Video: The State of the Solid State Drive SSD
2 likes•1,225 views
The document discusses the transition from 2D NAND to 3D NAND technology for solid state drives (SSDs), highlighting the limitations of 2D NAND and the advantages of 3D NAND in addressing data storage demands driven by rapid data generation and market growth. It outlines potential risks and uncertainties affecting Western Digital's expectations and performance, and emphasizes the importance of engagement with experts for service providers to leverage SSD capabilities for new applications. The content also covers market trends, the evolution of NAND technology, and the implications for data center growth and product development.
Video: The State of the Solid State Drive SSD
- 1. 1
- 2. State of the Solid State Drive (SSD):The Transition from 2D NAND to 3D NAND Walter Hinton, Senior Global Director Enterprise & Client Compute Solutions Marketing Western Digital Corporation
- 3. 3 Forward Looking Statements These presentation materials may contain forward-looking statements within the meaning of the federal securities laws, including statements concerning: our future results; our market positioning; expectations regarding our transformation and growth opportunities; our financial and business models, strategies and execution; integration activities and achievement of synergy goals; the demand for digital storage and market trends; our product portfolio, product development efforts and customer acceptance, introduction of new products, and expansion into new data storage markets; and data growth and its drivers. These forward-looking statements are based on Western Digital Corporation's current expectations. Risks and uncertainties may cause actual results to differ materially from those currently expected. These potential risks and uncertainties include, among others: § volatility in global economic conditions; § business conditions and growth in the storage ecosystem; § impact of competitive products and pricing; § market acceptance and cost of commodity materials and specialized product components; § actions by competitors; § unexpected advances in competing technologies; § our development and introduction of products based on new technologies and expansion into new data storage markets; § risks associated with acquisitions, mergers and joint ventures; § difficulties or delays in manufacturing; and § other factors listed in our periodic SEC filings and on this website in Risk Factors. In addition, these presentation materials include references to non-GAAP financial measures. Reconciliations of the differences between the historical non-GAAP measures we provide in these presentation materials to the comparable historical GAAP financial measures are included in the appendix to the applicable presentation materials. We have not reconciled our non-GAAP financial measures related to future results to the most directly comparable GAAP measures because material items that impact these measures are out of our control and/or cannot be reasonably predicted. Accordingly, a reconciliation of the non-GAAP financial measures related to future results to the corresponding GAAP measures is not available without unreasonable effort.
- 4. 4 Agenda • Market Forces • 2D NAND and Its Limitations • Western Digital Delivery of 3D NAND • Call to Action—Speak with our Experts
- 6. Source: IDC Digital Universe Study, sponsored by EMC, December 2014 Zettabytes of data in 2020 or Gigabytes of Data ©2017 Western Digital Corporation or its affiliates. All rights reserved. 6
- 7. 7 The Rapid Rate of Data Generation Private Public 4x increase in generated data 20 billion IoT devices by 20201 5 TB / day 1 PB / day 40 TB / day275 GB / day 6 TB / day 1 Exabyte / day 1 IoT Units Installed Base Sources: Global Cloud Index: Forecast and Methodology 2015-2020, Cisco, 2016; Visual Networking Index: Forecast and Methodology, 2015–2020, Cisco, 2015; Internet of Things Units Installed Base 2015-2020, Gartner, 2015; Self-driving Cars Report, DataFloq, 2016
