1. Granted 23 US patents (22 patents with the first inventor) and 132 total citation count. [online: www.patentbuddy.com/Inventor/Chen-Nan-Jang/11875829];
2. Published 4 journal papers and 17 conference papers (all papers with the first author). [online: ieeexplore.ieee.org];
3. Solved SI/PI/EMI problems for TV/BD-Player/Tablet/Box (tier 1) customers, including Samsung, LG, SONY, Panasonic, Lenovo, amazon, and Foxconn;
4. Development of Anywhere Decap in package with the package subcon;
5. 17 years’ experience for high-speed (SerDes, DDR) channel designs (packages, PCBs, and connectors), guidelines, and patents;
6. Chip-Package-Board co-simulation and verification (for signal and power i...
1. Granted 23 US patents (22 patents with the first inventor) and 132 total citation count. [online: www.patentbuddy.com/Inventor/Chen-Nan-Jang/11875829];
2. Published 4 journal papers and 17 conference papers (all papers with the first author). [online: ieeexplore.ieee.org];
3. Solved SI/PI/EMI problems for TV/BD-Player/Tablet/Box (tier 1) customers, including Samsung, LG, SONY, Panasonic, Lenovo, amazon, and Foxconn;
4. Development of Anywhere Decap in package with the package subcon;
5. 17 years’ experience for high-speed (SerDes, DDR) channel designs (packages, PCBs, and connectors), guidelines, and patents;
6. Chip-Package-Board co-simulation and verification (for signal and power i...
