Allwin21 Product Brochures-Plasma Asher Descum 2024.5.pdf
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Allwin21 Corp. specializes in semiconductor equipment, particularly in rapid thermal processing and plasma asher systems. The Branson/IPC 3000 offers versatile features including high throughput, customizable configurations, and innovative process control technologies. The company focuses on providing reliable support and high-quality solutions tailored for various semiconductor applications.
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Allwin21 Product Brochures-Plasma Asher Descum 2024.5.pdf
- 1. Branson/IPC 3000 Software Key Features Branson/IPC 3000 Specifications* Wafer Size: Sample to 200mm Capability. Multiple wafer size without hardware change Throughput: High Throughput. Up to 75 WPH. Process Dependent . Temperature: No heating function. N2 plasma can heat the substrate up to 170 C. Gas Lines: Up to 5 gas lines with MFCs. Popular MFC Range: 2 SLM O2 and 1 SLM N2 . Asher Rate: 0-0.1u/min. positive PR; >0.2u/min. negative PR Uniformity: 25%. Clear all photoresist without uniformity requirement Particulate: <0.05 /cm2 (0.03um or greater) Damage: Low damage with Faraday Cage if necessary. Selectivity: >1000:1 MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime Company Introduction and Main Products ALLLWIN21 CORP. Introduction Equipment Key Features Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Process tool. We are manufacturing the new AccuThermo AW Series Atmospheric and Vacuum Rapid Thermal Processors. Compared with traditional RTP systems, Allwin21’s AccuThermo AW RTPs have innovative software and more advanced real time temperature control technologies to achieve the BEST rapid thermal processing performance (repeatability, uniformity, and stability) with decades of research directly applicable to ours. We focus on extending product lifecycle, providing solutions, and engineering enhancements to many production proven semiconductor process equipment most directly related to III-V processing. These semiconductor equipment ha e een used in production and D since the 0 s hey ha e pro en processes and research. Allwin21 Corp. can customize these systems with All in2 s compara le inte rated process control system ith PC, solid robotic wafer transfer system, and new critical components. This is to achieve the goal of giving our customers a production edge, with right cost, and without having to worry about obsolete parts. Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE, Sputter Deposition and Metal Film Metrology high-tech semiconductor equipment, services and technical support in Semiconductor III-V, MEMS, Biomedical, Nanotechnology, Solar, Battery & LED industries. We endeavor to be a leader in our product lines. To achieve this, we have been providing unique innovative and cost-effective technical solutions, high quality equipment, and on time spare parts delivery worldwide. We have maintained a global presence that has grown and expanded into the major high-tech manufacturing areas of the world. We pride ourselves on developing and continuing lasting customer relationships. We understand that a timely responsive support and service are critical elements in semiconductor industries. Allwin21’s experienced engineer team is the best guarantee for high quality service and support. We provide on-site installation, training, maintenance, system optimization, retrofits, and/or customized upgrades Allwin21 Overview What sets us apart from the competition… 1) Exclusive licensed manufacturer of Heatpulse 610 of AG Associates. 