- 8. 8 Data Center Growth Expected to Increase 5x by 2020 Stored data 382EB 1.8ZB 5x 20202015 Growth in data center storage installed capacity5x Source: Global Cloud Index: Forecast and Methodology 2015-2020, Cisco, http://www.cisco.com/c/dam/en/us/solutions/collateral/service- provider/global-cloud-index-gci/white-paper-c11-738085.pdf
- 9. 9 2D NAND
- 10. 10 2D NAND AND ITS LIMITATIONS NAND DIE SIZE IS A PROXY FOR THE COST OF SSD PRODUCTS Magnified 15nm lithography • 2D NAND is the basis of all the SSD products deployed the last few years • SSD Capacities: 200GB - 4TB • Shrinking NAND die size, i.e., moving from 43nm to 32nm, 19nm to 15nm, enabled SSD capacity growth • As cells gets closer, i.e., 15nm, the “Proximity Effect” kicks in; no longer able to shrink NAND die sizes • Initially, 2D NAND SSD products stored 1 bit per cell, aka “Single-Level Cell” (SLC) flash, then: • Multi-Level Cell (MLC) – 2 bits per cell – doubles density capacity • Triple-Level Cell (TLC) – 3 bits per cell – additional 32% • Quad-Level Cell (QLC) – 4 bits per cell – 25% more • TRADEOFF: More bits per cell for larger capacity points, but at the expense of endurance, i.e., DWPD (Drive Writes Per Day)
- 11. 11 43nm 35nm 24nm 19nm BiCS2 Counts -0.05 0 0.05 0.1 0.15 0.2 0.25 No Moore’s Law for 2D NAND We don’t have enough electrons Threshold Voltage (DeltaVt) As cells get closer, proximity effect worsens Lithography Process Complexity 43nm 35nm 19nm 15nm Immersion Double Pattern Inversion Quad Pattern LOWER is better Source: WDC estimate, University of Texas: https://willson.cm.utexas.edu/Research/Sub_Files/Immersion/index.php
- 12. 12 COST 2001 2003 2005 2007 2009 2011 2013 2015 2017 2019 1Gb X2-160nm 128Gb X3 19nm 128Gb X3 1Ynm 128Gb X3 1Znm 2Gb X2-130nm 4Gb X2-90nm 8Gb X2-70nm 16Gb X3-56nm 32Gb X3-43nm 64Gb X3 24nm 64Gb X3-32nm In NAND We Trust! OVER Cumulative cost reduction over 20 years* Note: Images not to scale *Based on historical SanDisk NAND pricing 1992* BICS2 256Gb X3 48 layer BICS3 256Gb X3 64-layer ©2017 Western Digital Corporation or its affiliates. All rights reserved. Confidential.
- 13. 13 3D NAND
- 14. 14©2017 Western Digital Corporation or its affiliates. All rights reserved. Confidential. SG SG Control Gate Si Substrate Source: WDC Internal NAND Strings Go Vertical
- 15. 15©2017 Western Digital Corporation or its affiliates. All rights reserved. Confidential. SG SG Control Gate Poly-Si Body Gate Charge Trap Layer Source: WDC Internal NAND Strings Go Vertical
- 16. 16©2017 Western Digital Corporation or its affiliates. All rights reserved. Confidential. From the Suburbs to Downtown 2D NAND Architecture 3D NAND Architecture
- 17. 17©2017 Western Digital Corporation or its affiliates. All rights reserved. Confidential. 64 Layer BiCS3: First Commercially Viable 3D NAND Technology Predictable scaling path: x, y, z and logical scaling Source: WDC Internal
- 18. 18
- 19. 19 Market Segmentation MARKET SUMMARY Data Center/Cloud Enterprise On-Premise Client Compute Desktops Notebooks Embedded Emerging Markets Smart Phones & Tablets 3/14/17©2016 Western Digital Corporation or affiliates. All rights reserved. Confidential. 19Source: WDC Mobility Automotive Industrial Connected Home/Gaming Surveillance
- 20. 20 Call to Action for Service Providers Visit HGST Booth, Speak With Our Experts Software Developers Software Architects DevOps Data Center Architects § Enable new classes of applications § Higher concurrent IOPS at lower latency § Accelerate migration to cloud-native applications § Greater compute & storage densities § Reduced heat, power & cooling § ARM ® Processors and GPU-Intensive deployments § SSDs are a key enabling technology § Purpose-built appliances § Containerized delivery Stakeholders: IoT, Analytics, Open Source, Commerce, AR/VR, Cognitive/AI, etc.
- 22. 22 (c) 2017 Western Digital Corporation or its affiliates. All rights reserved. Western Digital and the Western Digital logo are registered trademarks or trademarks of Western Digital Corporation or its affiliates in the US and/or other countries. ARM is a registered trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All other marks are the property of their respective owners."