteristics of JFET, and compute transconductance (gm)
graphically.
4. Study Common Source JFET amplifier, compute cut-off frequencies and bandwidth
graphically.
Section 4: Amplifiers and Oscillators
5. Study Common Emitter amplifier circuit, plot their frequency response characteristics, and
calculate bandwidth graphically.
6. Study Common Collector-Emitter follower configuration using Darlington pair, compute gain
and input impedance.

27
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

7. Study an RCa phase shift oscillator and compute its feedback gain β, and frequency of
oscillations, and compare with the theoretical values.
8. Study Class B Push Pull Power Amplifiers and compute gain and efficiency.
Section 5: Network Theorems
9. Verify Thevenin Theorem and Norton Theorem for a given network.
10. Verify Superposition and Maximum Power Transfer Theorems for a given network.

Experimentation to be supported by simulations through SPICE simulator.

 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECDC0235 Digital Electronics Laboratory [0 0 2 1]

PO PO PO PO PO PO PO PO PO PO PO PO PS PS
1 2 3 4 5 6 7 8 9 10 11 12 O1 O2

CO1 ● ● ● ● ●

CO2 ● ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ●

Course Outcomes
CO1: Ability to test all logic gates and NAND/NOR as universal gates
CO2: Construct basic combinational circuits and verify their functionalities
CO3: Apply the design procedures to design basic sequential circuits
CO4: Familiarization with simple CAD tool

List of Experiments
1. Verification of truth tables of logic gates -OR, AND, NOT, NAND, NOR and Ex-OR.
2. Verification of NAND and NOR as universal gates.
3. Design and verification of the truth tables of Half and Full adder circuits.
4. Design and verification of the truth tables of Half and Full subtractor circuits.
5. Design and implementation of 4-bit binary Adder/ Subtractor and BCD adder using IC7483.
6. Design and implementation of code converters using logic gates (i) BCD to excess-3 code (ii)
Binary to gray code.
7. Verification of the truth table of the Multiplexer using IC 74150 and De-Multiplexer using IC
74154.
8. Verify the truth table of decoder driver 7447/7448. Hence operate a 7 segment LED display
through a counter using a low frequency clock.
9. Design and test of an SR flip-flop using NOR/NAND gates.
10. Verify the truth table of a D flip-flop (7474) and JK flip-flop (7476).
11. Design and implementation of 3-bit synchronous up/down counter.
12. Operate the counters 7490, 7493. Verify the frequency division at each stage and with a low
frequency clock (say 1 Hz) display the count on LEDs.
13. Operate the universal shift register using IC 74194.
14. Design and test D/A converter using R-2R Ladder Network.
Experimentation to be supported by computer simulations on SPICE simulator.

29
Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

th
4 Semester
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECDC0204 Analog Integrated Circuits [3 0 0 3]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO1 PO1 PO1 PS PS
0 1 2 O1 O2

CO1 ● ● ● ● ●

CO2 ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ●

Course Outcomes
CO1: Understanding of various configurations of differential amplifiers including their DC and AC
analysis. Also recall the performance parameters of an ideal Op-Amp, and understand the
operational principles of open-loop configurations.
CO2: Analyze the behaviour of practical Op-Amp characteristics and various feedback configurations
using Op-Amps, such as voltage-series and voltage-shunt feedback amplifiers.
CO3: Create and design Op-Amp applications, including amplifiers, summing and scaling circuits,
differentiators and integrators and active filter designs, and understand oscillator structures also.
CO4: Evaluate the operating principles and applications of specialized ICs like phase-locked loops,
voltage regulators, and the 555 Timer.
Course Content
Section 1- Differential amplifiers: Introduction, Differential Amplifier configurations– Dual Input-
Balanced output, Dual Input-Unbalanced output, Single Input-Balanced output, Single Input-
Unbalanced output Differential amplifier with their DC and AC analysis, Differential amplifier using
FET, Differential amplifier with swamping resistors, Constant current bias, Current mirror, Cascaded
differential amplifier Stages, Level Translator, Cascode amplifier. (8)
Section 2- Introduction to Op-amps: Block diagram of a typical Op-Amp, Schematic symbol,
Characteristics and performance parameters of ideal Op-Amp, Open loop configurations: Differential,
Inverting & Non Inverting. Practical Op-Amp: offset voltage analysis and compensation, input bias and
offset current analysis and compensation, Change in Input offset voltage and Input offset current with
time, Temperature and supply voltage, Common mode configuration and Common mode rejection
Ratio, Frequency response, slew rate. (8)
Section 3- Op-amp with Negative Feedback: Block diagram representation of feedback
configurations, Voltage-series and Voltage–shunt feedback amplifier, Differential amplifiers-using one
op-amp, two op-amps, three op-amps. (5)
Section4- Op-amp Applications: DC and AC amplifiers, Peaking amplifiers, Summing, Scaling and
Averaging amplifiers, Differential amplifier, Instrumentation amplifiers, V to I and I to V converters,
Differentiator and integrator, Log and antilog amplifiers, Sample and hold circuits, Schmitt trigger.
(7)
Section 5- Active Filters, Oscillators and Specialized ICs: Active filters- Low-Pass, High-Pass,
Band-Pass, Band-Reject Butterworth filters, State variable filters, All pass filters, Introduction to
Chebyshev and Cauer Filters, phase-shift & Wein bridge Oscillators, Square wave, triangular wave and
saw-tooth wave generators, Voltage controlled oscillator. Phase Locked Loop- Operating principles and

31
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

a
applications, Voltage Regulators - Fixed, adjustable and switching regulators, 555 Timer- its
applications as Monostable and Astable multivibrators. (12

Recommended Books
1. Gayakwad Ramakant A., “Op-amps and Linear Integrated Circuits”, Pearson Education Inc,
Delhi, 4th edition, 200).
2. Botkar K B, “Integrated Electronics”, Khanna Publishers, 10th edition, 2005.
3. Sedra, Adel S and Smith, Kenneth C, “Microelectronic Circuits”, Oxford University Press, 5th
edition, 2005.
4. Roy Choudhary D and Jain Shail, “Linear Integrated Circuits”, New Age International
Publishers, 3rd edition, 2007.
5. J. Michael Jacob, “Applications and Design with Analog Integrated Circuits”, PHI, 2nd edition,
2004.
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

CSDC0202 Data Base Management System [3 0 0 3]

PO PO PO PO PO PO PO PO PO PO PO PO PS PS
1 2 3 4 5 6 7 8 9 10 11 12 O1 O2

CO1 ● ● ● ● ● ● ● ●

CO2 ● ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ●

Course Outcomes
CO1. Demonstrate a comprehensive understanding of database fundamentals and architecture
CO2. Apply relational data modeling principles and SQL commands proficiently,
CO3. Design efficient and normalized database schemas using entity-relationship modeling
techniques,
CO4. Evaluate and fortify database infrastructure to guarantee data integrity, maximize performance,
manage concurrency effectively, and implement robust recovery strategies.

Course Content
Unit 1: Database Fundamentals and Data Modeling
Introduction: An overview of the database management system, Database system Vs file system,
Database system concepts and architecture, Data models, Schema and instances, Data independence,
Database languages: Data Definition Language(DDL), Data Manipulation Language DML, Overall
Database Structure.
Data Modelling using the Entity-Relationship Model: ER model concepts, Notation for ER diagram,
Mapping Constraints, Keys, Extended ER model: Generalization, Specialization and Aggregation,
Reduction of ER diagram to tables.

Unit 2: Relational Data Model and Language

Relational Data Model and Language: Relational data model concepts, Integrity constraints: Domain
constraints, Entity integrity, Referential integrity, Keys constraints: Concepts of Super, Candidate,
Primary and Foreign Keys, Relational algebra, Relational calculus: Tuple and Domain calculus.
Introduction to SQL: Characteristics of SQL. Advantages of SQL. SQL data types and literals. Types
of SQL commands. SQL operators, Queries, and subqueries. Aggregate functions. Insert, update and
delete operations. Joins, Unions, Intersection, Minus, Cursors, Triggers, Views, and Indexes

33
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

a
Unit 3: Query Optimization and Normalization
Query Processing and Optimization: Translating SQL Queries into Relational Algebra Operators,
Algorithms for SELECT, PROJECT, JOIN and Set operations, Query Trees and Heuristics for Query
Optimization
DataBase Design & Normalization: Functional dependencies, normal forms, first, second, third
normal forms, BCNF, Loss less join decompositions, Normalization using FD, MVD, and JDs

Unit 4: Transaction Management, Recovery, and Concurrency Control

Transaction Processing Concepts: Transaction processing, Transaction and system concepts,
Desirable properties of Transactions, Serializability of schedules: conflict & view serializable schedule,
Schedules based on recoverability
Database Recovery: Failure classification, Recovery from transaction failures, Log-based recovery:
Deferred update and immediate update, shadow paging.
Concurrency Control Techniques: Concurrency control, Two-phase locking Techniques for
concurrency control, Time stamping protocols for concurrency control, Multi-version Concurrency
Control, Validation based protocol, Multiple granularity schemes.