2) Advanced Allwin21 Real Time PC Control Technology. 3) Focus on Production-Proven process technology. 4) Integrated 3-axis solid robotic wafer transfer technology. 5) Experienced local engineer support. 6) Products made in U.S.A Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, atri 0 , atri 20 , atri 303, atri 403, atri 0 , atri 04, atri 02, atri 0 , atri 0 Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, asonics Aura 000, asonics Aura 2000, asonics Aura 3000, asonics 3 0, asonics Aura 30 0 Plasma Etcher, Please Etchin , Dry Etchin , Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, e al 0 e, e al 03e, e al 0 e , e al Plasma Etcher, Please Etchin , Dry Etchin , Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, asonics AE 200 , icro a e Etcher, icro a e Plasma Etcher, icro a e Etch apid hermal Process, apid hermal Processin , apid hermal Anneal, apid hermal Annealin , apid hermal idation, apid hermal itride, A, P, , ,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, A 2 0, A 3 0, A 4 0, A 0, A 0I, A Associates, eatpulse 2 0, eatpulse 4 0, inipulse 3 0, eatpulse 0, eatpulse 0I, A eatpulse 4 0, A eatpulse 0, A eatpulse 2 0, A inipulse 3 0, eatpulse 4 00, eatpulse 4 0 , eatpulse 0 , eatpulse 00, Atmospheric apid hermal Process, acuum apid hermal Process, urnace, en, hermal urnace, hermal Process, hermal Processin 1) Rapid Thermal Process • AccuThermo AW 610M • AccuThermo AW 820M • AccuThermo AW 820V • AccuThermo AW820R 2) Sputter Deposition • AccuSputter AW 4450 3) Plasma Asher Descum • AW-105R • AW-1008 • AW-B3000 4) Plasma Etch/RIE • AW-901eR • AW-903eR • AW-2001R 5) Upgraded Kit for: • Heatpulse 210,310,410,610 • Matrix X0X • Tegal 90Xe • Gasonics Aura 1000/2000LL/3000/3010 • Gasonics AE 2001/2000LL • Gasonics L3510/L3500 • Perkin-Elmer 24XX,4XXX Sputter • MRC 6XX, 9XX Sputer • TES 6XX,9XX Sputter • Branson/IPC 3000/2000/4000 • Lam AutoEtch 490/590/69 • Lam Rainbow 4XXX Series 6) Sheet Resistance Measurement • AWgage-150 • AWgage-200 Tel.: 408-778-7788 E-mail: [email protected] Website: www.allwin21.com All specification and information here are subject to change without notice and can not be used for purchase and facility plan. Address:220 Cochrane Circle, Morgan Hill,CA95037, U.S.A.
- 2. Plasma Asher Descum Tel.: 408-778-7788 E-mail: [email protected] Website: www.allwin21.com All specification and information here are subject to change without notice and can not be used for purchase and facility plan. Address:220 Cochrane Circle, Morgan Hill,CA95037, U.S.A. Introduction Allwin21 Corp. has been focusing on providing solutions and enhancements to plasma asher descum semiconductor process. These OEM asher descum semiconductor equipment have been used in production and R&D since 1990′s. They have been Process-Proven. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC, solid 3-axis robotic wafer transfer system, and new critical components to achieve the goal of giving our customers a production edge. Introduction Plasma Asher Descum Key Features Production-proven plasma Asher/Descum system. Frontside and backside isotropic removal. Consistent wafer-to-wafer process cycle repeatability. Can handle 50um thickness wafer. PC controller with Advanced Allwin21 Software. Endpoint detection (EOP) -Optional Pressure control with Throttle Valve. 