Presented By:
Yaser Shahbaaz
12J01A1223
 Phonebloks is an open-source modular
smartphone concept.
 primarily to reduce electronic waste.
 By attaching individual third-party
components (called "bloks") to a main board,
a user would create a personalized
smartphone
 These bloks can be replaced at will to replace
a broken blok, to upgrade an existing blok
 Bloks would be available in Blokstore, "an app
store for hardware", where users could buy
new and used bloks as well as sell back their
old ones
GOOGLE Project ARA
- In September 2013,Dutch designer
Dave Hakkens announced the
Phonebloks modular phone concept
independently in September 2013
- Motorola publicly announced Project
Ara on October 29,2013 and said they
will be working collaboratively with
Phonebloks
Dave Hakkens-Master
mind behind the
concept ‘Phonebloks’
 The Project Ara smartphone will allow
everyone to build their own perfect
smartphone.
 Where one person may want to spend more
money on a high power camera, another may
wish to splash out on more memory.
Whatever the desired goal a user should be
able to modify their device to suit that need.
 The Ara is a modular smartphone.
 The name of mechanical designer of this
smartphone is Ara.
First prototype of Ara launched in 0ct 2014.
GOOGLE Project ARA
 The newest Project Ara prototype is called Spiral 2.
 It's a block-based modular smartphone and builds
upon the MDK version 0.20.
 1280 x 720 display
 light and proximity sensors
 5-megapixel camera
 Wi-Fi and Bluetooth
 3G modem with a Band 2 antenna, separate Band 5
antenna
 Battery
 speaker module
 Marvell PXA1928 or NVIDIA Tegra K1 processor block.
GOOGLE Project ARA
 LED-packed flashlight
powered by Energizer
 Extended battery
 A fingerprint reader
 A breathalyzer
 Abreath strips dispenser
 It also sports a leather
flip cover that uses an E-
ink secondary display
 Spiral 3, the next Project Ara prototype.
 It will feature an inductive data connection
on the phone so modules and the endo can
communicate with no actual contact.
 Spiral 3 will also support 4G/LTE.
 Spiral 2 has a 1x1 block that includes a
microUSB port for charging and syncing, but
Spiral 3 will feature wireless connections
instead
 Launch in Puerto Rico
 MDK 0.5
 20-30 modules
GOOGLE Project ARA
 The most important piece of hardware is the
chassis called the "Endoskeleton
 it's where all the modular components will slide
in and attach to the Endo’s slots.
 In that a central "spine" traverses the length of
Project Ara phones, with "ribs" branching out to
split the phone into rectangular subsections.
 The sizes of the Endoskeletons are:
Small – 45x118x9.7mm (about the size of classic
Nokia 3310)
Medium – 68x141x9.7mm (about the size of
Samsung Galaxy S5)
Big – 91x164x9.7mm (slightly bigger than iPhone
6 Plus)
GOOGLE Project ARA
 Modules are building
blocks of phone
 It fits in the endo
structure
 These modules, which can
be 1x1, 1x2, or 2x2 blocks
 The brains of a Project Ara
phone the CPU and
memory live in a primary
Application Processor
module, which takes up a
2x2 module.
 you won't be able to split
up the the AP--- processor,
memory, SD card slot
GOOGLE Project ARA
 3D printed module cases
 Customers can select:
- Colour
- Material
- Image
- Text
- Inscriptions
 Easily replaceable cases
GOOGLE Project ARA
 Even though the modules know how to speak
to each other, they need a way to physically
connect to the Endo.
 The second technology Project Ara uses is
capacitive M-PHY, a physical layer developed
by the MIPI Alliance and made to work with
UniPro
 M-PHY is a capacitive interface, which means
that the connection points won't be worn
down over time from swapping modules in
and out of the phone
 M-PHY interface block calls for 10 connection
points, eight of which are for data (four pairs
of lanes), one for power, and one for ground.
 UniPro/M-PHY interface has enough
bandwidth 10Gb/s for most modules, 20Gb/s
for large modules
 The final technology in Project Ara's module
design is the use of electropermanent
magnets for affixing the modules in place in
the Endo
 electropermanent magnets only use current
to flip magnetization on and off
 Each interface block is composed of 4
electrical connections (2 for power, 1
detect/wake, and 1 RF) and 8 data interfaces
transferred by means of 4 contactless
inductive pads as shown in figure below (1×2
modules have 2 sets of electrical connections
to enable module insertion in both
orientations)
 The Project Ara team would sell the exoskeleton for a set price
$ 50
 Includes
-Wi-Fi chip
- Processor
- Screen
- Battery
 Then make a module store, much like the Google Play app
marketplace, available so you can buy modules to upgrade your
exoskeleton
 Many third-party developers are working with the Project Ara
team. Sennheisser will be developing specialised audio modules
and Toshiba has recently announced the first camera modules for
the smartphone.