Unit 5: Database Security and Implementation Techniques

Implementation Techniques- Data Storage and Indexes - file organizations, primary, secondary index
structures, various index structures - hash-based, dynamic hashing techniques, multi-level indexes, B+
trees.

Recommended Books
1. Silberschatz, Henry F. Korth, S. Sudharshan. "Database System Concepts" (6th Edition, 2010),
McGraw Hill Education.
2. J. Date, A. Kannan, S. Swamynathan. "An Introduction to Database Systems" (9th Edition,
2019), Pearson Education.
3. Ramez Elmasri, Shamkant B. Navathe. "Fundamentals of Database Systems" (7th Edition,
2015), Pearson/Addison Wesley.
4. Raghu Ramakrishnan. "Database Management Systems" (3rd Edition, 2003), McGraw Hill.
5. S. K. Singh. "Database Systems: Concepts, Design, and Applications" (1st Edition, 2006),
Pearson Education.
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECDC0208 VLSI Circuit Design [3 0 0 3]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12 PSO1 PSO2

CO1 ● ● ● ●

CO2 ● ● ● ● ● ●

CO3 ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ●

Course Outcomes
CO1: Knowledge of VLSI design methodology and performance analysis
CO2: Ability to design and analyze complex combinational circuits using the concepts of static and
dynamic CMOS design
CO3: Knowledge of parameters crucial in the design of sequential circuits and ability to analyze them
with the help of timing diagrams
CO4: Familiarization with ASIC design flow and implementation of FPGA

Course Content
Section-1 Introduction: CMOS Capabilities and Limitations, Historical perspective, VLSI Design
Flow, Issues in VLSI Design, Quality Metrics of VLSI Design. (5)
Manufacturing Process: Manufacturing CMOS Integrated Circuits, Simplified CMOS Process Flow,
Design rules- The contract between designer and process engineer, Packaging Integrated circuits. (7)
Section-2 The CMOS Inverter: Review of MOSFET, The static CMOS Inverter, Evaluating the
Robustness of the CMOS Inverter, Performance of CMOS Inverter: Dynamic Behaviour, Power,
Energy, and Energy Delay, Perspectives: Technology Scaling and Its impact. (5)
Section-3 Designing Combinational Circuits: Static CMOS Design, Complementary CMOS, Ratioed
Logic, Pass Transistor Logic, Dynamic C-MOS design, basic principle, speed and power Dissipation of
Dynamic Logic, Signal Integrity in Dynamic Design, Cascaded Dynamic Logic
(8)
Section-4 Designing Sequential Circuits: Introduction to Sequential logic, Static Latches and
registers, Dynamic Latches and Registers, Alternative Register Styles (8)
Section-5 ASIC Design and Implementation: Introduction, Full Custom, Semi-custom Circuit
Design, ASIC Design flow, FPGA implementation. (7)

Recommended Books
1. Jan M. Rabaey, AnanthaChandrakasan, Borivoje Nikolic “Digital Integrated Circuits- A Design
Perspective”, Prentice Hall, 2nd edition, 2003.

35
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

2. S M Kang and aY Lebici “CMOS Digital Integrated Circuits-analysis and design”, McGraw
Hill, 3rd edition, 2002.
3. Douglas R. Holberg, P. E. Allen “CMOS Analog Circuit Design” Oxford University Press, 2nd
edition, 2002.
4. Michael J S Smith “Application-Specific Integrated Circuits” Addison-Wesley Professional,
1997.
5. J. Baker “CMOS: Circuit Design, Layout, and Simulation” Wiley IEEE Press, 2nd edition, 2007.
6. B. Razavin “Design of Analog CMOS Integrated Circuits” McGraw Hill, 2004.
7. Neil H. E. Weste, Kamran Eshraghian, “Principles of CMOS VLSI Design”, Pearson Education
India, 2nd edition, 1999.
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECDC0212 Low Power VLSI Design [2 0 0 2]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12

CO1 ● ● ● ● ● ● ● ●

CO2 ● ● ● ● ●

CO3 ● ● ●

CO4 ● ● ● ● ●

Course Outcomes
CO1:Understandingof basic conceptsof power lossand its recovery
CO2:Abilitytoanalyzetheperformanceof CMOScircuitsatlowpoweroperation.
CO3:Knowledgeaboutpower reduction techniques andtheirimplementation.
CO4:Designofadvanceddeviceslevel,Circuitlevelandarchitecturelevellowpower designs.

Course Content
Introduction: Need for low power VLSI chips, Low Power Design hierarchy, Basic Principles
of Low Power Design, Low Power Figure of merits, Transistor sizing & gate oxide thickness,
Impact of technology Scaling, Technology & Device innovation.(7)

DeviceLevelPowerDissipationandReduction:Physics of power dissipation in CMOS

devices,TheMISstructure,long channel device,ShortChannelEffects, Sources of Power
Dissipation, Static Power Dissipation, Active Power Dissipation. (8)

CircuitTechniquesforLowPowerDesign:CircuitTechniques for Leakage Power

Reduction,Standby leakage controlusing Transistors tacking,Multi-threshold voltage
technique,Dynamic threshold voltagetechnique,Supply voltage scaling technique, power
reduction in memory circuits. (8)

Power Analysis: Simulation Power analysis: SPICE circuit simulators, gate level logic
simulation, capacitive power estimation, static state power, gate level capacitance estimation,
architecture level analysis, Monte Carlo simulation. (7)

Architecture and System: Power reduction at architecture and system level, Power
performance management, switching activities reduction, parallel architecture with voltage
reduction. (10)

RecommendedBooks
1. GaryK.Yeap, “PracticalLowPowerDigitalVLSIDesign”,KAP,2002
2. Rabaey,Pedram,“Lowpowerdesignmethodologies”KluwerAcademic,1997
3. KaushikRoy,SharatPrasad,“Low-PowerCMOSVLSICircuitDesign”Wiley,2009.

37
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

a
ECDC0216 Computer Organization & System Architecture [3 0 0 3]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12

CO1 ● ● ● ● ● ● ● ●

CO2 ● ● ● ● ●

CO3 ● ● ●

CO4 ● ● ● ● ●

Course Outcomes
CO1: To understand computer organization in detail for the design of elementary basic
digital computer
CO2: To understand the organization and architecture of CPU
CO3: To understand the organization and architecture of I/O and memory
CO4: To introduce the concept of parallel processing

Course Contents
Data representation and Microoperations:
Data types, Complements, Fixed point and floating point representations, Binary codes, Error
detecting codes, Register transfer language, Register transfer, Bus and Memory transfers,
Microoperation: Arithmetic, Logic and Shift Microoperations and their hardware
implementation. (7)
Computer Organization and Design:
Instruction codes, Stored program organization and Indirect address, Computer registers,
Computer instructions, Timing and Control, Instruction cycle, Memory Reference Instructions,
Input – Output and Interrupt, Machine Language, Assembly Language, Control memory, Address
sequencing, Microprogrammed control, Control Unit. (9)
Central Processing Unit:
General Register Organization, Stack Organization, Instruction Formats, Addressing Modes, Data
Transfer and Manipulation, Program Control, Introduction to RISC Vs CISC architecture.
(8)
I/O and Memory Organization:
Peripheral Devices, I/O Interface, I/O bus and interface modules, I/O vs Memory bus, Isolated
and Memory-mapped I/O, Practical example of I/O interface, Asynchronous data transfer:
Strobe control, Handshaking, Serial transfer, Asynchronous communication Interface, Modes
of transfer: Programmed I/O, Interrupt I/O, DMA transfer, Memory Hierarchy, Main Memory,
RAM & ROM, EPROM, EEPROM, Flash ROM, Memory address map, Introduction to
auxiliary associative, cache and virtual memory (12)
Parallel Processing:
Pipeline processing, Types of pipeline, Introduction to Vector Processing, Memory
Interleaving, Superscalar Processor, Introduction to Array Processor (4)
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

Recommended Books
1. M.M. Mano, “Computer System architecture”,Pearson, Third Edition, 2007.
2. John P. Hayes “Computer Architecture and Organization”, 3rd Edition by WCB/McGraw-Hill.
3. David A. Patterson and John L. Hennessy, “Computer Organization & Design-The
Hardware/Software Interface”, Morgan Kaufmann, 2nd Edition 1997.
4. William Stallings, “Computer Organisation and Architecture, Designing for Performance”,
Pearson Education Asia, 6th Edition 2003.