15-inch Touch screen monitor GUI. EMO, Interlocks, and Watchdog function. GEM/SECS II (optional). Small Footprint Made in U.S.A. Plasma Asher Descum Software Key Features o Real time graphics display, process data acquisition, and analysis. o Closed-loop process parameters control. o Precise parameters profiles tailored to suit specific process requirements. o Programmable comprehensive calibration of all subsystems from within the software. This allows faster, easier calibration, leading to enhanced process results. o Recipe creation to ensure process repeatability. It features a recipe editor to create and edit recipes to fully automate the processing of wafers inside the process chamber. o Validation of the recipe so improper control sequences will be revealed. o Storage of multiple recipes, process data, and calibration files so that process & calibration results can be maintained or compared over time. o Passwords provide security for the system, recipe editing, diagnostics, calibration, and setup functions. o Simple and easy to use menu screen which allow a process cycle to be easily defined and executed. o Troubleshooting features which allows engineers and service personnel to activate individual subassemblies and functions. More I/O and AD/DA “exposure”. o DB-25F parallel (printer) port. The computer interfaces to the Allwin21 system with only one cable: the control interface cable. o The control board inside the machine that translates the computer commands to control the machine has a watchdog timer. If this board loses communication with the control software, it will shut down all processes and halt the system until communication is restored. o GEM/SECS II function (Optional). o Advanced Allwin21 End of Process (EOP) function (Optional) Applications GaAs, InP, GaN, SiC wafer Strip (Mainly) GaAs, InP, GaN, SiC wafer Descum (Mainly) Thin Film Head Resist Cleaning Opto-Electronic Devices Cleaning Dry Descum, Clean Photoresist Stripping Controlled Resist Removal AW-105R AW-1008 AW-B3000 Production-proven Reactor
- 3. Plasma Asher Descum ALLLWIN21 CORP. AW-105R for compound materials AW-105R Configuration Main Frame with Circuit Breakers, Solenoid Valves Pentium Class PC with AW Software Keyboard, Mouse, USB SW backup, and Cables Chuck /w Heat, Pump Ring ,Lift Pins ① 2-4 inch; ② 2-6 inch; ③ 4-6 inch; ④ 6.125 inch; ⑤ 6.25 inch Center Aligner and Cassette Station ① Two Dimensions ② Four Dimensions Anodized Reactor with Door Chamber Base plate with water sensor Base Plate and Reactor Ceramic Ring Base Plate and Chuck Ceramic Ring Upper and Lower Electrodes Quartz showerhead & Diffusion Disk Main Control and Distribution PCBs 3-axis Integrated Robust Solid Robot RF Matching Network with PCBs 13.56MHz RF Generator ① 300W ② 600W MFC /w In-line Filter and Solenoid Isolation Valve ① One MFC; ② Two MFCs; ③ Three MFCs AC/DC Box with Temperature Controller MKS Baratron with Isolation Valve Lamp Tower Alarm w/ Buzzer Throttle Valve Main Vacuum Valve Front EMO, Interlocks 15-inch Touch Screen GUI End-of-Process (EOP) GEM/SECS II (Software) Vacuum Pump Chiller for Chamber Base Plate AW-105R Specifications Wafer Size: Up to 6.25 inch. Temperature: 60-250ºC (±2ºC) Gas Lines: Up to three gas lines with MFCs. Typical MFC configuration: 5 SLM O2 and 500 SCCM N2. Asher Rate: 0.5-1.5 um/min at 200 to 250 ºC, bulk strip; 600 A/min at 100 ºC, Descum Uniformity: <±8% (Max-Min) Strip; <±5% (Max-Min) Descum Particulate: <0.05 /cm2 (0.3um or greater) Damage: CV:<0.1V from control; Mobile Ion:<1-2 E10 ; Vt :0% total shift on 98%of points tested no shift >5% Selectivity: >1000:1 MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime AW-105R Facilities Plumbed Process Gases: O2 N2 Cooling water: 1GPM house circulating supply @ <23 ± 2°C Facility Exhaust: 100 CFM @ 1” static pressure Vacuum supply for Robot: 