 . It's expected that in the future other companies will be able to
sell their hardware add-ons through this platform
 The latest Android operating system will be
modified slightly to make it suitable for the
Ara. The project's team leader. Paul
Eremenko, has promised the Android team is
working to make sure the Ara phone is a
priority and gets the latest updates.
GOOGLE Project ARA
 Processor module
 pollution sensor module that turns your
smartphone into a portable air-quality gage
of sorts.
 biometric sensor
 Sennheiser Audio Modules
 game controller,
 fingerprint scanner
 media control button module
 NFC chip
 Toshiba camera module
 Marvell and Nvidia (application processors)
 Vestigen (health modules)
 Yezz (wide range of modules with different
functionalities)
 InnoLux (display module)
 Phison in partnership with Kingston (data
storage modules)
 Intersoft Eurasia (radiation sensor module),
 Project Ara will launch a pilot programme
that will take place in Puerto Rico.
 This was scheduled for 2015 but got moved
back to 2016.
 There will be an initial test market in a few
US locations.
 An entry-level Ara device is expected to be
$100.
 Solar powered batteries
 Customization
 Eco-friendly/reduces E-waste
 Spiral 2 supports hot-swapping those modules.
 Modules are hot swappable
 Modules can have multiple functions
 dummy module that does nothing. The dummy
module showed that developers will have about
40% of the PCB add their own hardware
 used a Samsung screen that didn't take up all
of the space available, so they packed in
another small battery
 gamer phone
 it could even be your car key.
 You can upgrade different parts of your
phone when you need
 Share a module with your family, or swap one
with your friends.
 Now you don’t have to throw your phone
away every few years
 It will be bigger and heavier than a
standard phone
 It will be more expensive
 The connectors are bound to cause
problems:
 Certain combinations won’t work:
 It won’t be optimized
 How many combinations can there really
be?
Puzzlephone Fairyphone 2 Project Ara
$333
64-bit ARM
Octa-core 3 GB
of RAM, a 5-
megapixel front
camera, 12-
megapixel main
shooter,
2,800 mAh
battery pack
Screw driver
needed to
separate
modules
$580
5-inch phone,
which is fitted
with a
Qualcomm
Snapdragon 801
SoC, 2 GB of
RAM, 8-
megapixel main
camera, a 2,420
mAh battery
and 32 GB of
eMMc storage
Screw driver
needed to
separate
modules
$100 (basic)
Marvell PXA1928
or NVIDIA Tegra
K1 processor
block
No need of
screw driver to
separate the
modules
 YEZZ offers a lineup of additional 28 module
 Keyboard Case module is a a slim, compact, and
completely cable-free keyboard
 Laser Pointer & PPT Controller modul
 eMask Connector module allows for the viewing of
messages and incoming calls, music control, see
friend’s locations as well as speed and analysis of
jumps
 Microscope with LED Light module is a microscope
with built-in LED light for analysis
 Mini high-capacity flash drive module based on solid
state storage technology
 Mirror module. May be useful for women
 MP3 module stores and manages music
 An identity module is just in the conception stages at
this point but could contain all your IDs, security
certificates, and other information.
GOOGLE Project ARA
Thus we could say Next-Gen Smartphone
Project Ara is a kind of innovation that would
allow individual to intellectually design a
modular smart phone based on there desired
feature
It has also made a step towards reducing the e-
waste and contributing to the healthier side of
environment
 http://www.projectara.com/
 http://gadgets.ndtv.com/mobiles/news/goog
le-delays-project-ara-modular-phone-launch-
until-2016-729099
 https://www.androidpit.com/project-ara-
release-date-news-specs-features
 https://phonebloks.com/
 www.yezzara.com/
GOOGLE Project ARA

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GOOGLE Project ARA

  • 2.  Phonebloks is an open-source modular smartphone concept.  primarily to reduce electronic waste.  By attaching individual third-party components (called "bloks") to a main board, a user would create a personalized smartphone  These bloks can be replaced at will to replace a broken blok, to upgrade an existing blok  Bloks would be available in Blokstore, "an app store for hardware", where users could buy new and used bloks as well as sell back their old ones
  • 4. - In September 2013,Dutch designer Dave Hakkens announced the Phonebloks modular phone concept independently in September 2013 - Motorola publicly announced Project Ara on October 29,2013 and said they will be working collaboratively with Phonebloks Dave Hakkens-Master mind behind the concept ‘Phonebloks’
  • 5.  The Project Ara smartphone will allow everyone to build their own perfect smartphone.  Where one person may want to spend more money on a high power camera, another may wish to splash out on more memory. Whatever the desired goal a user should be able to modify their device to suit that need.