39
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECDC0236 Analog and Digital Communication Laboratory [0 0 2 1]

List of Experiments

1) Generate the Double Sideband Amplitude Modulation (DSB-AM) modulated and demodulated
signals. further calculate modulation index through generated waveforms.
2) Generate the Single Sideband Amplitude Modulation (SSB-AM) modulated and demodulated
signals.
3)
a) Generate and analyse Frequency Modulation (FM) using Reactance Modulator.
b) Generate and analyse Frequency Modulation (FM) using Varactor Modulator.
4) Analysis of different Digital Data Formats generated through hardware kit.
5) Generate the Amplitude Shift Keying(ASK) modulated signal and analyse the output waveform
patterns.
6) Generate the Frequency Shift Keying (FSK) modulated signal and analyse the output waveform
patterns.
7) Generate the Phase Shift Keying (PSK) modulated signal and analyse the output waveform patterns.
8) Generate the Differential Phase Shift Keying (DPSK) modulated signal and analyse the output
waveform patterns.
9) Generate the Quadrature Phase Shift Keying (QPSK) modulated signal and analyse the output
waveform patterns.
10) Generate the Differential Quadrature Phase Shift Keying (DQPSK)modulated signal and analyse
the output waveform patterns.
11)
a) To analyse and measure amplitude for 16-QAM Modulation with respect to symbol mapper.
b) To analyse and measure amplitude for 16-QAM Demodulator with symbol de-mapper.
12) Study of different types of Noise and their frequency spectrum
a) White Noise Additive
b) Additive White Gaussian Noise
c) Pseudo Random Noise
13) Analysis of eye pattern with and without Noise.
14) Generate OFDM signal 64-point IFFT & FFT with Baseband QPSK modulation & demodulation
techniques.
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECDC0234 Analog Integrated Circuits Laboratory [0 0 2 1]

PO PO PO PO PO PO PO PO PO PO10 PO1 PO PSO PSO2

1 2 3 4 5 6 7 8 9 1 12 1

CO ● ● ● ● ● ● ●
1

CO ● ● ● ● ● ● ● ●
2

CO ● ● ● ● ● ● ● ● ● ●
3

CO ● ● ● ● ● ● ● ● ●
4

Course Outcomes
CO1: Develop proficiency in designing and analyzing fundamental circuits utilizing op-amps
CO2: Gain expertise in implementing a variety of analog circuits using op-amp such as waveform
generators, filters, integrators, etc.
CO3: Acquire the skills to utilize the 555 timer IC in different configurations for different applications
CO4: Demonstrate the operation of Voltage Controlled Oscillators (VCOs), Phase Locked Loops
(PLLs)and voltage regulator to understand their functionalities and application in circuit design.

List of Experiments
1. To experimentally analyze the performance of inverting, non-inverting, and differential
amplifier-using op-amp.
2. To investigate the performance of op-amp as a summing, scaling, and averaging amplifier.
3. To evaluate the working of an op-amp as a voltage level detector.
4. Construct a square wave generator using op-amp and validate its performance by analyzing the
output waveform.
5. Construct a triangular and saw-tooth wave generator using op-amp and validate its performance
by analyzing the output waveform.
6. Generate a square waveform using an op-amp configured as a Schmitt trigger.
7. Design low-pass filter and high-pass circuits using an op-amp and determine their cut-off
frequencies.
8. To design and setup a notch filter with a notch frequency fN = 1 KHz
9. Design a differentiator and integrator circuit using an op-amp and verify their performances
by analyzing the output waveform.
10. To validate the functionality of a 555 timer set up as a monostable and an astable multivibrator.
11. Verify the operation of VCO as Voltage to frequency characteristics of 566 IC.
12. To analyze the operation of PLL as a Frequency multiplier using 565 IC.
13. To set up a low voltage regulator using IC723 and plot the regulation characteristics.

Experimentation to be supported by computer simulations.

41
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

CSDC0232 a Data Base Management System Laboratory [0 0 2 1]

Course Outcomes

CO1: Apply DDL and DML commands proficiently, ensuring data integrity with various constraints.
CO2: Execute advanced SQL queries with aggregate functions and subqueries.
CO3: Design and implement database optimizations for performance and security using views,
indexes, and sequences.
CO4: Apply PL/SQL fundamentals for effective transaction management.
CO5: Utilize Embedded SQL in host languages, showcasing advanced database skills through a mini-
project.

List of Experiments

1. Table Creation and Modification (DDL and DML): Hands-on practice in creating and
modifying database tables using Data Definition Language (DDL) and Data Manipulation
Language (DML) commands.
2. Data Integrity Constraint Implementation: Implementation and enforcement of data integrity
constraints such as Primary Key, Foreign Key, Unique, and Not Null constraints.
3. SQL Query Writing with Functions and Sorting: Writing and executing SQL queries involving
aggregate functions, grouping data, and sorting results using Group By, Having, and Order By
clauses.
4. Relational Algebra Operations in SQL: Applying relational algebra operations like UNION,
INTERSECT, and MINUS in SQL queries for data manipulation.
5. Data Extraction with Joins: Constructing SQL queries to retrieve data from multiple tables using
various types of joins including Equi-Join, Non-Equi-Join, and Outer Join.
6. Subqueries and Nested Queries: Formulating SQL queries containing subqueries and nested
queries for complex data retrieval.
7. Advanced SQL Query Techniques: Utilizing advanced SQL query techniques involving
subqueries, set operators (ANY, ALL, IN), and constraints for comprehensive data analysis.
8. View, Index, and Sequence Management:Creating and managing database views, indexes, and
sequences for efficient data access and manipulation.
9. Data Control and Transaction Management: Practicing Data Control Language (DCL) and
Transaction Control Language (TCL) commands for managing database security and transactions.
10. Introduction to PL/SQL Programming Basics: Introduction to PL/SQL programming basics,
including variables, control structures, and basic query construction.
11. PL/SQL CASE Statements, Loops, and Exception Handling: Writing PL/SQL code with CASE
statements, loops, and exception handling mechanisms for effective database programming.
12. Stored Procedures and User-defined Functions: Developing stored procedures and user-defined
functions in PL/SQL for modular code reuse and customization.
13. Trigger Implementation: Designing and implementing database triggers for automatic actions in
response to database events.
14. Utilization of Cursors in PL/SQL: Understanding and utilizing cursors in PL/SQL for iterative
processing of query results.
15. Embedded SQL Integration: Integrating SQL statements within host programming languages for
seamless database interaction.
• This is only the suggested list of Practicals. The instructor may frame additional Practical’s
relevant to the course contents
• Mini Project may also be planned & carried out throughout the semester to understand the
important various concepts of Database.
Students are advised to use Oracle/MySQL or other latest database software for above-listed
experiments.
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECDC0238 VLSI Laboratory -I [0 0 2 1]

PO PO PO PO PO PO PO PO PO PO10 PO1 PO PSO PSO2

1 2 3 4 5 6 7 8 9 1 12 1

CO1 ● ● ● ● ● ● ● ●

CO2 ● ● ● ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ● ● ●

Course Outcomes
CO1: Ability to design and analyse CMOS devices.
CO2: Ability to design CMOS circuits using NMOS and PMOS.
CO3: Potential to implement logic gates switching circuits.
CO4: Potential to schematic design and transient analysis of logic gates.

List of Experiments

1. To plot and analyse the properties and characteristics of NMOS.

2. To plot and analyse the properties and characteristics of PMOS.
3. To design and analyse the properties and characteristics of CMOS Inverter.
4. To design and analyse the properties and characteristics of NMOS as Resistive Load.
5. To design and analyse the properties and characteristics of Two Stage Operational Amplifier.
6. Schematic designing and analysis(transient) of logic AND gate using PASS transistors.
7. Schematic designing and analysis(transient) of logic OR gate using Transmission Gate.
8. Schematic designing and analysis(transient) of logic NOT gate.
9. Schematic designing and analysis(transient) of logic NAND gate.
10. Schematic designing and analysis(transient) of logic NOR gate.
11. Demonstration of semiconductor devices and their quantum behaviour in nanoscale regism
(Using TCAD and quantum based CAD ).
• To perform band structure calculations, band gap, band edges etc
12. Design and demonstrate the following devices
• Nanowire, Nanotube, TFET
• CNT, Graphene Based FET
• Model and analyse quantum dot structures

43
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECFE a
Universal Human Values [2 0 0 1]

Course Introduction -Need, Basic Guidelines, Content and Process for Value Education,
Understanding the need, basic guidelines, content and process for Value Education, Self-Exploration
‘Natural Acceptance’ and Experiential Validation- as the mechanism for self-exploration, Continuous
Happiness and Prosperity

Harmony in the Human Being - Harmony in Myself! Understanding human being as a coexistence of
the sentient ‘I’ and the material ‘Body’ .Understanding the needs of Self (‘I’) and ‘Body’ - Sukh and
Suvidha, Understanding the characteristics and activities of ‘I’ and harmony in ‘I’. Understanding the
harmony of I with the Body: Sanyam and Swasthya; Understanding Harmony in the Family and Society

Understanding Harmony in the family – the basic unit of human interaction. Understanding values
in human-human relationship; Trust (Vishwas) and Respect (Samman) as the foundational values of
relationship, the other salient values in relationship

Understanding the harmony in the society (society being an extension of family): Samadhan,
Samridhi, Abhay, Sah-astitva as comprehensive Human Goals, Visualizing a universal harmonious
order in society- Undivided Society (AkhandSamaj), Universal Order (SarvabhaumVyawastha )- from
family to world family!