11.8”Hg(-5.8psi) / 0.1CFM airflow Power: 190-240VAC, single phase, 30A, 50/60Hz (NEMA L-6-30P plug supplied) The AW-105R single-wafer photoresist asher and descum is an automated tool designed as a flexible 13.56MHz RF Parallel Plate downstream plasma photoresist removal and descum system for high-volume wafer fabrication. The AW-105R is in direct response to manufacturer’s concerns for wafer uniformity, uptime, reliability and production-proven technology. Integrated Robust Solid Robot Options Introduction Tel.: 408-778-7788 E-mail: [email protected] Website: www.allwin21.com All specification and information here are subject to change without notice and can not be used for purchase and facility plan. Address:220 Cochrane Circle, Morgan Hill,CA95037, U.S.A. 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- 4. Plasma Asher ALLLWIN21 CORP. AW-1008 The AW-1008 single-wafer photoresist asher is an automated tool designed as a flexible downstream Microwave plasma photoresist removal system for high-volume wafer fabrication. The AW-1008 is in direct response to manufacturer’s concerns for wafer sensitivity to processing RF damage, uptime, reliability and production- proven technology. AW-1008 Configuration 15-inch Touch Screen GUI Main Frame with Breakers, Relays and Wires Pentium Class PC with AW Software Keyboard, Mouse, USB with SW backup and Cables Quartz Tray ① 3-4 inch; ② 4-6 inch; ③ 5 i nch; ④ 6 inch; ⑤ Others Fixed Cassette Station ① Two Cassette Stations; ② One Cassette Station Lamp Heat Module and Quartz Window (3 of 1000W IR lamp) 6 inch Quartz showerhead and 5 inch Diffusion Disk Chamber Top Plate and Body with TC for Close Loop Temperature Control (CLTC) Main Control, Distributor PCB and DC H1-7X10.5 Integrated Solid Robot Waveguide and Quartz Plasma Tube Blower for Magnetron and Waveguide Capacitor, Two Transformers, HV Diode 1000W Air cooling magnetron 1-4 Gas Lines w/ Pneumatic Valve, and MFC ① One MFC; ② T wo MFCs; ③ T hree MFCs; ④ Four MFCs AC Box and Lamp Control PCB for Close Loop Temperature Control (CLTC) Main Vacuum Valves. Two, one for Fast and on for slow pump down Options MKS Baratron Throttle Valve Front EMO, Interlocks End-of-Process (EOP) GEM/SECS II (Software) Vacuum Pump 1.25KW power Options AW-1008 Specifications Wafer Size: 3 ,4,5,6 inch Capability. Multiple wafer size without hardware charge. Temperature: 150-350 ºC (±2 ºC) capability Gas Lines: Up to four gas lines with MFCs. Popular MFC Range: 5-10 SLM O2 and 1 SLM N2. Asher Rate: 1.5u-5u/min. positive photoresist; >8u/min. negative photoresist Uniformity: 15%, Process Dependent Particulate: <0.05 /cm2 (0.3um or greater) Damage: CV: <0.I V CV-shift for 250A gate oxide Selectivity: >1000:1 MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95%uptime *Contact Allwin21 sales for other applications and specifications AW-1008 Facilities Vacuum Chamber Pump = 165 cfm Cabinet Exhaust = >250 cfm Plumbed Gases:O2, N2 Electrical Requirements: 208VAC, 3-Phase, 60Hz, 30Amps Weight = 350lbs. Integrated Robust Solid Robot Introduction Tel.: 408-778-7788 E-mail: [email protected] Website: www.allwin21.com All specification and information here are subject to change without notice and can not be used for purchase and facility plan. Address:220 Cochrane Circle, Morgan Hill,CA95037, U.S.A. Matrix 105, Matrix 205, Matrix 303, Matrix 403,Matrix 106,Matrix 104, Matrix 102,Matrix 101, Matrix 10, System One Stripper, Model 105, System One Etcher, model 303, model 403,Matrix 1107, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics Aura 3000, Gasonics L3510, Gasonics Aura 