  • 6.  The Ara is a modular smartphone.  The name of mechanical designer of this smartphone is Ara. First prototype of Ara launched in 0ct 2014.
  • 8.  The newest Project Ara prototype is called Spiral 2.  It's a block-based modular smartphone and builds upon the MDK version 0.20.  1280 x 720 display  light and proximity sensors  5-megapixel camera  Wi-Fi and Bluetooth  3G modem with a Band 2 antenna, separate Band 5 antenna  Battery  speaker module  Marvell PXA1928 or NVIDIA Tegra K1 processor block.
  • 10.  LED-packed flashlight powered by Energizer  Extended battery  A fingerprint reader  A breathalyzer  Abreath strips dispenser  It also sports a leather flip cover that uses an E- ink secondary display
  • 11.  Spiral 3, the next Project Ara prototype.  It will feature an inductive data connection on the phone so modules and the endo can communicate with no actual contact.  Spiral 3 will also support 4G/LTE.  Spiral 2 has a 1x1 block that includes a microUSB port for charging and syncing, but Spiral 3 will feature wireless connections instead  Launch in Puerto Rico  MDK 0.5  20-30 modules
  • 13.  The most important piece of hardware is the chassis called the "Endoskeleton  it's where all the modular components will slide in and attach to the Endo’s slots.  In that a central "spine" traverses the length of Project Ara phones, with "ribs" branching out to split the phone into rectangular subsections.  The sizes of the Endoskeletons are: Small – 45x118x9.7mm (about the size of classic Nokia 3310) Medium – 68x141x9.7mm (about the size of Samsung Galaxy S5) Big – 91x164x9.7mm (slightly bigger than iPhone 6 Plus)
  • 15.  Modules are building blocks of phone  It fits in the endo structure  These modules, which can be 1x1, 1x2, or 2x2 blocks  The brains of a Project Ara phone the CPU and memory live in a primary Application Processor module, which takes up a 2x2 module.  you won't be able to split up the the AP--- processor, memory, SD card slot
  • 17.  3D printed module cases  Customers can select: - Colour - Material - Image - Text - Inscriptions  Easily replaceable cases
  • 19.  Even though the modules know how to speak to each other, they need a way to physically connect to the Endo.  The second technology Project Ara uses is capacitive M-PHY, a physical layer developed by the MIPI Alliance and made to work with UniPro  M-PHY is a capacitive interface, which means that the connection points won't be worn down over time from swapping modules in and out of the phone  M-PHY interface block calls for 10 connection points, eight of which are for data (four pairs of lanes), one for power, and one for ground.
  • 20.  UniPro/M-PHY interface has enough bandwidth 10Gb/s for most modules, 20Gb/s for large modules  The final technology in Project Ara's module design is the use of electropermanent magnets for affixing the modules in place in the Endo  electropermanent magnets only use current to flip magnetization on and off
  • 21.  Each interface block is composed of 4 electrical connections (2 for power, 1 detect/wake, and 1 RF) and 8 data interfaces transferred by means of 4 contactless inductive pads as shown in figure below (1×2 modules have 2 sets of electrical connections to enable module insertion in both orientations)
  • 22.  The Project Ara team would sell the exoskeleton for a set price $ 50  Includes -Wi-Fi chip - Processor - Screen - Battery  Then make a module store, much like the Google Play app marketplace, available so you can buy modules to upgrade your exoskeleton  Many third-party developers are working with the Project Ara team. Sennheisser will be developing specialised audio modules and Toshiba has recently announced the first camera modules for the smartphone.  . It's expected that in the future other companies will be able to sell their hardware add-ons through this platform
  • 23.  The latest Android operating system will be modified slightly to make it suitable for the Ara. The project's team leader. Paul Eremenko, has promised the Android team is working to make sure the Ara phone is a priority and gets the latest updates.