Understanding Harmony in the Nature and Existence -Whole existence as Coexistence.

Understanding the harmony in the Nature. Interconnectedness and mutual fulfilment among the four
orders of naturere cyclability and self-regulation in nature. Understanding Existence as Coexistence
(Sah-astitva) of mutually interacting units in all-pervasive space.

Recommended Books
1. R.R Gaur, R Sangal, G P Bagaria, “A foundation course in Human Values and professional
Ethics” Excel books, New Delhi, 2010. 2.
2. A.N. Tripathy, “Human Values” New Age International Publishers, 2003
Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

th
5 Semester

45
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

a
ECDC0311 CMOS Analog IC Design [3 0 0 3]

PO1 PO PO PO PO PO PO PO PO PO PO PO PS PSO2
2 3 4 5 6 7 8 9 10 11 12 O1

CO1 ● ● ● ● ●

CO2 ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ●

Course Outcomes
CO1: Analog VLSI subject deals with the analysis and design of analog CMOS Integrated Circuits.
CO2: Demonstration and understanding of MOS basic physics and operation of MOS devices.
CO3: An ability to analyze basic amplifier stages, differential amplifier stages, current mirrors, and
active loads. Students should be able to make choices among these building blocks.
CO4: Analyze various single-stage and two-stage op amp circuits to determine gain (differential and
common-mode), frequency response, output resistance, short-circuit transconductance, input common-
mode range, and output signal range.

Course Content
Section 1 Introduction: Analog MOS circuits, single stage amplifiers, differential amplifiers,
passive and active current mirrors, frequency and transient responses, noise, feedback, operational
amplifiers, stability and frequency compensation, analog switches, switched-capacitor circuits,
oscillators. (10)
Section-2: Filters & A/D Converters: Sampled Data Analog Filters, Over Sampled A/D
Converters and Analog Integrated Sensors: First-order and Second SC Circuits-Bilinear
Transformation – Cascade Design- Switched-Capacitor Ladder Filter-Synthesis of Switched-
Current Filter – Nyquist rate A/D Converters- Modulators for Over sampled A/D Conversion. (10)
Section-3: Operational Amplifier: Differential and Common mode circuits, Op Amp CMRR
requirements, Need for single and multistage amplifiers, Effect of loading in differential stage.
Performance Analysis: dc gain, frequency response, noise, mismatch, slew rate of cascade and two
stage OP Amps, Fully Differential Op Amps-common-mode feedback, loop stability. (10)
Section-4: Phase Locked Loops: Problem of lock acquisition, phase Detector. Basic PLL and its
dynamics, Charge- pump PLL, Non-ideal effects in PLL: PFD/CL non idealities, Jitter, Delay
Locked Loop, Amplifications. (10)

Recommended Books
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

1.Neil H. E. Weste & Kamran Eshraghian, “Principles of CMOS VLSI Design” 2nd edition, Pearson
education Asia, 2000.
2.Wayne Wolf, “Modern VLSI Design” Pearson Education, 4th Indian Reprint 2005. R.S.
Muller and T.I. Kamins, “Device Electronics for Integrated Circuits” Wiley, 1986.
3.DA. and Eshrachian K, “Basic VLSI design-systems & circuits”, PHI, 1988.
4.B Razavi, “Design of Analog CMOS Integrated Circuits”, Mc Graw Hill, 2000.

47
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECDC0303 a
Advanced Microprocessor and Peripherals [3 0 0 3]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12

CO1 ● ● ● ● ● ●

CO2 ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ●

Course Outcomes
CO1: To familiarize with the architecture, addressing modes, instruction format of 8085and 8086
microprocessor and to introduce with the advanced 16-64 bit processors
CO2: To understand the concept of machine code construction and to write structured assembly
language programming for 8086 microprocessor, its interrupts and I/O interfacing.
CO3: To give detailed introduction to embedded system with an attempt to design a standalone
system.
CO4: To understand the architecture of special purpose peripheral devices, their interfacing with
8086 for design applications
CO5: To understand the architecture, programming model of 8051 microcontroller, and
interfacing with I/O devices

Course Content

• Introduction to 8-bit processor: Digital computing, Minicomputers and Mainframes,

Microcomputer revolution and applications, Machine and Assembly language,
Microcomputer organization, Brief description of 8085 MPU and its organization,
Programming model and its I/O interfacing. (4)
• Advanced Microprocessors and Embedded System: Overview of 16-bit to 64-bit
processors: 8086, 8088, 80186, 80188, 80286, 80386, 80486, Pentium Processors, ARM
Cortex series and Dual core processors, Organization of 8086 CPU, 8086 Microprocessor
internal architecture, Concept of 8086 architecture splitting: BIU and EU, its instruction
pipelining, its Physical and logical memory, PIN diagram, 8086 hardware configurations,
8086 flags, Segmented memory, Minimum and maximum mode configurations, 8086
Interrupts and interrupt applications.
Embedded System: Introduction to embedded system, Types and Classification, Hardware,
software and firmware, Chip selection and constraints, OS and its types, RTOS and its types,
Introduction to Von Neuman and Harvard architecture, RISC and CISC. (10)
• 8086 Assembly Language Programming: Addressing modes, Instruction formats, 8086
Instruction set and assembler directives, Constructing machine codes for 8086 instructions,
Assembly language programming, Linking and Relocation, Data Transfer Instructions,
Arithmetic, Logical, Shift and Rotate Instructions, Stacks, Procedures, JUMP operations,
STRING operations, CALL& RET operations, addressing memory & ports, , Flag Control
Instructions, Transfer of Control Instructions, Processor Control Instructions. (6)
• Programmable Peripheral Devices and their Interfacing: Programmable parallel ports
and handshake I/O, Programmable Peripheral Interface 8255A, Programmable Interval
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

Timer/Counter 8254, Programmable Interrupt Controller 8259A, Asynchronous and

synchronous communication interface, Physical communication standards, Data
communication using 8251 A programmable communication interface, keyboard Interfacing,
Interfacing to alphanumeric displays, Keyboard/Display 8279, DMA Controller. (7)
• Micro Controllers and their Interfacing: Micro controllers & Embedded processors,
Overview of 8051 family, 8051-architecture, pin diagram, and Hardware Description: its
Registers, Timers, Counters, Flags, Special Function Registers, I/O Pins Ports and Circuits,
Memory organization, register banks and stack, program status word (PSW), accumulator,
program counter, 8051 instruction set, addressing modes, 8051 assembly language
programming, I/O Port programming, Overview of 16 & 32 bit micro controllers. (8)
Interfacing:
8051 Timer and counter programming, its Serial port programming, its Interrupt
programming, its LED and LCD Interfacing, ADC, DAC & Sensor Interfacing, External
Memory Interface, Stepper Motor Interfacing, Introduction to PIC and ARM
microcontroller.(5)

Recommended Books

1. Douglas V. Hall, “Microprocessor & Interfacing: Programming & Hardware”, Tata

McGraw
Hill, (1992).
2. Lyla B Das, “Embedded Systems An Integrated Approach”, Pearson 2013.
3. M A Mazidi, J G Mazidi, R D Mc Kinlay“The 8051 Micro controllers & Embedded
Systems”, 2nd Indian reprint, Pearson education, (2002).

49
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

a
ECDC0313 IC Technology [2 0 0 2]

PO1 PO PO PO PO PO PO PO PO PO PO PO PS PSO2
2 3 4 5 6 7 8 9 10 11 12 O1

CO1 ● ● ● ● ●

CO2 ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ●

Course Outcomes
CO1: Ability to understand the concepts of semiconductor technology.
CO2: Understanding about the basic fabrication steps used in IC fabrication.
CO3: Ability to learn and implement the advanced techniques for IC design.
CO4: Understanding the brief concepts of CMOS technology and Packaging.