3010, Plasma Etcher, Plasma Etching, Dry Etching, Dry Clean,Gasonics AE 2001, Gasonics AE 2000LL,Plasma Asher Equipment, plasma Descum equipment, Dry asher equipment, Dry clean equipment, dry descum equipment, semiconductor process equipment, semiconductor equipment, used semiconductor equipment, front end equipment , 等离子去胶机, 自动去胶机，手动去胶机, 干法去胶机，湿法去胶机，等離子去膠機，自動去膠機，手動去膠機，乾式去膠機，濕式去膠機，半导体设备，半导体旧设备，半导 体中古设备，半导体前道工艺设备，半导体后道工艺设备，半导体前道设备，半导体后道设备，半導體設備，半導體舊設備，半導體中古設備，半導體前道製程設備，半導體後道製程設備，半導體前道設備，半導體 後道設備 Tegal901e,Tegal903e,Tegal901eTTW,Tegal915,Tegal701,Tegal703,Tegal801,Tegal803,Tegal981e,Tegal903e,Tegal915,Tegal965,Tegal405,Tegal401,LamAutoEtch490,LamAutoEtch590,LamAutoEtch690,LamAutoEtch790,LamRainbow4400, LamRainbow4420,LamRainbow4428,LamRainbow4500,LamRainbow4520,LamRainbow4528,LamRainbow4600,LamRainbow4620,LamRainbow4628,LamRainbow4700,LamRainbow4720,LamRainbow4728,GasonicsAE2001,Microwave Etcher,MicrowavePlasmaEtcher,MicrowaveEtch,DownstreamPlasmaEtch,PlasmaEtcher,PlasmaEtching,DryEtching,DryClean,semiconductorprocessequipment,semiconductorequipment,usedsemiconductorequipment,frontendequipment,等 离子刻蚀，深刻蚀，各向同性，各向异性，等离子清洗，溅射台，蒸发台，磁控溅射台，直流电源溅射，高频溅射，自动刻蚀机，手动刻蚀机，干法刻蚀机，湿法刻蚀机，半导体量测仪器，半导体量测设备，等離子 蝕刻，深刻蝕，各向同性，各向異性，等離子清洗，濺射台，蒸發台，磁控濺射台，直流電源濺射，高頻濺射，自動蝕刻機，手動蝕刻機，乾法蝕刻機，濕蝕刻機， RFQ for Fast Free Quotation
- 5. Plasma Asher Descum ALLLWIN21 CORP. AW-B3000 Barrel Batch The AW-B3000 batch/barrel photoresist asher is a manual load tool designed as a flexible 13.56 MHz RF plasma photoresist removal system for high-volume wafer fabrication. The AW-B3000 is in direct response to manufacturer’s concerns for Uptime, Reliability, Production-Proven technology. and low cost of ownership. AW-B3000 Configuration Main Body with wires Control Box Pentium Class PC with AW Software Keyboard, Mouse, USB with SW backup and Cables Main Control PCB and DC Transformer, Circuit Breaker,Contactor 1-5 Isolated Gas Lines w/ Pneumatic Valve and MFC Purge has manual regulator in controller box to control speed. Quartz Chamber: Dia 12” x Depth 23”; RF Match Network Integrated in the Main Body of tool. Chamber Door with quartz plate in the Main Body. Gas and vacuum lines Connections in the Main Body 13.56MHz RF Generator (Air-Cooled ) ① 300W; ② 600W; ③ 1000W; ④ 1200W Lamp tower alarm with buzzer Main Vacuum Valve MKS Baratron Throttle Valve Front EMO, Interlocks 15-inch Touch Screen GUI Introduction End-of-Process (EOP) function. GEM/SECS II function (Software) Thermocouple for Chamber Temperature Vacuum Pump Table for AW-B3000 Options AW-B3000 Specifications Wafer Size: Sample to 200mm Capability. Multiple wafer size without hardware change High Throughput: Up to 75 WPH. Process Dependent. Temperature: Only TC Option can be used for N2 plasma to heat the substrates up to 170°C. Gas Lines: Up to 5 isolated gas lines with MFCs. Asher Rate: 0-0.1u/min. positive PR; >0.2u/min. negative PR. Slower if Faraday Cage is used Uniformity: Up to 25%. Much lower with Faraday Cage. Particulate: <0.05 /cm2 (0.3um or greater) Damage: Low damage with Faraday Cage. Selectivity: >1000:1 MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better. 95% uptime AW-B3000 Facilities Vacuum Chamber Pump = 165 cfm Cabinet Exhaust = >250 cfm Plumbed Gases:O2, N2 Electrical Requirements: 208VAC, 3-Phase, 60Hz, 30Amps Weight = 180lbs. Tel.: 408-778-7788 E-mail: [email protected] Website: www.allwin21.com All specification and information here are subject to change without notice and can not be used for purchase and facility plan. Address:220 Cochrane Circle, Morgan Hill,CA95037, U.S.A. RFQ for Fast Free Quotation