  • 25.  Processor module  pollution sensor module that turns your smartphone into a portable air-quality gage of sorts.  biometric sensor  Sennheiser Audio Modules
  • 26.  game controller,  fingerprint scanner  media control button module  NFC chip
  • 28.  Marvell and Nvidia (application processors)  Vestigen (health modules)  Yezz (wide range of modules with different functionalities)  InnoLux (display module)  Phison in partnership with Kingston (data storage modules)  Intersoft Eurasia (radiation sensor module),
  • 29.  Project Ara will launch a pilot programme that will take place in Puerto Rico.  This was scheduled for 2015 but got moved back to 2016.  There will be an initial test market in a few US locations.  An entry-level Ara device is expected to be $100.
  • 30.  Solar powered batteries  Customization  Eco-friendly/reduces E-waste  Spiral 2 supports hot-swapping those modules.  Modules are hot swappable  Modules can have multiple functions  dummy module that does nothing. The dummy module showed that developers will have about 40% of the PCB add their own hardware
  • 31.  used a Samsung screen that didn't take up all of the space available, so they packed in another small battery  gamer phone  it could even be your car key.  You can upgrade different parts of your phone when you need  Share a module with your family, or swap one with your friends.  Now you don’t have to throw your phone away every few years
  • 32.  It will be bigger and heavier than a standard phone  It will be more expensive  The connectors are bound to cause problems:  Certain combinations won’t work:  It won’t be optimized  How many combinations can there really be?
  • 33. Puzzlephone Fairyphone 2 Project Ara $333 64-bit ARM Octa-core 3 GB of RAM, a 5- megapixel front camera, 12- megapixel main shooter, 2,800 mAh battery pack Screw driver needed to separate modules $580 5-inch phone, which is fitted with a Qualcomm Snapdragon 801 SoC, 2 GB of RAM, 8- megapixel main camera, a 2,420 mAh battery and 32 GB of eMMc storage Screw driver needed to separate modules $100 (basic) Marvell PXA1928 or NVIDIA Tegra K1 processor block No need of screw driver to separate the modules
  • 34.  YEZZ offers a lineup of additional 28 module  Keyboard Case module is a a slim, compact, and completely cable-free keyboard  Laser Pointer & PPT Controller modul  eMask Connector module allows for the viewing of messages and incoming calls, music control, see friend’s locations as well as speed and analysis of jumps  Microscope with LED Light module is a microscope with built-in LED light for analysis  Mini high-capacity flash drive module based on solid state storage technology  Mirror module. May be useful for women  MP3 module stores and manages music  An identity module is just in the conception stages at this point but could contain all your IDs, security certificates, and other information.
  • 36. Thus we could say Next-Gen Smartphone Project Ara is a kind of innovation that would allow individual to intellectually design a modular smart phone based on there desired feature It has also made a step towards reducing the e- waste and contributing to the healthier side of environment
  • 37.  http://www.projectara.com/  http://gadgets.ndtv.com/mobiles/news/goog le-delays-project-ara-modular-phone-launch- until-2016-729099  https://www.androidpit.com/project-ara- release-date-news-specs-features  https://phonebloks.com/  www.yezzara.com/

Editor's Notes

  • #14: Made from aluminium Water and dust-proof
  • #16: Front modules reach across the entire width of a particular Endoskeleton frame, while rear modules come in three standard sizes (1×1, 1×2, and 2×2) and can fit into multiple frame sizes. The rear of the Endo is parceled into 1×1 unit squares. Each 1×1 square is approximately 22mm. 1×2 and 2×2 modules are approximately 22x44mm and 44x44mm respectively.
  • #22: The interface block is itself mounted and printed on a separate PCB (printed cirquit board). The interface block PCB is then soldered to the main PCB. When installed into the module, the interface block PCB should be completely flush with the corresponding opening in the module base. The interface block PCB must follow the geometry specified in the module template CAD and EDA files provided in the reference implementation withing MDK (Module Developers Kit). The interface block in the current prototype platform differs from the objective specification. Instead of contactless data transfer with inductive pads, the prototype uses electrical signaling between the gold-plated copper pads on the module interface block and spring pins on the Endo for data transfer (i.e., the same method used for power transfer). The shape of the prototype interface block pad is round to match the spring pins on the Endo. The module template section provides design artifacts for the prototype interface block reference implementation. The prototype interface block provides 8 data pads: two bidirectional M-PHY data lanes with 8 differential pairs (2 TX pairs and 2 RX pairs), a power pad, a ground pad, a detect/wake pad, and an RF pad. Figure and table below detail the pinouts of the prototype interface block.