Course Content
I. Introduction: VLSI technology Device scaling and Moore’s law, basic device fabrication
methods, Semiconductor materials, Semiconductor process technology, Introduction to basic
fabrication steps’ flow chart. Electronic-Grade Silicon,Crystal growth-Czochralski method
for Silicon, Crystal growth technique for GaAs, LCE, Zone-refining and floating zone, Wafer
preparation.
2. Oxidation, Diffusion and ionimplantation Types of oxidation and their kinematics, oxidation
systems, Deposition process and methods, Diffusion in solids, Diffusion equation and diffusion
mechanisms, ion implantation technology, implantation damage and annealing, transient
enhanced diffusion and rapid thermal processing.
3. Introduction to Epitaxial growth Techniques: LPE, VPE/CVD, MOCVD, MBE,
CVD and LPCVD techniques for deposition of poly silicon, Silicon nitride and silicon dioxide,
Metallization and passivation.
4. Lithography Optical lithography contact/proximity and projection printing, resolution and
depth of focus, resist processing methods and resolution enhancement, advanced lithography
techniques for nanoscale pattering, immersion, EUV, electron, X-ray lithography, Etching.
5. IC Manufacturing: Process flows for CMOS and bipolar IC, Electrical testing,Bonding,
Packaging,Statistical Process control. (3)

Recommended Books
1. G S May and S M Sze, “Fundamentals of Semiconductor Fabrication”, John Wiley &
Sons, India, (2004).
2. S M Sze, “VLSI Technology”, McGraw Hill, 2nd International Edition (1988).
3. S K Ghandhi, “VLSI fabrication Principles”, John Wiley Inc., New York (1983).
4. B G Streetman, “Solid State Electronics Devices”, Prentice Hall of India, New Delhi,
(1995).
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

5. C Y Chang and S Sze, “ULSI Technology”,McGraw-Hill Companies Inc. (1996).

51
 Curriculum of B.Tech Programme in Electronics and VLSI Engineering to be
applicable from 2023 batch onwards

ECDC0307 a Digital Signal Processing [3 1 0 4]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12

CO1 ● ● ● ●

CO2 ● ● ● ● ●

CO3 ● ● ● ● ● ● ●

CO4 ● ● ● ● ●

Course Outcomes
CO1: Understanding the concepts of signal processing to enable the students to
understand the continuous and discrete representation of signals in both time- and
frequency- domains
CO2: Analyze discrete linear time invariant systems by employing Z transforms,
FFT and DFT concepts
CO3: Design of FIR and IIR digital filters with the help of concepts learned
CO4: Application of analog-to-digital and digital-to-analog conversions for
sampling of signals and reconstruction of the original signal from the processed
signal

Course Contents
Introduction: Signals, Systems and Signal Processing, Classification of Signals, Concept of
Frequency in Continuous Time and Discrete Time Signals, Analog-to-Digital and Digital-to-Analog
Conversion, Applications of Signal Processing (4)
Discrete Time signals and Systems: Discrete Time Signals, Discrete Time Systems, Analysis
of Discrete Time Linear Time-Invariant Systems, Discrete Time Systems Described by
Difference Equations, Implementation of Discrete Time systems, Correlation of Discrete Time
Signals. (6)
The Z-transform and Its Application to the Analysis of LTI Systems: The z-Transform,
Properties of z-Transforms, Inversion of z-Transform, One-sided z-Transform, Analysis of
Linear Time- Invariant Systems in the z-Domain (5)
Frequency analysis of signals and systems: Frequency Analysis of Continuous –Time
Signals, Frequency Analysis of Discrete Time Signals, Properties of Fourier Transform for
Discrete Time Signals. Frequency Domain Characteristics of Linear Time-Invariant Systems, Linear
Time-Invariant Systems as Frequency-Selective Filters, Inverse Systems, and Deconvolution (4)
The discrete Fourier transform: its properties and applications: Frequency Domain
Sampling: The discrete Fourier Transform, Properties of the DFT, Linear Filtering Methods based on
the DFT. Frequency Analysis of Signals Using the DFT. (4)
Efficient computation of DFT: Fast Fourier transforms: Efficient Computation of DFT: FFT
Algorithms, Application of FFT Algorithms, A Linear Filtering Approach to Computation of DFT.
Quantization Effect in the Computation of DFT. (4)
Curriculum of B.Tech Programme in Electronics and Communication Engineering to be
applicable from 2023 batch onwards

Implementation of discrete time systems: Structures for the realization of Discrete Time Systems,
Structures for FIR Systems, Structures for IIR Systems, Representation of Numbers, Quantization of
Filter Coefficients, Round off Effect in Digital Filters (4)
Design of digital filters: General Considerations like causality etc., Design of FIR Filters, Design of
IIR Filters from Analog Filters, Frequency Transformations, Design of Digital Filters Based on
Linear Squares Method. (6)
Sampling and reconstruction of signals: Sampling of Band-pass Signals, Analog-to-
Digital Conversion, Digital-to-Analog Conversion (3)

Recommended Books
1. J. G. Proakis and D. G. Manolakis, “Digital Signal Processing: Principles, Algorithms
and Applications”, Pearson Prentice Hall, (2007).
2. S. K. Mitra, “Digital Signal Processing: A Computer Based Approach”, 3rd Edition, TMH, (2008).
3. A. V. Oppenheim, R. W. Schafer and J. R. Buck, “Discrete-time Signal
Processing”, 2nd Edition, Prentice Hall, (1999).
4. Emmanuel C. Ifeachor and Berry W. Jervis, “Digital Signal Processing”-A
Practical Approach. 2nd Edition, Prentice Hall, (2002).

53
 Curriculum of B.Tech Programme in Electronics and Communication Engineering to be applicable
from 2023 batch onwards

ECDC0305 Data Communication and Networks and Internet of Things [3 0 0 3]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12

CO1 ● ● ● ● ● ● ●

CO2 ● ● ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ● ●

Course Outcomes
CO1: To learn OSI and TCP/IP models and introduction to Physical Layer concepts.
CO2: To understand the design issues of Data Link layer and to learn the basic concepts of framing,
flow and error control.
CO3: To understand the broadcast channels and to learn different Medium Access Control protocols,
and IEEE standards for LAN, MAN and WAN.
CO4: To understand the basic concepts of routing and IP addressing.
CO5: To understand the basic concepts of end to end communication and Quality of Service.
CO6: To become familiar with the basic concept of Internet-of-Things, its architecture and
design, the 'Things' used in IoT, and to understand the existing IoT MAC and Network
layer protocols.

Course Contents
Unit 1: Introduction to Data Communication And Networks, Network Types, Different
Networks Topologies, Layered Architectures, Performance Parameters; Physical Layer: Wired
and Wireless media, Basic Concept of Switching and Switching Architecture, Introduction to
ATM Reference Model and ATM Networks.

Unit 2: Data Link Control: Design issues, services provided to Network layer, Framing, Error
and Flow Control, Elementary data link protocols; Simplex, Stop and Wait, Sliding Window
or Automatic Repeat Request (ARQ) protocols; Stop-and-Wait, Go-back-N, and Selective
Repeat ARQs and their Performance analysis. Example data link protocols such as HDLC and
PPP.

Unit 3: Medium Access Control Sublayer: The channel allocation problem, Multiple Access
Protocols, Aloha, CSMA, CSMA/CD, CSMA/CA, Hidden and Exposed Terminal Problems,
Ethernet (IEEE 802.3), Wireless LANs (IEEE 802.11), DCF and PCF, MAC Frame structure,
Introduction to IEEE 802.15 (WPAN) and IEEE 802.16 (WiMAX).

Unit 4: Network Layer: Design issues, Logical Addressing, Ipv4 and Ipv6, ARP, DHCP,
ICMP, Subnetting, Classless addressing, Network Address Translation, Routing Protocols:

54
Curriculum of B.Tech Programme in Electronics and Communication Engineering to be
applicable from 2023 batch onwards

Distance Vector and Link-State, Interior and Exterior Gateway Protocol concepts, Dijkstra’s
algorithm, Bellman-Ford algorithm, Example protocols: OSPF, RIP, and BGP.

Unit 5: Transport Layer: Process to Process Delivery, Connection-oriented and Connectionless

Protocols; TCP and UDP, Connection Establishment and release, Sliding Window, Flow and
Congestion Control, Timers, Retransmission, Quality of Service.

Unit 6: Introduction to IoT: What is IoT, Impact of IoT, IoT Challenges. IoT network
architecture & design: oneM2M, IoTWF, Core functional stack, Data management stack.
'Things' in IoT: Sensors, Actuators, Smart objects, Basics of Sensor Networks. Communicating
smart objects: Communication criteria, IoT access technologies- IEEE 802.15.4, IEEE
802.15.4e, IEEE 802.11ah, IEEE 1901.2a, NB-IoT. IoT Network Layer: IP as IoT network
layer, 6LoWPAN, 6Lo, 6TiSCH, RPL.

Reference Books
1. William Stallings, Data and Computer Communications, Tenth Edition, Prentice Hall, 2017.
2. Behrouz A. Forouzan, “Data Communications and Networking”, Fourth Edition, TMH, 2017.
3. Andrew S. Tanenbaum, “Computer Networks”, Fifth Edition, Pearson Education India, 2013.
4. Peterson and Davie, “Computer Networks, A Systems Approach’’, 5th ed., Elsevier, 2011.
5. Kurose and Ross, “Computer Networking – A top-down approach”, Seventh Edition, Pearson,
2017.
6. D. Hanes, G. Salgueiro, P. Grossetete, R. Barton, J. Henry; IoT Fundamentals:
Networking Technologies, Protocols, and Use Cases for the Internet of Things, 1st
Edition, Pearson India Pvt. Ltd., 2018.
7. Bahga, V. Madisetti; Internet of Things: A Hands-on Approach, 1st Edition,
Universities Press (India) Pvt. Ltd., 2015.
8. Y. Kanetkar, S. Korde; 21 Internet of Things (IOT) Experiments: Learn IoT, the
programmer's way, 1st Edition, BPB Publications, 2018.

55
 Curriculum of B.Tech Programme in Electronics and Communication Engineering to be applicable
from 2023 batch onwards

ECDC0339 VLSI Laboratory -II [0 0 2 1]

PO PO PO PO PO PO PO PO PO PO10 PO1 PO PSO PSO2

1 2 3 4 5 6 7 8 9 1 12 1

CO1 ● ● ● ● ● ● ● ● ● ●

CO2 ● ● ● ● ● ● ● ● ●

CO3 ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ● ●

Course Outcomes

CO1: Knowledge of semiconductor devices simulation tools.

CO2: To design and analyse semiconductor devise using TCAD tool.
CO3: Ability to process variation analysis of devices.
CO4: To design and simulate advanced semiconductor devices.

List of Experiments

1. Introduction to TCAD tool.

2. To design and analyse characteristics of PN junction DIODE using TCAD tool.
3. To design and analyse different properties of the BIPOLAR JUNCTION
TRANSISTOR (npn) using TCAD tool.
4. To design and analyse different properties of the BIPOLAR JUNCTION
TRANSISTOR (pnp) using TCAD tool.
5. To analyse the impact process variation on the characterization of BJT using TCAD.
6. To design MOSFET using device TCAD tool and analyse characteristics.
7. To analyze the impact of process variation on the characterization of MOSFET using
TCAD.
8. To design double gate MOSFET using TCAD tool.
9. To analyze the impact process variation on the characterization of double-gate
MOSFET using TCAD.
10. To simulate different properties of the Thin Film Transistor

56
Curriculum of B.Tech Programme in Electronics and Communication Engineering to be
applicable from 2023 batch onwards

ECDC0335 Data Communication Networks and IoT Laboratory [0 0 2 1]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12

CO1 ● ● ● ● ● ● ●

CO2 ● ● ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ● ● ●

Course Outcomes
CO1: Understand the basics of network simulator (ns-2).
CO2: Understand the basic idea of implementing different types of wired network scenarios and
how different layer protocols are being used in those scenarios.
CO3: Understand the basic idea of implementing different types of wireless network scenarios and
how to implement advanced wireless network scenarios.

List of Experiments

1. Basics of Network Simulation-Introduction | Platform required to run network simulator |

Backend Environment of Network Simulator | Basics of Tcl Programming for NS-2 |
Agents and applications | Tracing

2. The first Tcl script-How to start | Two nodes, one link | How to send the data

3. Creating different topologies-The events | Marking flows | Monitoring a queue

4. Network dynamics-Creating a larger topology | Link failure

5. Measuring Network Performance-Network Performance Evaluation | Performance

Evaluation Metrics | Parameters Affecting the Performance of Networks | Performance
Evaluation Techniques | Network Performance Evaluation using NS-2

6. Creating output files for X-graph-Topology and traffic sources | Recording data in output
files | Running the simulation

7. Running wireless simulations in ns-Creating a simple wireless scenario | Using node-

movement/traffic-pattern files and other extensions for wireless simulations

8. Creating Wired-cum-Wireless and Mobile IP Simulations-Creating a simple wired-cum-

wireless scenario | Running Mobile IP in a simple wired-cum-wireless topology

9. Generating traffic-connection and node-movement files for large wireless scenarios-

Creating random traffic-pattern for wireless scenarios | Creating node-movements for
wireless scenarios

57
Curriculum of B.Tech Programme in Electronics and Communication Engineering to be applicable
from 2023 batch onwards

10. Simulating a Local Area Network-Local Area Network | LAN Topologies | MAC
Protocols | Taking turns | Ethernet | Ethernet Frame Structure | Ethernet Versions |
Simulating a LAN using Network Simulator 2

58
Curriculum of B.Tech Programme in Electronics and Communication Engineering to be
applicable from 2023 batch onwards

ECDC0337 Digital Signal Processing Laboratory [0 0 2 1]

List of Experiments

1. Compute cross-correlation of two digital sequences.

2. Compute Z-transform of transfer function using partial fraction method.
3. Compute discrete time Fourier transform for a finite length sequence.
4. Perform linear convolution computation of two finite length sequences.
5. Evaluate M-point discrete cosine transform of a N-length sequence.
6. Design minimum-phase low pass FIR digital filter
7. Design multiband FIR filter using Hamming window with given specifications
8. Design a Kaiser window and demonstrate it for given parameters.
9. Design Type-I Chebyshev IIR high pass filter with given specifications
10. Design Butterworth IIR band pass filter.

59
 Curriculum of B.Tech Programme in Electronics and Communication Engineering to be applicable
from 2023 batch onwards

ECDC0333 Advanced Microprocessor and Peripherals Laboratory [0 0 2 1]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO1 PO1 PO1 PS PS
0 1 2 O1 O2

CO1 ● ● ● ● ●

CO2 ● ● ● ● ● ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ● ● ●

Course Outcomes
CO1: Ability to design and analyze an assembly language program using 8086 instruction set
CO2: Ability to develop a prototype for various interfacing peripheral devices
CO3: Ability to design and analyze an assembly language program using 8051 instruction set
CO4: Ability to apply the gained concept in interfacing and design application using 8086
microprocessor and 8051 microcontroller.
List of Experiments
1. Understanding of 8085, 8086 and 8051 programming models, instruction formats and
templates.
2. 8085 based programming problems includes looping, stacking, advanced multi bit operations.
3. 8086 based assembly language programming exercises on emulator and hardware boards: 16
bit multiplication and division, signed arithmetic, sorting, arrange series of numbers in
ascending/descending order, strings, stack, timers, counters etc and interfacing with I/O
peripherals.
4. Study of microcontroller boards.
5. 8051 based microcontroller assembly language programming exercises and interfacing with
LEDs, LCD, and Switches etc.
6. Interfacing using 8051 and 8086 and to design an application based on target boards.

60
Curriculum of B.Tech Programme in Electronics and Communication Engineering to be
applicable from 2023 batch onwards

th
6 Semester

61
 Curriculum of B.Tech Programme in Electronics and Communication Engineering to be applicable
from 2023 batch onwards

ECDC0312 VLSI Testing [3 0 0 3]

PO1 PO PO PO PO PO PO PO PO PO PO PO PS PSO2
2 3 4 5 6 7 8 9 10 11 12 O1

CO1 ● ● ● ● ●

CO2 ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ●

Course Outcomes
CO1: Explain the concepts of testing, testability and fault modelling.
CO2: Understand the fundamental knowledge of various testing algorithms for combinational circuits.
CO3: Understand the fundamental knowledge of various testing algorithms for sequential circuits
CO4: Ability to analyze the problems related to sequential, combinational and memory system design
algorithms and fault tolerance and society solutions.

Course Content
I. Introduction on to Testing Role of testing in VLSI Design flow, Testing at different levels of
abstraction, Fault, error, defect, diagnosis, yield, Types of testing, Rule of Ten, Defects in VLSI chip.
Modelling basic concepts, Functional modelling at logic level and register level, structure models,
logic simulation, delay models. Various types of faults, Fault equivalence and Fault dominance in
combinational sequential circuits.

2. Fault Models Fault models, Fault Collapsing, Logic Simulation and Fault simulation, Fault
simulation applications, General fault simulation algorithms Serial, and parallel, Deductive fault
simulation algorithms.

3. Combinational circuit test generation Combinational circuit test generation, Structural Vs

Functional test, Path sensitization methods. Difference between combinational and sequential circuit
testing, five and eight valued algebras, and Scan chain-based testing method.

4. Algorithms D-algorithm procedure, Problems, PODEM Algorithm. Problems on PODEM

Algorithm. FAN Algorithm. Problems on FAN algorithm, Comparison of D, FAN and PODEM
Algorithms

5. Built in Self-Test (BIST) Built in Self-Test (BIST) - Exhaustive pattern generation, random pattern
generation, LFSR for pattern generation and Output response analysis, SISR, MISR, Memory BIST –
Type of memory faults, fault detection by MARCH tests Issues in test and verification of complex
chips, embedded cores and SOCs, System testing and test for SOCs.

RecommendedBooks

62
Curriculum of B.Tech Programme in Electronics and Communication Engineering to be
applicable from 2023 batch onwards

1. D. Gajski, N. D. Dutt,A.C.-H. Wu and S.Y.-L. Lin, HighLevel Synthesis: Introduction to

Chip and System Design, Springer, 1st edition, 1992.
2. S.Palnitkar,Verilog HDL:A Guide to Digital Design and Synthesis,Prentice Hall, 2nd
edition, 2003.
3. G. De Micheli.Synthesis and optimization of digital circuits, 1st edition, 1994.
4. M. Huth and M. Ryan, Logic in Computer Science modeling and reasoning about systems,
Cambridge University Press, 2nd Edition, 2004
5. Bushnell and Agrawal,Essentials of Electronic Testing for Digital, Memory & Mixed-Signal
Circuits,Kluwer Academic Publishers, 2000

63
 Curriculum of B.Tech Programme in Electronics and Communication Engineering to be applicable
from 2023 batch onwards

ECDC0314 RF Circuit and Antenna Design [3 0 0 3]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO PO PS PS
11 12 O1 O2

CO1 ● ● ● ● ● ● ● ●

CO2 ● ● ● ● ● ●

CO3 ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ● ●

Course Outcomes
CO1: To apply knowledge of basic electromagnetic in RF circuit design
CO2: To analyze single and multi port networks
CO3: To analyze active Rf components
CO4: To design RF circuit such as amplifier, filter

Course Content
Introduction: Importance of Radiofrequency Design, RF Behavior of Passive Components,
Chip Components and Circuit Board Considerations, Microstrip Transmission Lines. (6)
Single-and Multiport Networks: Interconnecting Networks, Network Properties and
Applications, Scattering Parameters, Signal Flow Graph (4)
Antenna Parameters: Isotropic radiators, Radiation pattern, Gain, Directive gain, Directivity,
Reciprocity theorem & its applications, effective aperture, radiation resistance, terminal
impedance, noise temperature, antenna beam width, antenna bandwidth, antenna beam
efficiency, antenna beam area or beam solid angle, Infinitesimal Dipole, small dipole, half wave
dipole, reflection (8)
Antenna Arrays: Introduction, various forms of antenna arrays, arrays of point sources, non-
isotropic but similar point sources, multiplication of patterns. (4)
RF Filter: Basic Resonator and Filter Configurations, Special Filter Realizations, Filter
Implementation. (6)
Active RF Components: Semiconductor Basics, RF Diodes – Schottky, PIN, Varactor,
Bipolar-Junction Transistor, RF Field Effect Transistors, High Electron Mobility Transistors,
LDMOS, FinFET (8)
Matching and Biasing Networks: Impedance Matching Using Discrete Components,
Microstrip Single Stub and Double Stub Networks.(4)

Recommended Books
1. Reinhold Ludwig, Pavel Bretchko, “RF Circuit Design”, 1st Indian Reprint, Pearson
Education Asia (2001).
2. B Razavi, “Design of Analog CMOS Integrated Circuit”, Mc Graw Hill (2000).

64
Curriculum of B.Tech Programme in Electronics and Communication Engineering to be
applicable from 2023 batch onwards

3. R. Jacob Baker, H.W. Li, D.E. Boyce, “CMOS Circuit Design, layout and Simulation”,
PHI (1998).
4. Y. P. Tsividis, “Mixed Analog and Digital Devices and Technology”, TMH (1996).
5. Thomas H. Lee, “Design of CMOS RF Integrated Circuits”, Cambridge University Press
(1998)

65
 Curriculum of B.Tech Programme in Electronics and Communication Engineering to be applicable
from 2023 batch onwards

ECDC0304 Digital Design with HDL [3 0 0 3]

PO PO PO PO PO PO PO PO PO PO PO PO PS PS
1 2 3 4 5 6 7 8 9 10 11 12 O1 O2

CO1 ● ● ● ●

CO2 ● ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ●

Course Outcomes
CO1: Understand design abstraction levels and digital design flow
CO2: Analyze digital systems, identify and handle their design issues
CO3: Implement digital systems using HDL on FPGAs and CPLDs
CO4: Design digital systems for varied applications
Course Content
Section-1 Introduction to Digital Design: Design abstraction levels with Gajski-Kuhn Y-Chart,
Digital Design Flow using CAD (1)
Hardware Description Language: Levels of Design Description, Concurrency, Program
structure, Top-down and Bottomup design methodology, Basic Language Elements, Data
types and Operators, system tasks, compiler directives, Gate-level Modelling, Dataflow
Modelling and Behavioral Modelling, Test Bench Techniques, Design Verification,
Assertion Verification, HDL for combinational circuits (5)
Section-2 Review of digital design fundamentals: Minimization techniques for multi-output circuits,
design of combinational circuits, sequential machine fundamentals, various implementation
approaches for digital systems (6)
Sequential Design using LSI & MSI circuits: Using decoders, multiplexers in sequential
circuits, sequential network design using ROMs, Programmable Logic Devices (PLDs),
Field Programmable gate Arrays (PGAs) (4)
Section-3 Clocked Sequential Finite State Machines (FSM): State diagram, analysis of
synchronous circuits, timing analysis, derivation of state graphs and tables, reduction of
state tables, state code assignment, one-hot encoding, design of Mealy and Moore
synchronous FSMs, HDL for FSMs, design of sequence detectors, serial data code
conversion, design and applications of counters and shift registers. (7)
Multi-input System Controllers Design: System controller, controller design principles,
timing and frequency considerations, DFD development, controller architecture design,
asynchronous input handling, issues of Metastability and controller Faults, state assignment
concepts, flip-flop level implementation using VEM’s, complete design example (7)
Clocking Issues: Clock synchronization, Clock Skew, Delay constraints, Flip-flop timing
parameters, asynchronous inputs to flip-flops, switch debouncing (2)
Section-5 Asynchronous Sequential Finite State Machines: Asynchronous behaviour, analysis of
asynchronous circuits, races and cycles, derivation of primitive flow tables, reduction of
primitive flow tables, state assignments, Hazards, complete asynchronous design examples
(8)
Recommended Books
1. William I Fletcher “An Engineering Approach to Digital Design”, PHI, 3rd Indian reprint,
(1994)

66
Curriculum of B.Tech Programme in Electronics and Communication Engineering to be
applicable from 2023 batch onwards

2. Palnitkar, Samir. Verilog HDL: a guide to digital design and synthesis. Vol. 1. Prentice Hall
Professional, 2003.
3. Jr. Charles H. Roth, “Fundamentals of Logic Design”, Jaico Publishers, 4th Edition, (2002).
4. John Wakerly, “Digital Design, Principles and Practices", Pearson Education, 3rd Ed. (2002)
5. Brown, Stephen D., and Zvonko G. Vranesic. Fundamentals of digital logic with Verilog
design. Vol. 1. New York: McGraw-Hill, 2003.

67
 Curriculum of B.Tech Programme in Electronics and Communication Engineering to be applicable
from 2023 batch onwards

ECDC0306 Control System [3 0 0 3]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12

CO1 ● ● ● ● ●
CO2 ● ● ● ●
CO3 ● ● ● ● ●
CO4 ● ● ● ● ●

Course Outcomes
CO1: Ability to represent the control system via its equivalent models.
CO2: Evaluating the control systems’ stability in time domain and frequency domain.
CO3: Understanding and analysis of controllers and compensators for stability improvements.
CO4: Applying the knowledge of state space models for system analysis.

Course Content

Section-1 Introduction and Representation: Terminology and Basic Structure-Feedforward and

Feedback control theory-Electrical Models-Block diagram Models-Signal flow graphs models-DC and
AC servo Systems-Synchronous -Multivariable control system. (8)
Section-2 Time Response Analysis: Transient response-steady state response-Measures of
performance of the standard first order and second order system-effect on an additional zero and an
additional pole-steady error constant and system- type number-PID control-Analytical design for PD,
PI,PID control systems. (8)
Section-3 Frequency Response and System Analysis: Closed loop frequency response-Performance
specification in frequency domain-Frequency response of standard second order system- Bode Plot —
Polar Plot- Nyquist plots-Design of compensators using Bode plots-Cascade lead compensation-
Cascade lag compensation-Cascade lag-lead compensation. (9)
Section-4 Concept of Stability Analysis: BIBO analysis, Routh criteria, Concept of relative stability:
Root locus, Nyquist stability criteria. (7)
Section-5 State Space Analysis: State variable representation, conversion of state model to transfer
function, solution of state equations, concept of observability and controllability, checking the stability
of linear systems, equivalence between transfer function and state variable representation. (8)

Recommended Books

1. Ogata, K., “Modern Control Engineering,” Prentice Hall.

2. Kuo B C, “Automatic Control System,” Prentice Hall.
3. Gibsen J F, “Control System Components,” Mcgraw Hill
4. Norman S. Nose, “Control System Engineering” Wiley

68
Curriculum of B.Tech Programme in Electronics and Communication Engineering to be
applicable from 2023 batch onwards

ECDC0310 Semiconductor Device Characterization [2 0 0 2]

PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO1 PO1 PO1 PSO PSO
0 1 2 1 2

CO1 ● ● ● ●

CO2 ● ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ●

Course Outcomes
CO1: Understand the significance of various semiconductor device characterization techniques
CO2: Analyze semiconductor device performance under different operating conditions.
CO3: Design experimental setups for semiconductor device characterization.
CO4: Propose solutions to address reliability issues in semiconductor devices based on
characterization data.
Course Content
Section-1 Review of Semiconductor Materials and Devices: Semiconductor crystal structures and
properties. Semiconductor doping and carrier concentration. Basic semiconductor device
operation principles. (3)
Review of Semiconductor Device Models: Semiconductor device models. Physical and
empirical models for diodes, BJTs, and FETs. Modeling of semiconductor device
characteristics. (5)
Section-2 Semiconductor Device Fabrication and Processing: Recap of semiconductor device
fabrication processes. Impact of fabrication techniques on device characteristics.
Introduction to process variation and its effects on device performance (3)
Section-3 Semiconductor Device Characterization Techniques (DC): DC characterization
techniques for diodes and transistors. I-V and C-V measurements. Introduction to parameter
extraction methods (5)
Section-4 Semiconductor Device Characterization Techniques (AC): AC and high-frequency
characterization techniques. Small-signal and large-signal analysis. High-frequency
modeling and characterization. (6)
Section-5 Semiconductor Device Reliability and Testing: Semiconductor device reliability
considerations. Accelerated testing methods. Failure analysis techniques. (6)
Recommended Books
1. Schroder, Dieter K. Semiconductor material and device characterization. John Wiley & Sons, 2015.

69
 Curriculum of B.Tech Programme in Electronics and Communication Engineering to be applicable
from 2023 batch onwards

ECDC0342 Semiconductor Device Characterization Laboratory [0 0 2 1]

PO PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO1 PO1 PO1 PS PS
1 0 1 2 O1 O2

CO1 ● ● ● ● ●

CO2 ● ● ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ●

Course Outcomes
CO1: Gain practical experience in semiconductor device measurement techniques.
CO2: Learn to operate laboratory equipment used in semiconductor device characterization.
CO3: Analyze measurement data to extract device parameters and performance metrics.
CO4: Apply characterization techniques to real-world semiconductor devices
Course Content
Introduction to Laboratory Equipment and Safety Procedures: Overview of laboratory instruments
and setups. Safety protocols and procedures in the laboratory. Introduction to semiconductor device
measurement techniques.
DC Characterization of Diodes and Bipolar Junction Transistors (BJTs):Forward and reverse bias
I-V characterization of diodes.Measurement of diode parameters: forward voltage, reverse saturation
current, etc.DC I-V characterization of BJTs and extraction of parameters.
AC Characterization and Small-Signal Analysis: AC small-signal characterization of semiconductor
devices.Measurement of frequency response and bandwidth.Analysis of small-signal parameters:
transconductance, output conductance, etc.
Capacitance-Voltage (C-V) Measurement Techniques: C-V characterization of MOS
capacitors.Extraction of MOS capacitor parameters: oxide thickness, interface trap density, etc.Analysis
of C-V curves and frequency dependence.
High-Frequency Characterization Techniques: High-frequency measurement setups and techniques.
Measurement of S-parameters for semiconductor devices.Analysis of high-frequency performance and
limitations.
Project Work- Design and Execution: Design and execution of a semiconductor device
characterization project.Selection of appropriate characterization techniques and measurement setups.
Data collection, analysis, and interpretation.

70
Curriculum of B.Tech Programme in Electronics and Communication Engineering to be
applicable from 2023 batch onwards

ECDC0334 Digital Design with HDL Laboratory [0 0 2 1]

PO1 PO PO PO PO PO PO PO PO PO PO PO PS PS
2 3 4 5 6 7 8 9 10 11 12 O1 O2

CO1 ● ● ● ● ●

CO2 ● ● ● ● ● ● ● ●

CO3 ● ● ● ● ● ● ● ●

CO4 ● ● ● ● ● ● ● ●

Course Outcomes
CO5: Knowledge of Hardware Description Languages, CAD tools (Xilinx or equivalent) and FPGA
boards
CO6: Ability to design and synthesize combinational and sequential circuits using different modeling
styles in VHDL
CO7: Ability to verify the synthesize circuits by writing test-benches
CO8: Ability to implement and test simple digital circuits on FPGA boards

Course Content
Following topics should be covered in detail in this lab course:
Setting Up the Development Environment: Installation and configuration of HDL development tools
(e.g., Vivado, Quartus), Introduction to the design workspace and project management
Familiarization with Complete Digital Design Flow, Design Libraries
Basic HDL Syntax and Structure: Understanding modules, ports, and signals, simulation and
synthesis model, Modeling digital circuits using gate-level abstraction, Simulating gate-level models,
Behavioral modeling in HDL
Hierarchy and Modularity in HDL Design: Designing reusable modules and submodules, Creating
hierarchical designs for complex systems
Test Bench Techniques and Simulation: Writing test benches for HDL designs, Simulating designs
to verify functionality and timing
FPGA Design: Familiarization with FPGA Boards, Synthesizing and implementing HDL designs on
FPGAs
List of Experiments:
1. Design of combinational logic circuits- Logic gates, Adders, MUX, DEMUX,
Encoder, Decoder, etc. using different modeling styles in HDL
2. Case Study: Hands-on project to design a complex combinational circuit using HDL
3. Design of Sequential logic - Flip-Flops, Registers, Counters etc. using different
modeling styles
4. Design of sequence detectors, counters and registers
5. HDL implementation of Mealy and Moore FSMs
6. In addition to the above experiments, students will be required to take up Collaborative
projects where they apply all learned concepts to solve a real-world digital design
problem
The list of experiments given above is only suggestive. The instructor may add more design problems.
Recommended Books

71
Curriculum of B.Tech Programme in Electronics and Communication Engineering to be applicable
from 2023 batch onwards

1. Palnitkar, Samir. Verilog HDL: a guide to digital design and synthesis. Vol. 1. Prentice Hall
Professional, 2003.
2. Ciletti, Michael D. Advanced digital design with the Verilog HDL. Vol. 1. Upper Saddle River:
Prentice Hall, 2003.

72
Curriculum of B.Tech Programme in Electronics and Communication Engineering to be
applicable from 2023 batch onwards

ECDC0340 Quantum Device and Fabrication Laboratory [0 0 2 1]

S.No. Name of Practical Objective
1. Band Structure Calculation To perform band structure calculations of semiconductor
and Quantum-mechanical materials. Analyse the band gap, band edges, Numerical atomic
computational orbital basis sets, and effective mass of charge carriers.

2. Density of States (DOS) Calculate the density of states of a semiconductor or

Analysis nanomaterial. Study the distribution of energy states and their
impact on electronic properties.
3. Effective Mass Calculation Determine the effective mass of electrons and holes in
semiconductor materials. Understand the impact of effective
mass on carrier mobility and transport properties.
4. Carrier Transport Simulate carrier transport in semiconductor devices such as
Simulation diodes or transistors. Study carrier drift, diffusion, and velocity-
field characteristics.
5. Cleanroom Protocol Introduce students to cleanroom protocols and safety procedures.
Teach them about cleanroom attire, cleanroom behavior, and
contamination control measures.
6. Thin Film Deposition Introduce students to thin film deposition techniques such as
physical vapor deposition (PVD) and chemical vapor deposition
(CVD). Demonstrate thin film growth on substrates and
characterize film properties.
7. Semiconductor Device Guide students through the fabrication of basic semiconductor
Fabrication devices such as diodes or MOSFETs. Include steps like oxide
growth, photolithography, doping, metallization, and device
testing.
8. Characterization Tools Familiarize students with characterization tools used in
fabrication, such as scanning electron microscopy (SEM), atomic
force microscopy (AFM), and profilometry. Teach data
interpretation and analysis.
9. Quantum Well Simulation Design and simulate a quantum well structure. Investigate the
energy levels, confinement effects, and wave function properties
in the quantum well.
10. Quantum Dot Modeling Model and analyse quantum dot structures. Explore size-
dependent electronic properties, energy levels, and quantum
confinement effects in quantum dots.
11. Optical Properties Simulate optical properties such as absorption, reflection, and
Simulation emission spectra of semiconductor materials. Analyse the optical
band gap, excitonic effects, and absorption coefficients.

12. Semiconductor Laser Design and simulate semiconductor laser structures. Optimize
Design laser cavity dimensions, gain medium properties, and optical
confinement for efficient laser operation.
13. Quantum Hall Effect Simulate the Quantum Hall Effect in two-dimensional electron
Simulation gas (2DEG) systems. Calculate Hall resistance quantization,
electron density, and mobility.
14. Spintronics Device Model spintronic devices such as spin valves or magnetic tunnel
Modeling junctions. Simulate spin transport, spin injection, and
magnetoresistance effects.

73
Curriculum of B.Tech Programme in Electronics and Communication Engineering to be applicable
from 2023 batch onwards

74